The XC2S200-6FGG850C represents a flagship member of the Spartan-II FPGA family, delivering exceptional programmable logic capabilities in an 850-ball fine-pitch BGA package. This advanced field-programmable gate array combines 200,000 system gates with 5,292 logic cells, making it an ideal solution for complex digital designs requiring high density and reliable performance.

Manufactured using advanced 0.18-micron CMOS technology, the XC2S200-6FGG850C operates at 2.5V and achieves maximum clock frequencies of 263 MHz. The device’s -6 speed grade ensures superior timing performance for time-critical applications, while the commercial temperature range (0°C to 85°C) makes it suitable for a wide variety of industrial and commercial implementations.

Key Technical Specifications

Core Performance Parameters

Memory Configuration

Input/Output Capabilities

XC2S200-6FGG850C Architecture and Features

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG850C features a robust CLB architecture optimized for versatile digital design. Each CLB contains four logic cells arranged in two slices, providing maximum flexibility for implementing complex logic functions. The 28 x 42 CLB array delivers 1,176 configurable logic blocks, enabling designers to implement sophisticated algorithms and control systems.

The device’s look-up table (LUT) architecture supports 4-input function generation, with additional logic to combine functions for 5 or 6 input operations. This hierarchical approach maximizes logic density while maintaining predictable timing characteristics essential for meeting design constraints.

Advanced Memory Options

Dual-column block RAM implementation provides 56 Kbits of dedicated synchronous memory, perfect for buffering, FIFO implementations, and data storage. The distributed RAM capability leverages LUT resources to create shallow memory structures totaling 75,264 bits, offering designers flexible memory allocation options.

High-Speed I/O Architecture

With 284 maximum user I/O pins, the XC2S200-6FGG850C supports extensive connectivity requirements. The device implements 16 selectable I/O standards, ensuring compatibility with various interface protocols including LVTTL, LVCMOS, PCI, and differential signaling standards.

Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide advanced clock management capabilities, including clock multiplication, division, phase shifting, and board-level clock deskewing for multi-FPGA systems.

Application Areas for XC2S200-6FGG850C

Industrial Control Systems

The XC2S200-6FGG850C excels in industrial automation applications requiring high logic density and robust I/O capabilities. Its 200,000 system gates support complex control algorithms, while the 263 MHz clock frequency ensures real-time response in time-critical operations.

Communications Infrastructure

Network switching equipment, protocol converters, and telecommunications interfaces benefit from the device’s abundant I/O resources and high-speed performance. The 850-ball package provides maximum pin density for multi-channel applications.

Digital Signal Processing

With dedicated block RAM and distributed memory resources, the XC2S200-6FGG850C handles data-intensive DSP applications efficiently. The carry chain logic optimizes arithmetic operations essential for filtering, transforms, and signal conditioning.

Embedded System Development

The device serves as an excellent co-processor or system controller in embedded applications, offering hardware acceleration for computationally intensive tasks while maintaining flexibility through FPGA reprogrammability.

XC2S200-6FGG850C Package Details

FGG850 Fine-Pitch BGA Specifications

The FGG850 package provides superior electrical performance through reduced lead inductance and improved signal integrity. The fine-pitch design maximizes I/O density while maintaining manufacturability for high-volume production.

Lead-Free (RoHS) Compliance

The “G” designation in FGG850 indicates lead-free packaging compliance with RoHS environmental standards, making the XC2S200-6FGG850C suitable for modern electronics manufacturing requirements.

Design Tools and Development Support

Compatible Design Software

The XC2S200-6FGG850C integrates seamlessly with Xilinx ISE Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification. Designers can leverage VHDL, Verilog, or schematic entry methods to implement their applications.

Configuration Options

Multiple configuration modes support diverse system architectures:

• Master Serial Mode: FPGA controls configuration from serial PROM
• Slave Serial Mode: External controller provides bitstream
• Slave Parallel Mode: High-speed 8-bit configuration interface
• JTAG Boundary Scan: In-system programming and debugging

Simulation and Verification

Complete timing models and simulation libraries ensure accurate pre-implementation verification, reducing development cycles and time-to-market.

Advantages Over ASIC Solutions

Cost-Effective Development

The XC2S200-6FGG850C eliminates the substantial NRE costs associated with ASIC development. Design iterations require only software changes rather than expensive mask revisions, dramatically reducing development expenses.

Rapid Prototyping and Deployment

FPGA programmability enables same-day design iteration and testing. Engineering changes that might require months with ASIC fabrication complete in hours with the XC2S200-6FGG850C.

Field Upgradability

Unlike ASICs, the XC2S200-6FGG850C supports in-system programming, allowing feature enhancements and bug fixes through firmware updates without hardware replacement.

Risk Mitigation

FPGA flexibility eliminates the risk of committing to a fixed silicon implementation before complete system validation. Design modifications accommodate changing requirements throughout the product lifecycle.

Performance Optimization Techniques

Maximizing Clock Frequency

The -6 speed grade provides the fastest timing performance in the Spartan-II family. Designers can achieve the 263 MHz maximum by optimizing register placement, minimizing logic depth between registers, and utilizing dedicated routing resources.

Efficient Resource Utilization

Strategic partitioning between distributed RAM and block RAM optimizes overall design density. Shallow, distributed memories use LUT resources while deeper structures leverage dedicated block RAM for maximum efficiency.

Power Management Strategies

The 2.5V core voltage combined with selective clock gating minimizes power consumption. DLL features enable dynamic clock management, reducing power in less critical operational modes.

Quality and Reliability Standards

Manufacturing Excellence

Xilinx (now AMD) manufacturing processes ensure consistent device quality with rigorous testing at every production stage. The XC2S200-6FGG850C undergoes comprehensive functional, parametric, and reliability testing before shipment.

Extended Temperature Performance

The commercial temperature range (0°C to 85°C) accommodates typical industrial environments. For extreme conditions, industrial-grade variants provide -40°C to 100°C operation.

Long-Term Availability

As part of the established Spartan-II family, the XC2S200-6FGG850C benefits from proven silicon and mature supply chains, ensuring component availability for production requirements.

Comparison: XC2S200 Package Options

The FGG850 package maximizes available I/O resources, making it the premier choice for applications requiring extensive connectivity and superior electrical performance.

Getting Started with XC2S200-6FGG850C

Development Resources

Engineers beginning XC2S200-6FGG850C development should access comprehensive datasheets, application notes, and reference designs available through official channels. Complete documentation covers pinout information, timing specifications, and design guidelines.

Evaluation Platforms

Development boards featuring Spartan-II FPGAs provide hands-on experience with the architecture, enabling rapid prototyping before committing to custom PCB designs.

Technical Support Community

Active FPGA design communities and manufacturer support resources provide assistance with implementation challenges, optimization techniques, and best practices for Xilinx FPGA development.

Procurement and Availability

Authorized Distribution Channels

The XC2S200-6FGG850C is available through authorized electronic component distributors worldwide. Engineers should verify authenticity and quality by sourcing from established distributors with documented quality management systems.

Lead Time Considerations

Standard lead times vary based on market conditions and order quantities. For production planning, designers should consult with distributors regarding current stock levels and delivery schedules.

Quality Assurance

Reputable suppliers provide complete traceability with manufacturer lot codes, date codes, and compliance documentation ensuring genuine Xilinx components meeting published specifications.

Conclusion: Why Choose XC2S200-6FGG850C

The XC2S200-6FGG850C delivers an exceptional combination of logic density, I/O capability, and performance in a high-pin-count package. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins, this FPGA handles complex applications requiring extensive connectivity and computational resources.

The -6 speed grade ensures industry-leading performance at 263 MHz, while 0.18µm technology provides excellent power efficiency. Whether developing industrial control systems, communications infrastructure, or embedded applications, the XC2S200-6FGG850C offers the flexibility, performance, and reliability required for successful implementation.

For engineers seeking a proven, cost-effective alternative to ASIC development with the advantages of reprogrammability and rapid time-to-market, the XC2S200-6FGG850C represents an outstanding choice in the Spartan-II FPGA family.