The XC2S200-6FGG842C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, designed and manufactured by Xilinx (now part of AMD). This high-density FPGA delivers exceptional performance with 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities in a robust 842-ball Fine-Pitch Ball Grid Array (FBGA) package. The device combines cost-effectiveness with professional-grade features, making it an ideal solution for telecommunications, industrial automation, medical equipment, and embedded system applications.

As a member of the Xilinx FPGA product line, the XC2S200-6FGG842C represents a mature, reliable platform for designers seeking a proven FPGA solution with excellent price-to-performance ratio.

Key Features and Technical Specifications

Core Architecture Specifications

Memory and I/O Resources

Advanced Features of XC2S200-6FGG842C FPGA

High-Speed Digital Processing Capabilities

The XC2S200-6FGG842C FPGA delivers outstanding performance with a maximum operating frequency of 200 MHz for system-level applications. The -6 speed grade designation indicates this device is optimized for high-speed operations, offering reduced propagation delays and faster clock-to-output times compared to standard speed grades.

Comprehensive Logic Resources

With 5,292 logic cells organized in a 28×42 configurable logic block (CLB) array, this FPGA provides substantial resources for implementing complex digital designs. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, enabling flexible implementation of combinational and sequential logic circuits.

Flexible Memory Architecture

The dual-memory architecture combines distributed RAM and block RAM for optimal performance:

• Distributed RAM: 75,264 bits integrated within CLBs for fast, localized data storage
• Block RAM: 56 Kbits of dedicated memory blocks for efficient data buffering and storage
• Dual-Port Capability: Block RAM supports simultaneous read/write operations

Rich I/O Capabilities

The 842-ball FBGA package provides extensive connectivity with up to 284 user I/O pins, supporting various interface standards including:

• LVTTL/LVCMOS voltage levels
• Differential signaling standards
• Multi-voltage I/O interface for compatibility with different logic families
• Individual I/O configuration for input, output, or bidirectional operation

Technical Advantages and Performance Benefits

Superior Alternative to ASICs

The XC2S200-6FGG842C offers significant advantages over application-specific integrated circuits (ASICs):

1. Eliminates NRE Costs: No mask charges or fabrication setup fees
2. Rapid Development: Immediate prototyping and testing capabilities
3. Field Upgradability: In-system reprogramming for updates and bug fixes
4. Reduced Time-to-Market: Weeks instead of months for design implementation
5. Lower Financial Risk: No minimum order quantities or long-term commitments

Design Flexibility and Reconfigurability

Unlike fixed-function logic devices, the XC2S200-6FGG842C can be:

• Reprogrammed unlimited times during development
• Updated in the field without hardware replacement
• Configured for different applications across product lifecycle
• Optimized through iterative design improvements

Power Efficiency and Thermal Management

Application Areas for XC2S200-6FGG842C

Telecommunications and Networking Equipment

The high-speed processing capabilities make the XC2S200-6FGG842C ideal for:

• Protocol converters and bridges
• Network packet processors
• Telecommunications switches
• Digital signal processing (DSP) applications
• Software-defined radio (SDR) implementations
• Base station controllers

Industrial Automation and Control Systems

Industrial applications benefit from the device’s reliability and performance:

• Programmable logic controllers (PLCs)
• Motor control and drive systems
• Process control automation
• Factory automation interfaces
• Robotics control systems
• Machine vision processing

Medical and Healthcare Devices

The FPGA’s precision and reconfigurability support medical applications:

• Medical imaging systems (ultrasound, X-ray processing)
• Patient monitoring equipment
• Diagnostic instrumentation
• Laboratory analysis equipment
• Portable medical devices
• Real-time signal processing for biomedical data

Consumer Electronics and Multimedia

Consumer product applications include:

• Video processing and format conversion
• Audio DSP and effects processing
• Display controllers and graphics engines
• Gaming and entertainment systems
• Set-top boxes and media players
• Camera and imaging equipment

Package Information: 842-Ball FBGA

Physical Package Specifications

PCB Design Considerations

The 842-ball FBGA package requires careful PCB layout considerations:

• Multi-layer PCB Required: Minimum 6-8 layers recommended
• Via-in-Pad Technology: May be necessary for dense routing
• Thermal Vias: Required for adequate heat dissipation
• Controlled Impedance: Critical for high-speed signals
• Power Plane Design: Dedicated planes for VCC and ground

Development Tools and Software Support

Design Entry and Simulation

The XC2S200-6FGG842C is supported by industry-standard FPGA development tools:

• Xilinx ISE Design Suite: Complete design environment
• Vivado Design Suite: Advanced synthesis and implementation (compatibility mode)
• Third-Party EDA Tools: Support for leading simulation platforms
• IP Core Libraries: Pre-verified intellectual property blocks
• Hardware Description Languages: VHDL, Verilog, SystemVerilog support

Programming and Configuration Options

Ordering Information and Part Number Breakdown

XC2S200-6FGG842C Part Number Decoding

XC2S200-6FGG842C breaks down as follows:

• XC: Xilinx Commercial FPGA
• 2S: Spartan-II family designation
• 200: 200,000 system gates
• -6: Speed grade (fastest commercial grade)
• FGG: Fine-pitch BGA, lead-free (RoHS compliant)
• 842: 842-ball package
• C: Commercial temperature range (0°C to +85°C)

Available Temperature Grades

Competitive Advantages and Market Position

Comparison with Alternative FPGAs

When to Choose XC2S200-6FGG842C

This FPGA is particularly well-suited for:

• Established Designs: Legacy system upgrades and maintenance
• Medium-Volume Production: 100 to 50,000 units annually
• Cost-Sensitive Applications: Budget-constrained projects
• Proven Technology Requirements: Risk-averse development
• Extensive I/O Requirements: Applications needing 200+ I/O pins

Quality and Reliability

Manufacturing Standards

The XC2S200-6FGG842C is manufactured to the highest quality standards:

• ISO 9001 Certified Facilities: Quality management systems
• Automotive-Grade Options: AEC-Q100 qualification available
• RoHS Compliance: Lead-free packaging (FGG designation)
• REACH Compliance: European chemical regulations
• Conflict-Free Sourcing: Responsible mineral procurement

Reliability Metrics

Getting Started with XC2S200-6FGG842C

Initial Design Steps

1. Requirements Analysis: Define system specifications and constraints
2. Architecture Planning: Create high-level block diagrams
3. HDL Coding: Write VHDL or Verilog design files
4. Simulation: Verify functional correctness
5. Synthesis: Convert HDL to gate-level netlist
6. Place and Route: Map design to physical FPGA resources
7. Timing Analysis: Verify performance requirements
8. Programming: Load configuration bitstream

Recommended Development Kits

While specific XC2S200-6FGG842C development boards may be limited due to the device’s mature status, general Spartan-II evaluation platforms and custom boards can be utilized for prototyping and development.

Frequently Asked Questions (FAQs)

Q: What is the maximum operating frequency of the XC2S200-6FGG842C?

The maximum system-level operating frequency is typically 200 MHz, though individual internal paths may operate faster. Actual achievable frequency depends on design complexity, routing congestion, and operating conditions.

Q: Can the XC2S200-6FGG842C be used in automotive applications?

While the commercial-grade C version operates from 0°C to 85°C, industrial-grade I versions are available that operate from -40°C to 100°C, which may be suitable for some automotive applications. For critical automotive systems, consult Xilinx for AEC-Q100 qualified variants.

Q: What is the difference between XC2S200-6FGG842C and other XC2S200 variants?

The primary differences are package type and pin count. The FGG842 package provides 842 balls with up to 284 user I/O pins, offering more connectivity than smaller packages like FG256 (256 balls, 176 I/O) or PQ208 (208 pins, 140 I/O).

Q: Is the XC2S200-6FGG842C still in production?

The Spartan-II family is a mature product line. While production status may vary, the device is typically available through distributors and authorized channels. For new designs requiring long-term availability, consult with Xilinx/AMD regarding product longevity and recommended alternatives.

Q: What development software is required?

Xilinx ISE Design Suite is the primary development environment for Spartan-II devices. The software includes synthesis, implementation, simulation, and programming tools. ISE Webpack (free version) supports the XC2S200 device family.

Q: How does power consumption compare to newer FPGA families?

As a 0.18μm process device, the XC2S200-6FGG842C has higher static power consumption than modern 28nm or 7nm FPGAs. However, for moderate-performance applications, total system power remains acceptable and is offset by lower device cost.

Q: Can I migrate designs from other FPGA families?

Design migration is possible but requires re-synthesis and re-implementation. Pin compatibility is unlikely between different families, requiring PCB redesign. HDL code is generally portable, though optimization and timing constraints need adjustment.

Conclusion: Why Choose XC2S200-6FGG842C

The XC2S200-6FGG842C represents a proven, reliable FPGA solution for applications requiring substantial logic resources, extensive I/O capabilities, and cost-effective implementation. With 200,000 system gates, 284 I/O pins, and robust 842-ball FBGA packaging, this device excels in telecommunications, industrial control, medical equipment, and embedded system applications.

Its advantages include elimination of ASIC development costs, rapid prototyping capabilities, field upgradability, and excellent long-term reliability. Backed by comprehensive development tools and decades of proven performance in deployed systems worldwide, the XC2S200-6FGG842C continues to serve as a solid choice for designers seeking a balance between performance, cost, and reliability.

For designers working with existing Spartan-II architectures or developing new applications where proven technology is paramount, the XC2S200-6FGG842C offers an excellent foundation for successful FPGA implementation.