The XC2S200-6FGG847C represents a powerful field-programmable gate array solution from Xilinx’s proven Spartan-II family. This FPGA combines 200,000 system gates with an advanced 847-ball fine-pitch BGA package, delivering exceptional performance for industrial and commercial applications requiring high I/O density and reliable operation.
Overview of XC2S200-6FGG847C FPGA Technology
The XC2S200-6FGG847C is engineered with cutting-edge 0.18-micron process technology, offering designers a cost-effective alternative to mask-programmed ASICs. This programmable logic device eliminates the initial costs and lengthy development cycles associated with traditional ASIC implementations while providing the flexibility to upgrade designs in the field without hardware replacement.
Key Features and Specifications
| Feature |
Specification |
| Device Family |
Spartan-II FPGA |
| Logic Cells |
5,292 |
| System Gates |
200,000 (Logic and RAM) |
| CLB Array Configuration |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Speed Grade |
-6 (High Performance) |
| Package Type |
FGG847 (847-Ball Fine Pitch BGA) |
| Operating Voltage |
2.5V |
| Process Technology |
0.18µm |
Understanding the FGG847 Package Configuration
The FGG847 designation indicates an 847-ball fine-pitch ball grid array package, representing one of the higher pin-count options in the Spartan-II family. This advanced packaging technology provides several advantages for complex digital designs.
FGG847 Package Advantages
- High I/O Density: 847 solder balls arranged in precise grid formation
- Superior Thermal Performance: Enhanced heat dissipation capabilities
- Reduced Package Footprint: Compact form factor for space-constrained applications
- Improved Signal Integrity: Shorter electrical paths minimize signal degradation
- Lead-Free (RoHS Compliant): The “G” designation indicates Pb-free packaging
Performance Characteristics of XC2S200-6FGG847C
Speed Grade -6 Performance Specifications
The -6 speed grade represents the highest performance tier available for commercial temperature range Spartan-II devices, offering:
| Performance Metric |
Value |
| Maximum System Performance |
Up to 200 MHz |
| Operating Temperature Range |
Commercial (0°C to +85°C) |
| Configuration Time |
Fast startup capability |
| Power Supply Voltage |
2.5V ±5% |
Architectural Features
Configurable Logic Blocks (CLBs)
- 1,176 CLBs arranged in optimized 28×42 array
- Each CLB contains two slices with flexible logic functions
- Four-input look-up tables (LUTs) for complex Boolean functions
- Dedicated carry logic for arithmetic operations
Memory Resources
- 75,264 bits of distributed RAM for flexible memory implementation
- 56K bits of dual-port block RAM
- Synchronous read/write operations
- Configurable as various RAM depths and widths
Input/Output Architecture
- 284 maximum user I/O pins (excluding global clock inputs)
- Support for multiple I/O standards
- Programmable drive strength and slew rate control
- Input delay compensation using Delay-Locked Loops (DLLs)
Applications and Use Cases
Industrial Control Systems
The XC2S200-6FGG847C excels in industrial automation applications requiring:
- Real-time processing capabilities
- Multiple communication protocol support
- Robust environmental performance
- Field-upgradeable firmware
Communications Infrastructure
Ideal for telecommunications equipment including:
- Protocol conversion and bridging
- Digital signal processing implementations
- High-speed serial data management
- Network interface controllers
Medical Electronics
Suitable for medical device applications demanding:
- Reliable signal processing
- Precise timing control
- Regulatory compliance capabilities
- Long-term availability
Automotive Systems
Deployed in automotive electronics for:
- Advanced driver assistance systems (ADAS)
- Infotainment processing
- Sensor fusion applications
- Engine control systems
Technical Specifications Deep Dive
Configuration Options
| Configuration Mode |
Clock Direction |
Data Width |
Serial DOUT |
Application |
| Master Serial |
Output |
1-bit |
Yes |
Autonomous boot from PROM |
| Slave Serial |
Input |
1-bit |
Yes |
Host processor configuration |
| Slave Parallel |
Input |
8-bit |
No |
Fast configuration requirement |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
No |
Debug and programming |
Power Consumption Profile
The XC2S200-6FGG847C demonstrates efficient power characteristics:
- Core Voltage: 2.5V internal logic supply
- I/O Voltage: Configurable based on interface standards
- Static Power: Low quiescent current
- Dynamic Power: Proportional to switching activity
Design Resources and Development Support
Compatible Development Tools
Working with the XC2S200-6FGG847C requires appropriate design software:
- Xilinx ISE Design Suite
- FPGA Editor for detailed placement
- ChipScope Pro for in-system debugging
- iMPACT for device programming
Reference Designs and IP Cores
Xilinx provides extensive intellectual property libraries including:
- Communication protocol controllers
- Digital signal processing functions
- Memory interface controllers
- Arithmetic operators and functions
Comparing Package Options for XC2S200 Family
| Package Type |
Pin Count |
Typical Applications |
Form Factor |
| PQ208 |
208 |
Low-density designs |
Quad Flat Pack |
| FG256 |
256 |
Medium I/O requirements |
Fine-pitch BGA |
| FGG847 |
847 |
Maximum I/O density |
Fine-pitch BGA |
The FGG847 package offers the maximum number of available user I/O pins, making it the optimal choice for applications requiring extensive external connectivity.
Reliability and Quality Standards
Manufacturing Quality
Xilinx Spartan-II devices undergo rigorous quality assurance:
- Comprehensive electrical testing at multiple temperatures
- Burn-in testing for enhanced reliability
- ESD protection exceeding 2000V HBM
- Latch-up immunity per JEDEC standards
Long-Term Availability
The Spartan-II family benefits from:
- Extended product lifecycle support
- Availability of automotive-grade variants
- Comprehensive obsolescence management
- Second-source manufacturing options
Migration and Scalability Options
Family Migration Paths
Designers can scale their implementations across the Spartan-II family:
| Device |
Logic Cells |
System Gates |
CLBs |
User I/O |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
Forward Migration Opportunities
When additional resources become necessary, consider upgrading to:
- Spartan-3 family for increased logic density
- Spartan-6 series for advanced DSP capabilities
- Modern Xilinx FPGA families for cutting-edge performance
Procurement and Ordering Information
Part Number Breakdown
Understanding the XC2S200-6FGG847C designation:
- XC2S200: Device family and gate count
- -6: Speed grade (highest performance)
- FGG847: Package type (847-ball fine-pitch BGA with Pb-free)
- C: Commercial temperature range
Package Marking
Device packages include laser marking with:
- Full part number identification
- Manufacturing lot code
- Date code for traceability
- Xilinx logo and branding
Design Considerations and Best Practices
PCB Layout Guidelines
When designing with the FGG847 package:
Power Distribution
- Implement proper power plane design
- Decoupling capacitors near each power pin
- Multiple ground connections for stability
- Adequate thermal vias for heat dissipation
Signal Routing
- Controlled impedance for high-speed signals
- Length matching for synchronous interfaces
- Proper termination strategies
- EMI considerations for signal integrity
Thermal Management
The 847-ball BGA package requires appropriate thermal solutions:
- Adequate air circulation around the device
- Heat sink attachment when necessary
- Thermal interface material selection
- Operating temperature monitoring
Configuration and Programming
Bitstream Generation
The XC2S200-6FGG847C configuration process involves:
- Design synthesis and implementation
- Bitstream file generation
- Configuration memory programming
- Device verification and testing
Configuration Memory Size
- Total configuration bits: 1,335,840
- Typical PROM requirements: 2Mbit or larger
- Compressed bitstream support: Available for faster configuration
Environmental and Regulatory Compliance
Standards Conformance
The XC2S200-6FGG847C meets international standards:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- MSL (Moisture Sensitivity Level) rated
- Conflict minerals reporting available
Why Choose XC2S200-6FGG847C for Your Design
Superior Cost-Performance Ratio
The XC2S200-6FGG847C delivers exceptional value through:
- No NRE costs compared to ASIC development
- Reduced time-to-market for product launches
- Field upgrade capability extending product life
- Volume pricing advantages for production
Proven Technology Platform
Benefits of the mature Spartan-II architecture:
- Extensive design examples and reference materials
- Large community of experienced developers
- Comprehensive third-party IP availability
- Proven reliability in deployed systems
Comprehensive Ecosystem Support
Access to complete development infrastructure:
- Free synthesis tools for entry-level designs
- Professional development suite availability
- Technical documentation and application notes
- Responsive technical support channels
Getting Started with XC2S200-6FGG847C Development
Initial Design Steps
- Requirements Analysis: Define system specifications and constraints
- Architecture Planning: Partition functionality across FPGA resources
- IP Selection: Choose appropriate cores and interfaces
- Implementation: Design entry using HDL or schematic
- Verification: Simulate and validate functionality
- Synthesis: Generate gate-level netlist
- Place and Route: Physical implementation within FPGA
- Timing Analysis: Verify speed grade requirements
- Programming: Load configuration into device
- Testing: System-level validation and debugging
Learning Resources
Expanding your XC2S200-6FGG847C expertise:
- Xilinx online documentation library
- Community forums and discussion groups
- University program materials
- Third-party training courses
- Application notes and white papers
Conclusion: XC2S200-6FGG847C as Your FPGA Solution
The XC2S200-6FGG847C stands as a robust, feature-rich FPGA solution for applications demanding 200,000 system gates and maximum I/O connectivity. Its combination of 5,292 logic cells, 284 user I/O pins, and high-performance -6 speed grade makes it an excellent choice for industrial control, communications, medical, and automotive applications.
The 847-ball fine-pitch BGA package provides the physical interface necessary for complex, I/O-intensive designs while maintaining a reasonable footprint. Combined with Xilinx’s proven Spartan-II architecture, mature development tools, and extensive support resources, the XC2S200-6FGG847C offers designers a reliable path from concept to production.
Whether you’re upgrading an existing design, developing a new product, or seeking an ASIC alternative, the XC2S200-6FGG847C delivers the programmable logic performance and flexibility required for successful implementation. Its balance of resources, speed, I/O capacity, and cost-effectiveness makes it a compelling choice for demanding digital design applications.
