The XC2S200-6FGG846C is a powerful Field-Programmable Gate Array (FPGA) from AMD Xilinx’s proven Spartan-II family, engineered to deliver exceptional programmable logic capabilities for demanding embedded system applications. This advanced FPGA solution features 200,000 system gates and 5,292 logic cells, making it an ideal choice for complex digital designs requiring high-performance processing and flexible configuration options.
Manufactured using cost-effective 0.18-micron CMOS technology, the XC2S200-6FGG846C combines superior performance with energy efficiency, offering designers a reliable platform for industrial automation, telecommunications equipment, data acquisition systems, and digital signal processing applications.
Key Technical Specifications of XC2S200-6FGG846C
Core Performance Parameters
| Specification |
Value |
Description |
| System Gates |
200,000 |
Total logic capacity for complex designs |
| Logic Cells |
5,292 |
Programmable logic elements |
| CLB Array |
28 x 42 (1,176 total) |
Configurable Logic Blocks arrangement |
| Maximum User I/O |
284 pins |
Available input/output connections |
| Speed Grade |
-6 |
Optimized for high-performance operations |
| Operating Voltage |
2.5V |
Core logic supply voltage |
| Package Type |
FGG846 |
846-pin Fine-pitch Ball Grid Array |
| Temperature Range |
Commercial (0°C to +85°C) |
Standard operating conditions |
Memory Architecture Features
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Fast local storage within CLBs |
| Block RAM |
56 Kbits (7 KB) |
Dedicated memory blocks for data buffering |
| Total RAM Bits |
131,328 bits |
Combined memory resources |
Advanced Features of XC2S200-6FGG846C FPGA
Programmable Logic Capabilities
The XC2S200-6FGG846C incorporates advanced architectural features derived from the industry-leading Virtex FPGA family, delivering:
- Unlimited Reprogrammability: Configure and reconfigure your designs in-system without hardware modifications
- SelectRAM Hierarchical Memory: Flexible memory options with 16 bits per lookup table (LUT) distributed RAM
- Delay-Locked Loops (DLLs): Four integrated DLLs positioned at die corners for precise clock management and skew reduction
- Enhanced I/O Architecture: Support for multiple voltage standards and high-speed interface protocols
- Configurable Block RAM: Organized in dual columns for optimized memory bandwidth
Package Configuration Details
The FGG846 package offers exceptional I/O density and thermal performance characteristics:
| Package Feature |
Specification |
| Total Pins |
846 |
| Package Format |
Fine-pitch Ball Grid Array (FBGA) |
| Lead-Free Option |
Yes (indicated by ‘G’ in part number) |
| Maximum I/O Pins |
284 user-configurable |
| Global Clock Pins |
4 dedicated (can be used as user I/O) |
Applications for XC2S200-6FGG846C FPGA Development
Industrial and Embedded Systems
The XC2S200-6FGG846C excels in industrial environments requiring reliable, reconfigurable logic solutions:
- Industrial Automation Control: Motor control systems, PLC implementations, and process automation
- Data Acquisition Systems: High-speed sensor interfaces and real-time data processing
- Machine Vision Applications: Image processing pipelines and pattern recognition systems
- Robotics Control Systems: Precision motion control and sensor fusion applications
Communication and Networking Infrastructure
Leverage the XC2S200-6FGG846C for demanding communication applications:
- Protocol Converters: Implementing custom communication protocols and standards
- Network Interface Controllers: Ethernet, serial, and parallel communication systems
- Digital Signal Processing: Filter implementation, modulation/demodulation functions
- Telecom Equipment: Base station controllers and switching infrastructure
Medical and Scientific Instrumentation
The reliability and precision of the XC2S200-6FGG846C make it suitable for:
- Medical Imaging Equipment: CT scanners, ultrasound machines, and diagnostic devices
- Laboratory Instrumentation: Analytical equipment and test measurement systems
- Patient Monitoring Devices: Real-time vital sign processing and display systems
- Research Equipment: Data collection and experimental control systems
Design Advantages: Why Choose XC2S200-6FGG846C
Cost-Effective ASIC Alternative
The XC2S200-6FGG846C provides significant advantages over traditional ASIC solutions:
- Zero Non-Recurring Engineering (NRE) Costs: Eliminate expensive mask sets and fabrication setup fees
- Rapid Development Cycles: Accelerate time-to-market with iterative design capabilities
- Field Upgradability: Update functionality post-deployment without hardware replacement
- Design Risk Mitigation: Test and validate designs before final implementation
Superior Flexibility and Performance
| Design Benefit |
Impact |
| In-System Programming |
Update designs remotely without board replacement |
| Multiple Configuration Modes |
JTAG, Slave Serial, Slave Parallel, and Master Serial options |
| Clock Management |
DLL-based clock distribution minimizes skew across large designs |
| I/O Standard Support |
Compatible with LVTTL, LVCMOS, SSTL, HSTL, and differential standards |
Technical Design Considerations
Power Supply Requirements
The XC2S200-6FGG846C requires carefully planned power distribution:
- VCCINT (Core Logic): 2.5V ± 5% for internal logic operation
- VCCO (I/O Banks): Configurable per bank (1.5V to 3.3V) based on I/O standards
- VCCAUX (Auxiliary): 2.5V for DLL and auxiliary circuits
- Decoupling Requirements: Multiple bypass capacitors near power pins for stable operation
Thermal Management
With 846 pins in a compact BGA footprint, proper thermal design ensures reliable operation:
- Thermal vias under package for heat dissipation
- Heat sink attachment options for high-performance applications
- Junction temperature monitoring for mission-critical systems
- Ambient temperature derating for extended reliability
Configuration and Programming Options
Multiple Configuration Modes
The XC2S200-6FGG846C supports flexible configuration methods:
| Configuration Mode |
Speed |
Best For |
| Master Serial |
Moderate |
Stand-alone applications with serial PROM |
| Slave Serial |
Moderate |
Microcontroller-controlled configuration |
| Slave Parallel |
Fast |
High-speed configuration from processor/CPLD |
| JTAG |
Slow |
Development, debugging, and boundary scan |
Development Tool Support
Design with industry-standard Xilinx ISE Design Suite or Vivado compatibility:
- Comprehensive synthesis and place-and-route tools
- Integrated simulation environment
- Timing analysis and constraint management
- IP core library access for rapid design integration
Xilinx FPGA Family Comparison
Spartan-II Series Position
| Device |
Logic Cells |
System Gates |
Block RAM |
Max I/O |
| XC2S50 |
1,728 |
50,000 |
32 Kbits |
176 |
| XC2S100 |
2,700 |
100,000 |
40 Kbits |
176 |
| XC2S150 |
3,888 |
150,000 |
48 Kbits |
260 |
| XC2S200 |
5,292 |
200,000 |
56 Kbits |
284 |
The XC2S200-6FGG846C represents the flagship device in the Spartan-II family, offering maximum logic density and I/O capability for the most demanding applications.
Ordering Information and Availability
Part Number Breakdown: XC2S200-6FGG846C
- XC2S200: Device family and logic density (200K gates)
- -6: Speed grade (commercial temperature, high performance)
- FG: Package type (Fine-pitch Ball Grid Array)
- G: Lead-free (Pb-free) package designation
- 846: Pin count (846-pin configuration)
- C: Commercial temperature range (0°C to +85°C)
Quality and Compliance
The XC2S200-6FGG846C meets stringent industry standards:
- RoHS compliant lead-free construction
- Manufactured in ISO-certified facilities
- Long-term availability support
- Comprehensive quality assurance testing
Design Resources and Support
Getting Started with XC2S200-6FGG846C
Engineers implementing the XC2S200-6FGG846C have access to extensive design resources:
- Detailed Datasheets: Complete electrical specifications and AC/DC characteristics
- Reference Designs: Proven implementations for common applications
- Application Notes: Best practices for power, thermal, and signal integrity
- Technical Support: Access to Xilinx/AMD engineering expertise
For comprehensive information on Xilinx FPGA products and design resources, visit specialized FPGA component distributors and technical portals.
Community and Technical Forums
Connect with thousands of FPGA developers worldwide through:
- Online design forums and discussion groups
- Technical webinars and training sessions
- University programs and educational resources
- Third-party IP core providers and design services
Comparison with Alternative FPGA Solutions
Migration and Upgrade Paths
| Upgrade Option |
Advantage |
Considerations |
| Spartan-3 Family |
Lower power, higher density |
Different architecture |
| Spartan-6 Family |
Enhanced DSP, higher speed |
Package differences |
| Artix-7 Family |
Advanced process node |
Significant cost increase |
Legacy Design Support
The XC2S200-6FGG846C maintains compatibility with established Spartan-II design flows, ensuring:
- Minimal migration effort from existing designs
- Proven reliability in deployed applications
- Extensive field history and documentation
- Cost-effective maintenance and support
Performance Optimization Tips
Maximizing XC2S200-6FGG846C Efficiency
Clock Domain Optimization:
- Utilize all four DLLs for multi-clock designs
- Minimize clock domain crossings
- Implement proper synchronization techniques
Memory Utilization:
- Balance distributed RAM and block RAM usage
- Optimize block RAM configurations for bandwidth
- Consider dual-port RAM for concurrent access
I/O Planning:
- Group related signals in same I/O banks
- Match I/O standards within banks
- Plan for signal integrity on high-speed interfaces
Reliability and Quality Assurance
Long-Term Operational Reliability
The XC2S200-6FGG846C undergoes rigorous qualification:
- Extended temperature cycling tests
- High-temperature operating life (HTOL) validation
- Electrostatic discharge (ESD) protection testing
- Latch-up immunity verification
Manufacturing Quality Control
AMD Xilinx maintains strict quality standards:
- 100% electrical testing of all devices
- Statistical process control monitoring
- Failure mode and effects analysis (FMEA)
- Continuous improvement programs
Environmental and Regulatory Compliance
The XC2S200-6FGG846C complies with global environmental standards:
- RoHS Directive: Lead-free construction (Pb-free)
- REACH Compliance: Restricted substance management
- Conflict Minerals: Responsible sourcing certification
- ISO Standards: Manufactured under ISO 9001 quality systems
Conclusion: XC2S200-6FGG846C FPGA Summary
The XC2S200-6FGG846C stands as a proven, reliable FPGA solution combining 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in a compact 846-pin BGA package. Its robust feature set, including dedicated block RAM, four DLLs, and unlimited reprogrammability, makes it an excellent choice for industrial, communication, and embedded system applications.
With cost-effective 0.18-micron technology, comprehensive development tool support, and AMD Xilinx’s industry-leading quality assurance, the XC2S200-6FGG846C delivers exceptional value for engineers seeking a balance of performance, flexibility, and reliability in their FPGA designs.
Whether you’re developing communication infrastructure, industrial control systems, medical instrumentation, or data acquisition platforms, the XC2S200-6FGG846C provides the programmable logic resources and I/O capability needed for successful product implementation.
