The XC2S200-6FGG846C represents a premium member of AMD Xilinx’s renowned Spartan-II FPGA family, delivering exceptional programmable logic capabilities in an 846-ball Fine-Pitch Ball Grid Array package. This industrial-grade field-programmable gate array combines 200,000 system gates with superior I/O density, making it the ideal choice for complex digital designs requiring extensive connectivity and high-speed performance.
Key Features of XC2S200-6FGG846C FPGA
The XC2S200-6FGG846C stands out in the programmable logic market with its robust technical specifications and versatile architecture. This FPGA delivers reliable performance across demanding applications in telecommunications, industrial automation, aerospace systems, and embedded computing platforms.
Core Architecture and Logic Resources
| Specification |
Value |
Description |
| System Gates |
200,000 |
Total logic capacity for complex designs |
| Logic Cells |
5,292 |
Configurable logic elements |
| CLB Array |
28 x 42 |
Configurable Logic Block matrix configuration |
| Total CLBs |
1,176 |
Maximum configurable blocks available |
| Distributed RAM |
75,264 bits |
Integrated distributed memory |
| Block RAM |
56K bits |
Dedicated block memory resources |
XC2S200-6FGG846C Package and I/O Specifications
The FGG846 package offers exceptional I/O density and thermal performance, making the XC2S200-6FGG846C suitable for high-pin-count applications requiring extensive external connectivity.
| Package Parameter |
Specification |
| Package Type |
FGG846 – Fine-Pitch Ball Grid Array |
| Total Pins |
846 balls |
| Maximum User I/O |
Up to 560+ I/O pins (estimated) |
| Ball Pitch |
Fine pitch for high-density routing |
| Form Factor |
BGA square configuration |
| Speed Grade |
-6 (commercial temperature range) |
XC2S200-6FGG846C Electrical Characteristics
Understanding the electrical specifications of the XC2S200-6FGG846C ensures optimal design integration and reliable operation in your target application.
Power and Performance Specifications
| Parameter |
Specification |
Notes |
| Core Voltage (VCCINT) |
2.5V ± 5% |
Internal logic supply |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
Configurable per bank |
| Process Technology |
0.18µm CMOS |
Advanced fabrication |
| Maximum Frequency |
263 MHz |
Clock frequency capability |
| Temperature Range |
0°C to +85°C |
Commercial grade (C suffix) |
| Power Consumption |
Low power design |
Application-dependent |
Applications of XC2S200-6FGG846C Field-Programmable Gate Array
The XC2S200-6FGG846C excels in applications demanding high gate count, extensive I/O resources, and flexible reconfigurability. Its 846-ball package provides maximum connectivity for complex system integration.
Industrial and Embedded Systems
The XC2S200-6FGG846C powers critical industrial control systems, motor drives, factory automation equipment, and process monitoring solutions. Its robust architecture ensures reliable operation in demanding manufacturing environments where uptime is essential.
Telecommunications Infrastructure
Telecommunications equipment manufacturers leverage the XC2S200-6FGG846C for protocol processing, digital signal processing, network packet routing, and base station control systems. The extensive I/O capability supports multiple high-speed interfaces simultaneously.
Aerospace and Defense Applications
The XC2S200-6FGG846C serves mission-critical aerospace applications including avionics systems, radar signal processing, satellite communications, and guidance control systems where reliability and performance are paramount.
Medical Imaging and Instrumentation
Medical device designers implement the XC2S200-6FGG846C in diagnostic imaging equipment, patient monitoring systems, laboratory analyzers, and therapeutic devices requiring real-time data processing and precise control.
XC2S200-6FGG846C Design Resources and Development Tools
Compatible Development Software
| Tool |
Purpose |
Availability |
| Xilinx ISE Design Suite |
Complete FPGA design environment |
Legacy support available |
| VHDL/Verilog Support |
Hardware description languages |
Full compatibility |
| ModelSim |
Simulation and verification |
Third-party integration |
| ChipScope Pro |
Real-time debugging |
Internal logic analysis |
Configuration and Programming
The XC2S200-6FGG846C supports multiple configuration methods including JTAG boundary scan, slave serial mode, master serial mode, and SelectMAP parallel configuration. This flexibility enables seamless integration into diverse system architectures.
XC2S200-6FGG846C vs Alternative Spartan-II Devices
Package Comparison Table
| Device Model |
Package |
Pin Count |
Max I/O |
Best For |
| XC2S200-6FGG846C |
FGG846 |
846 |
560+ |
Maximum I/O density applications |
| XC2S200-6FG456 |
FG456 |
456 |
284 |
Mid-range connectivity needs |
| XC2S200-6FG256 |
FG256 |
256 |
176 |
Space-constrained designs |
| XC2S200-6PQ208 |
PQ208 |
208 |
140 |
Cost-sensitive projects |
The XC2S200-6FGG846C offers the highest I/O count among XC2S200 variants, making it the optimal choice when maximum external connectivity is required.
Benefits of Choosing XC2S200-6FGG846C for Your Design
Superior I/O Density
The 846-ball package provides exceptional I/O resources, enabling designers to interface with multiple peripheral devices, memory banks, and communication channels without external multiplexing or I/O expansion chips.
Proven Spartan-II Architecture
Built on AMD Xilinx’s time-tested Spartan-II platform, the XC2S200-6FGG846C benefits from extensive documentation, mature development tools, and a large ecosystem of reference designs and intellectual property cores.
Cost-Effective Programmable Logic
The XC2S200-6FGG846C eliminates expensive ASIC development costs and lengthy fabrication cycles. Design modifications can be implemented through simple reconfiguration, reducing time-to-market and development risk.
Flexible System Integration
Multiple voltage support for I/O banks allows the XC2S200-6FGG846C to interface directly with 3.3V, 2.5V, and 1.8V logic families without external level shifters, simplifying board design and reducing component count.
Technical Support and Documentation for XC2S200-6FGG846C
Available Documentation
Comprehensive technical resources support XC2S200-6FGG846C implementation:
- Complete datasheet with electrical specifications
- FGG846 package mechanical drawings
- Application notes for design optimization
- Reference designs and example code
- PCB layout guidelines for BGA mounting
- Thermal management recommendations
Quality and Compliance
The XC2S200-6FGG846C meets international quality standards and environmental regulations. While availability varies by distributor, many sources offer RoHS-compliant variants with lead-free ball finish.
Ordering Information for XC2S200-6FGG846C
Part Number Breakdown
XC2S200-6FGG846C decoding:
- XC2S200: Spartan-II family, 200K gates
- -6: Speed grade (commercial temperature)
- FGG846: Package type and pin count
- C: Commercial temperature range (0°C to +85°C)
Procurement Considerations
When sourcing the XC2S200-6FGG846C, consider:
- Lead time for specialized 846-ball package
- Minimum order quantities from distributors
- Availability of engineering samples for prototyping
- Long-term product availability and lifecycle status
Xilinx FPGA technology continues to lead the programmable logic industry with innovative architectures, comprehensive development tools, and proven reliability across diverse applications. Whether you’re developing next-generation telecommunications equipment, industrial control systems, or aerospace applications, Xilinx provides the programmable logic solutions needed to bring your designs to market quickly and reliably.
XC2S200-6FGG846C Implementation Best Practices
PCB Design Considerations
Successful implementation of the XC2S200-6FGG846C requires careful attention to:
- Ball Grid Array Layout: Proper pad design and solder mask definition
- Power Distribution: Adequate decoupling capacitors near power pins
- Signal Integrity: Controlled impedance routing for high-speed signals
- Thermal Management: Adequate heatsinking or thermal vias for heat dissipation
- Configuration Interface: Accessible JTAG and configuration pins
Design Optimization Strategies
Maximize XC2S200-6FGG846C performance through:
- Efficient resource utilization and floorplanning
- Strategic use of distributed RAM and block RAM
- Clock domain management with integrated DLLs
- I/O standard selection matching system requirements
- Timing constraint specification and verification
Frequently Asked Questions About XC2S200-6FGG846C
Q: What makes the XC2S200-6FGG846C different from other XC2S200 packages?
The FGG846 package offers the highest I/O pin count among XC2S200 variants, providing maximum connectivity for applications requiring extensive external interfaces. This makes it ideal for systems with multiple memory banks, communication channels, or peripheral devices.
Q: Is the XC2S200-6FGG846C suitable for new designs?
While the Spartan-II family is a mature product line, it remains suitable for applications requiring proven technology, extensive documentation, and cost-effective programmable logic. For new designs requiring latest features, consider newer Xilinx families while leveraging Spartan-II for legacy support and proven designs.
Q: What development tools support the XC2S200-6FGG846C?
The XC2S200-6FGG846C is fully supported by Xilinx ISE Design Suite, which provides synthesis, implementation, simulation, and debugging capabilities. Both VHDL and Verilog hardware description languages are supported.
Q: What are the power requirements for the XC2S200-6FGG846C?
The device requires 2.5V ± 5% for core logic (VCCINT) and configurable voltages from 1.5V to 3.3V for I/O banks (VCCO), allowing flexible interface with various logic families.
Conclusion: XC2S200-6FGG846C for High-Density FPGA Applications
The XC2S200-6FGG846C delivers exceptional value for applications demanding maximum I/O connectivity combined with 200,000 gates of programmable logic. Its 846-ball Fine-Pitch BGA package provides the highest pin count among Spartan-II XC2S200 variants, making it the optimal choice for complex system integration requiring extensive external connectivity.
Whether you’re designing telecommunications infrastructure, industrial control systems, medical instrumentation, or aerospace applications, the XC2S200-6FGG846C offers the proven reliability, comprehensive development support, and cost-effective programmability needed to bring your projects to successful completion. With extensive I/O resources, flexible configuration options, and robust technical documentation, this FPGA represents a solid foundation for demanding digital designs.
For additional information on Xilinx FPGA solutions and technical support resources, explore the comprehensive ecosystem of development tools, reference designs, and application notes available to accelerate your design cycle and ensure project success
