The XC2S200-6FGG841C is a powerful field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance and versatility for complex digital designs. This advanced FPGA combines 200,000 system gates with 5,292 logic cells in a robust 841-ball fine-pitch ball grid array package, making it an ideal solution for engineers and developers seeking cost-effective programmable logic for demanding applications.
Overview of XC2S200-6FGG841C FPGA
The XC2S200-6FGG841C represents a superior alternative to traditional mask-programmed ASICs, offering the flexibility of field upgrades without hardware replacement. Built on advanced 0.18-micron technology and operating at 2.5V, this FPGA delivers high-speed performance up to 200 MHz while maintaining low power consumption. The -6 speed grade ensures optimal performance across commercial temperature ranges, making it suitable for a wide variety of industrial and commercial applications.
Key Advantages of Spartan-II Architecture
This Xilinx FPGA combines abundant logic resources with advanced features including delay-locked loops (DLLs), block RAM, and configurable logic blocks (CLBs). The architecture enables designers to implement complex digital circuits efficiently while maintaining flexibility for future modifications and upgrades.
Technical Specifications
Core Features and Performance
| Parameter |
Specification |
| Device Family |
Spartan-II |
| Part Number |
XC2S200-6FGG841C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 × 42 (1,176 total CLBs) |
| Maximum Frequency |
200 MHz |
| Speed Grade |
-6 (Commercial) |
| Process Technology |
0.18μm |
| Core Voltage |
2.5V |
Memory and I/O Capabilities
| Resource Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (57,344 bits) |
| Maximum User I/O |
284 pins |
| Package Type |
841-ball Fine-Pitch BGA (FGG841) |
| Temperature Range |
Commercial (0°C to +85°C) |
Package Specifications: FGG841
Physical Characteristics
The FGG841 package utilizes fine-pitch ball grid array technology, providing excellent thermal performance and signal integrity for high-speed digital designs. This package offers:
- 841 total balls for comprehensive connectivity
- Fine-pitch BGA construction for space-efficient PCB layouts
- Pb-free packaging option available (denoted by “G” in part number)
- Superior thermal management for reliable operation
- Enhanced signal integrity through optimized ball placement
Pin Distribution and Configuration
| Pin Category |
Count/Details |
| User I/O Pins |
Up to 284 maximum |
| Power Supply Pins (VCCINT) |
Multiple (core voltage) |
| I/O Supply Pins (VCCO) |
Multiple (per bank) |
| Auxiliary Supply (VCCAUX) |
Dedicated pins |
| Ground Pins (GND) |
Distributed throughout package |
| Configuration Pins |
CCLK, DONE, PROG, M0-M2 |
| JTAG Pins |
TDI, TDO, TMS, TCK |
Detailed Architecture and Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG841C features 1,176 CLBs arranged in a 28×42 array, providing extensive resources for implementing complex logic functions. Each CLB contains:
- Four logic cells (LCs) with look-up tables (LUTs)
- Fast carry logic for arithmetic operations
- Dedicated flip-flops for registered designs
- Direct feedthrough paths for optimized routing
Block RAM Architecture
| Memory Feature |
Specification |
| Total Block RAM |
56 Kbits (14 blocks × 4K bits) |
| Block Organization |
Dual-port synchronous RAM |
| Data Width Options |
1, 2, 4, 8, or 16 bits |
| Address Depth |
Configurable based on width |
| Access Time |
High-speed synchronous |
Input/Output Blocks (IOBs)
The FPGA provides 284 user I/O pins supporting multiple I/O standards:
- LVTTL and LVCMOS at various voltages
- PCI 33 MHz and 66 MHz compliant
- GTL, GTL+, HSTL, SSTL standards
- Programmable slew rate control
- Individual tri-state capability
- Input/output registers for timing optimization
Applications and Use Cases
Industrial Automation and Control
The XC2S200-6FGG841C excels in industrial environments for:
- Motor control systems with PWM generation
- Process control and monitoring
- Sensor data acquisition and processing
- Real-time control loop implementation
- Protocol conversion and bridge circuits
Communications and Networking
| Application |
Implementation Details |
| Protocol Processing |
Custom communication protocol engines |
| Data Routing |
Packet switching and routing logic |
| Signal Processing |
Digital filtering and modulation |
| Interface Bridging |
Multiple protocol conversion |
| Network Controllers |
Ethernet, CAN, serial interfaces |
Consumer Electronics
- Digital signal processing for audio/video
- Display controllers and graphics engines
- Interface management and control
- Smart device logic implementation
- Embedded system controllers
Medical and Scientific Equipment
The reliability and reconfigurability make this FPGA ideal for:
- Medical imaging systems
- Patient monitoring equipment
- Laboratory instrumentation
- Diagnostic device controllers
- Data acquisition systems
Design and Development
Software Tools and Support
| Tool/Resource |
Description |
| ISE Design Suite |
Legacy development environment for Spartan-II |
| Synthesis Tools |
XST (Xilinx Synthesis Technology) |
| Simulation |
ModelSim, ISim support |
| Programming |
iMPACT for device configuration |
| Constraints |
UCF (User Constraints File) format |
Configuration Options
The XC2S200-6FGG841C supports multiple configuration modes:
- Master Serial Mode – FPGA generates configuration clock
- Slave Serial Mode – External clock provided
- Master Parallel Mode – Fast parallel configuration
- Slave Parallel Mode – Microprocessor interface
- JTAG Mode – Boundary scan and programming
- SelectMAP Mode – High-speed parallel interface
Power Management and Specifications
Power Consumption Profile
| Power Parameter |
Typical Value |
Notes |
| Core Voltage (VCCINT) |
2.5V ± 5% |
Internal logic supply |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
Bank-dependent |
| Auxiliary Voltage (VCCAUX) |
2.5V or 3.3V |
DLL and configuration |
| Static Power |
Low |
Depends on configuration |
| Dynamic Power |
Variable |
Activity-dependent |
Thermal Characteristics
- Junction Temperature Range: 0°C to +85°C (Commercial grade)
- Thermal Resistance (θJA): Package and airflow dependent
- Power Dissipation: Design and utilization dependent
- Cooling Requirements: Natural or forced air convection
Performance Optimization
Timing and Speed Grade
The -6 speed grade represents the fastest commercial-grade option for the Spartan-II family, offering:
- Maximum system clock frequencies up to 200 MHz
- Optimized for high-performance applications
- Low propagation delays through logic
- Fast setup and clock-to-output times
- Enhanced routing resources for timing closure
Design Best Practices
| Optimization Area |
Recommendation |
| Clock Management |
Use DLLs for clock distribution and deskewing |
| Resource Utilization |
Balance CLB and Block RAM usage |
| I/O Planning |
Group related signals in same I/O banks |
| Timing Closure |
Apply proper constraints in UCF file |
| Power Optimization |
Gate unused clocks and logic |
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG841C is manufactured to the highest quality standards:
- ISO 9001 certified production facilities
- Comprehensive testing and screening
- RoHS compliant options available
- Extended temperature variants for industrial use
- Long-term availability and support
Reliability Metrics
| Reliability Parameter |
Specification |
| MTBF |
>1 million hours |
| Configuration Cycles |
Unlimited (SRAM-based) |
| Data Retention |
N/A (volatile configuration) |
| ESD Protection |
Per JEDEC standards |
| Latch-up Immunity |
JEDEC Class II |
Comparison with Alternative Solutions
Advantages Over ASICs
- Zero NRE costs – No mask or tooling expenses
- Rapid development – Prototype to production quickly
- Field upgradable – Update functionality post-deployment
- Lower risk – Test and verify before committing
- Shorter time-to-market – Immediate implementation
Benefits vs. Smaller FPGAs
| Feature |
XC2S200-6FGG841C Advantage |
| Logic Capacity |
200K gates for complex designs |
| I/O Count |
284 pins for extensive interfacing |
| Memory |
56K block RAM plus distributed RAM |
| Performance |
-6 speed grade for maximum frequency |
| Package Options |
841-ball BGA for dense routing |
Ordering and Availability
Part Number Breakdown
XC2S200-6FGG841C decodes as follows:
- XC2S200 – Device family and gate count
- -6 – Speed grade (fastest commercial)
- FGG841 – 841-ball fine-pitch BGA package
- C – Commercial temperature range (0°C to +85°C)
Packaging Options
| Package Code |
Description |
Ball Count |
| FGG841 |
Fine-pitch BGA (standard) |
841 |
| FGGG841 |
Fine-pitch BGA (Pb-free) |
841 |
Support and Resources
Documentation and Datasheets
Engineers working with the XC2S200-6FGG841C should reference:
- Spartan-II Family Data Sheet (DS001)
- Spartan-II Pinout and Packaging Guide
- ISE Design Suite documentation
- Application notes for specific implementations
- PCB design guidelines for FGG841 package
Technical Support
AMD Xilinx provides comprehensive support including:
- Online knowledge base and forums
- Application engineering assistance
- Design consulting services
- Training and education programs
- Reference designs and IP cores
Conclusion
The XC2S200-6FGG841C represents an excellent choice for engineers requiring a high-performance, cost-effective FPGA solution. With 200,000 system gates, 5,292 logic cells, and the robust 841-ball BGA package, this device offers the perfect balance of capability, performance, and reliability for demanding digital design applications.
Whether you’re developing industrial control systems, communications equipment, medical devices, or consumer electronics, the XC2S200-6FGG841C provides the resources and flexibility needed to bring innovative products to market quickly and efficiently. Its proven Spartan-II architecture, combined with extensive I/O capabilities and abundant memory resources, makes it an ideal platform for both prototyping and volume production.
For engineers seeking a reliable, high-performance FPGA with comprehensive development tool support and long-term availability, the XC2S200-6FGG841C delivers exceptional value and capability in a compact, space-efficient package.
