The XC2S200-6FGG845C represents a premium solution within AMD Xilinx’s renowned Spartan-II FPGA family, delivering exceptional programmable logic capabilities for demanding digital applications. This advanced field programmable gate array combines 200,000 system gates with 5,292 logic cells in an 845-ball Fine-Pitch Ball Grid Array package, offering engineers a powerful platform for implementing complex digital designs with superior performance and reliability.

As a cost-effective alternative to traditional ASICs, the XC2S200-6FGG845C eliminates lengthy development cycles and high initial costs while providing unprecedented flexibility through field-upgradable programmability. This Spartan-II device stands out with its speed grade -6 designation, ensuring optimal performance across various operating conditions.

Key Technical Specifications

Core Performance Features

Package Specifications for FGG845

Advanced Architecture and Design Features

Configurable Logic Block Structure

The XC2S200-6FGG845C incorporates 1,176 Configurable Logic Blocks arranged in a 28×42 array, providing extensive logic resources for complex digital implementations. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that enable flexible circuit configurations for diverse applications.

Memory Architecture Advantages

This Spartan-II FPGA offers dual memory architecture with 75,264 bits of distributed RAM and 56K bits of block RAM. The distributed RAM integrates directly within CLBs for fast, small-scale memory requirements, while block RAM provides high-capacity storage for buffering and data processing operations.

Enhanced I/O Capabilities

With 284 maximum user I/O pins available in the FGG845 package, the XC2S200-6FGG845C supports extensive interface requirements. The I/O blocks surround the FPGA perimeter, enabling communication with external components through various signaling standards and voltage levels.

Clock Management with DLL Technology

Four Delay-Locked Loops (DLLs) positioned at die corners provide precise clock distribution and management. This architecture ensures minimal clock skew and enables high-performance synchronous designs operating at maximum frequencies.

Comprehensive Application Areas

Digital Signal Processing Systems

The XC2S200-6FGG845C excels in digital signal processing applications requiring real-time data manipulation. Engineers leverage its parallel processing capabilities for implementing filters, transforms, and signal conditioning algorithms in audio processing, image enhancement, and telecommunications equipment.

Industrial Automation and Control

Manufacturing facilities utilize this Spartan-II FPGA for motor control systems, process automation, and machine vision applications. The device’s reliability and reconfigurability make it ideal for adaptive control systems that require field updates without hardware replacement.

Communication Infrastructure

Network equipment manufacturers integrate the XC2S200-6FGG845C into routers, switches, and protocol converters. Its high-speed I/O capabilities and logic resources support complex communication protocols, packet processing, and data encryption functions.

Medical Device Development

Medical equipment developers deploy this FPGA in diagnostic instruments, patient monitoring systems, and imaging devices. The programmable architecture allows for regulatory compliance updates and feature enhancements throughout product lifecycles.

Aerospace and Defense Systems

The XC2S200-6FGG845C serves critical roles in radar processing, avionics systems, and secure communications. Its proven reliability and radiation-tolerant design options support demanding aerospace applications.

Performance Specifications and Speed Grade

Speed Grade -6 Performance Characteristics

The speed grade -6 designation indicates the highest performance tier within the Spartan-II product line, exclusively available in commercial temperature range devices. This grade ensures maximum operating frequencies and minimum propagation delays for time-critical applications.

Development and Programming Support

Design Tools and Software

The XC2S200-6FGG845C integrates seamlessly with Xilinx ISE Design Suite and Vivado Design Suite, providing comprehensive development environments. Engineers access powerful synthesis, implementation, and debugging tools for efficient FPGA development workflows.

Programming Options

Design Resources

Xilinx provides extensive documentation, reference designs, and application notes supporting the XC2S200-6FGG845C. Development boards and evaluation kits accelerate prototyping and proof-of-concept implementations.

Competitive Advantages Over ASIC Solutions

Cost-Effectiveness

The XC2S200-6FGG845C eliminates substantial Non-Recurring Engineering (NRE) costs associated with ASIC development. Organizations avoid mask costs, lengthy fabrication cycles, and minimum order quantities that characterize traditional ASIC manufacturing.

Time-to-Market Benefits

FPGA development cycles typically range from weeks to months, compared to year-long ASIC development timelines. This rapid development enables faster product launches and quicker response to market opportunities.

Design Flexibility and Upgrades

Unlike fixed-function ASICs, the XC2S200-6FGG845C supports field updates and feature enhancements throughout product lifecycles. Manufacturers can address bugs, add functionality, and adapt to changing requirements without hardware redesign.

Risk Mitigation

Programmable logic eliminates the risk of silicon errors that plague ASIC development. Engineers can verify and modify designs before final deployment, significantly reducing project risks and development costs.

Power Management Features

Power Consumption Characteristics

The Spartan-II architecture implements efficient power management through selective clock gating, unused logic power-down, and optimized I/O buffer designs. Power analysis tools help engineers optimize designs for specific power budgets.

Quality and Reliability Standards

Manufacturing Quality

AMD Xilinx manufactures the XC2S200-6FGG845C using proven 0.18μm CMOS technology in certified facilities meeting stringent quality standards. Comprehensive testing ensures each device meets published specifications across temperature ranges.

Reliability Metrics

Package Advantages of FGG845

Fine-Pitch BGA Benefits

The 845-ball Fine-Pitch Ball Grid Array package offers several advantages for modern PCB designs:

• High Density: Maximum I/O density in compact footprint
• Signal Integrity: Short interconnect paths minimize inductance
• Thermal Performance: Direct die attachment enhances heat dissipation
• Mechanical Reliability: Superior solder joint reliability compared to peripheral packages
• Routing Flexibility: Breakout routing on multiple PCB layers

PCB Design Considerations

Engineers designing boards for the XC2S200-6FGG845C should consider controlled impedance traces, proper power plane distribution, and adequate thermal management. Xilinx provides comprehensive PCB design guidelines and reference layouts supporting successful implementations.

Comparison with Alternative Solutions

XC2S200 Package Variants

The FGG845 package provides maximum I/O accessibility, making it optimal for applications requiring extensive external connectivity. This package variant supports all 284 available user I/O pins, eliminating I/O limitations in complex systems.

Design Best Practices and Implementation Guidelines

Timing Closure Strategies

Achieving timing closure with the XC2S200-6FGG845C requires strategic placement constraints, pipeline insertion, and clock domain management. The speed grade -6 performance enables designs operating at maximum system frequencies with proper design techniques.

Resource Utilization Optimization

Efficient designs balance CLB utilization, memory allocation, and I/O placement. Xilinx synthesis tools provide detailed utilization reports guiding optimization decisions for area, speed, and power tradeoffs.

Thermal Management Requirements

High-utilization designs in the FGG845 package require adequate cooling solutions. Thermal simulations and heat sink calculations ensure reliable operation across ambient temperature ranges. Consider forced air cooling or heat sinks for designs exceeding 50% device utilization.

Supply Chain and Ordering Information

Part Number Breakdown

XC2S200-6FGG845C

• XC2S200: Device family and gate count
• 6: Speed grade (fastest performance)
• FGG845: Package type and ball count
• C: Commercial temperature range (0°C to 85°C)

Availability and Sourcing

The XC2S200-6FGG845C remains available through authorized AMD Xilinx distributors and electronic component suppliers worldwide. Organizations requiring large quantities or specialized testing should consult distributors for custom ordering options.

For comprehensive solutions across the Xilinx FPGA product portfolio, engineers can access complete technical resources and procurement support for their programmable logic requirements.

Environmental Compliance and Standards

RoHS and Environmental Regulations

The FGG845 package features lead-free construction complying with RoHS (Restriction of Hazardous Substances) directives. The “G” designation in FGG indicates green (lead-free) packaging materials meeting European Union environmental standards.

Conflict Minerals Compliance

AMD Xilinx maintains strict policies regarding conflict minerals sourcing, ensuring responsible supply chain practices. The company publishes annual conflict minerals reports documenting due diligence efforts.

Technical Support and Documentation

Available Resources

AMD Xilinx provides comprehensive technical documentation supporting the XC2S200-6FGG845C:

• Detailed datasheets with electrical specifications
• User guides covering architecture and design methodology
• Application notes demonstrating implementation techniques
• Reference designs for common applications
• CAD libraries including symbols, footprints, and 3D models

Community and Forum Support

Active user communities provide peer support, design examples, and troubleshooting assistance. Xilinx forums connect engineers worldwide, facilitating knowledge sharing and problem-solving collaboration.

Conclusion: Why Choose XC2S200-6FGG845C

The XC2S200-6FGG845C Spartan-II FPGA delivers an optimal combination of performance, flexibility, and cost-effectiveness for modern digital design challenges. With 200,000 system gates, 284 user I/O pins, and speed grade -6 performance, this device supports applications ranging from industrial automation to medical devices and communication systems.

Organizations choosing the XC2S200-6FGG845C benefit from reduced development costs, accelerated time-to-market, and design flexibility unmatched by traditional ASIC solutions. The FGG845 package provides maximum I/O accessibility in a reliable, thermally efficient form factor suitable for demanding applications.

Whether developing next-generation medical instruments, industrial control systems, or communication infrastructure, the XC2S200-6FGG845C provides the programmable logic foundation for successful product implementations. Its proven reliability, comprehensive development tool support, and extensive documentation make it an ideal choice for engineering teams seeking high-performance FPGA solutions.