The XC2S200-6FGG837C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance and flexibility for complex digital logic implementations. This high-density FPGA features 200,000 system gates packaged in an 837-ball Fine-Pitch Ball Grid Array (FBGA), making it an ideal choice for engineers and designers seeking robust programmable logic solutions.
As a member of the Spartan-II series, the XC2S200-6FGG837C combines cost-effectiveness with powerful processing capabilities, offering a superior alternative to traditional mask-programmed ASICs. Whether you’re developing telecommunications equipment, industrial automation systems, or advanced digital signal processing applications, this Xilinx FPGA provides the performance and reliability your project demands.
Key Specifications and Technical Features
Core Performance Specifications
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG837C |
| Manufacturer |
AMD Xilinx |
| FPGA Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Speed Grade |
-6 (High Performance) |
| Package Type |
FGG837 (837-ball Fine-Pitch BGA) |
| Operating Voltage |
2.5V Core |
| Process Technology |
0.18μm CMOS |
| Maximum Frequency |
263 MHz |
Memory and I/O Capabilities
| Feature |
Capacity |
| Block RAM |
56 Kbits (56,000 bits) |
| Distributed RAM |
75,264 bits |
| Maximum User I/O |
284 pins |
| Global Clock Inputs |
4 dedicated clock pins |
| Delay-Locked Loops (DLLs) |
4 units |
| Temperature Range |
Commercial (0°C to +85°C) |
Understanding the XC2S200-6FGG837C Part Number
Part Number Breakdown
The part number XC2S200-6FGG837C provides crucial information about the device:
- XC2S200: Spartan-II family with 200,000 system gates
- -6: Speed grade indicating high-performance operation
- FGG: Fine-Pitch Ball Grid Array package type
- 837: 837-ball package configuration
- C: Commercial temperature grade (0°C to +85°C)
Advanced FPGA Architecture
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG837C features 1,176 Configurable Logic Blocks arranged in a 28×42 matrix, providing extensive logic resources for complex digital designs. Each CLB contains:
- Look-up tables (LUTs) for combinational logic
- Flip-flops for sequential logic
- Multiplexers for flexible routing
- Fast carry logic for arithmetic operations
Memory Architecture
Block RAM Resources
With 56 Kbits of embedded Block RAM, this FPGA excels at applications requiring:
- High-speed data buffering
- FIFO implementations
- Small memory arrays
- DSP coefficient storage
- Packet buffering for communication systems
Distributed RAM
The 75,264 bits of distributed RAM offers:
- Flexible memory allocation throughout the logic fabric
- Low-latency memory access
- Efficient small memory implementations
- Enhanced data processing capabilities
Clock Management System
The XC2S200-6FGG837C includes four Delay-Locked Loops (DLLs) strategically positioned at each corner of the die, providing:
- Precise clock distribution
- Clock deskewing capabilities
- Clock multiplication and division
- Reduced clock-to-output delays
- Enhanced timing performance
Applications and Use Cases
Telecommunications and Networking
The XC2S200-6FGG837C FPGA is extensively used in:
- Protocol Processing: Implementation of communication protocols (Ethernet, USB, CAN)
- Network Routers: High-speed packet routing and switching
- Base Station Equipment: Wireless communication infrastructure
- Data Transmission: Reliable high-speed data transfer systems
- Signal Processing: Digital signal conditioning and filtering
Industrial Automation and Control
Engineers leverage this FPGA for:
- Motor Control Systems: Precise PWM generation and feedback control
- Process Automation: Real-time control and monitoring
- Machine Vision: Image processing and analysis
- Sensor Interfaces: Multi-sensor data acquisition and processing
- PLC Functions: Programmable logic controller implementations
Consumer Electronics
The device powers various consumer applications:
- Digital Audio/Video Processing: Real-time multimedia processing
- Display Controllers: LCD/LED display management
- Gaming Systems: Graphics and logic processing
- Set-Top Boxes: Video decoding and processing
Medical Equipment
Healthcare applications include:
- Imaging Systems: Ultrasound, MRI signal processing
- Diagnostic Equipment: Real-time data analysis
- Patient Monitoring: Vital signs processing
- Laboratory Instruments: Precision measurement and control
Aerospace and Defense
Mission-critical applications utilize this FPGA for:
- Avionics Systems: Flight control and navigation
- Radar Processing: Signal detection and analysis
- Secure Communications: Encryption/decryption implementations
- Guidance Systems: Real-time trajectory calculations
Technical Advantages and Benefits
Superior Alternative to ASICs
| Advantage |
Benefit |
| No NRE Costs |
Eliminates expensive mask and tooling fees |
| Rapid Development |
Reduces time-to-market by months |
| Design Flexibility |
Allows in-field updates and modifications |
| Lower Risk |
No costly respins for design changes |
| Prototyping |
Enables thorough testing before production |
High-Density Integration
The 837-ball FBGA package provides:
- Maximum I/O density for complex interfacing
- Compact footprint for space-constrained designs
- Superior electrical performance with shorter bond wires
- Enhanced thermal characteristics
- Reduced board space requirements
Performance Optimization
Speed Grade -6 delivers:
- Fastest timing performance in the Spartan-II family
- Lower propagation delays
- Higher maximum operating frequencies
- Improved setup and hold times
- Enhanced system throughput
Cost-Effective Solution
The XC2S200-6FGG837C offers:
- Competitive pricing for 200K gate capacity
- Reduced total system cost
- Lower development expenses
- Excellent price-to-performance ratio
- Long-term availability
Development Tools and Software Support
ISE Design Suite
The XC2S200-6FGG837C is supported by Xilinx ISE (Integrated Software Environment):
- Synthesis Tools: Efficient logic synthesis
- Implementation: Place and route optimization
- Simulation: Behavioral and timing simulation
- Constraints Editor: Timing and placement constraints
- BitGen: Configuration bitstream generation
Programming and Configuration
Multiple configuration options include:
- JTAG Programming: In-system programming via boundary scan
- Master Serial Mode: Fast configuration from external memory
- Slave Serial Mode: Configuration by external controller
- Master SelectMAP: Parallel configuration interface
- Slave SelectMAP: High-speed parallel loading
Design Entry Methods
Flexible design approaches supported:
- Schematic Capture: Visual design entry
- HDL Languages: VHDL and Verilog support
- IP Cores: Pre-verified functional blocks
- CoreGen: Parameterizable IP generation
- Mixed Design: Combination of multiple methods
Package Information and Pinout
FGG837 Package Characteristics
| Feature |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array |
| Total Balls |
837 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
31 x 31 mm (nominal) |
| Body Thickness |
Approximately 2.30 mm |
| Seating Plane Height |
0.50 mm (nominal) |
| Ball Material |
Lead-free solder (RoHS compliant option available) |
Pin Configuration
The 837-ball configuration provides:
- User I/O Pins: Up to 284 configurable I/O
- Power Pins: Multiple VCCINT and VCCIO pins
- Ground Pins: Distributed GND for low impedance
- Configuration Pins: Dedicated programming interface
- Clock Input Pins: 4 global clock inputs
I/O Standards Support
Compatible I/O standards include:
- LVTTL (Low Voltage TTL)
- LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
- PCI (33 MHz, 66 MHz)
- GTL and GTL+ (Gunning Transceiver Logic)
- SSTL (Stub Series Terminated Logic)
- HSTL (High-Speed Transceiver Logic)
Design Considerations and Best Practices
Power Supply Requirements
Core Voltage (VCCINT)
- Nominal Voltage: 2.5V
- Tolerance: ±5% (2.375V to 2.625V)
- Recommended: 2.5V regulated supply
- Decoupling: Multiple capacitors near power pins
I/O Voltage (VCCIO)
- Voltage Range: 1.5V to 3.3V
- Bank-dependent: Different banks can use different voltages
- Standards-specific: Based on I/O standard requirements
Thermal Management
The XC2S200-6FGG837C requires proper thermal design:
- Junction Temperature: Maximum 85°C for commercial grade
- Power Dissipation: Varies with design utilization
- Heat Sinking: May be required for high-power designs
- Airflow: Adequate ventilation recommended
- Thermal Simulation: Use Xilinx XPower tools
PCB Design Guidelines
Layout Recommendations
- Power Plane: Solid power and ground planes
- Decoupling: 0.1μF and 0.01μF capacitors near FPGA
- Trace Impedance: Controlled impedance for high-speed signals
- Via Placement: Minimize via stubs on critical signals
- Layer Stack-up: Appropriate for signal integrity
Signal Integrity
- Termination: Match impedance for high-speed interfaces
- Crosstalk: Adequate spacing between sensitive signals
- EMI Control: Ground stitching and shielding
- Clock Distribution: Star topology for critical clocks
Ordering Information and Availability
Part Number Options
The XC2S200 series is available in various package options:
| Part Number |
Package |
Pins |
Speed Grade |
| XC2S200-6FGG837C |
837-ball FBGA |
284 I/O |
-6 (Commercial) |
| XC2S200-5FGG837I |
837-ball FBGA |
284 I/O |
-5 (Industrial) |
| XC2S200-6FG256C |
256-ball FBGA |
176 I/O |
-6 (Commercial) |
| XC2S200-6PQ208C |
208-pin PQFP |
140 I/O |
-6 (Commercial) |
Lead-Free and RoHS Compliance
The XC2S200-6FGG837C is available in:
- Standard Package: Traditional solder balls
- Green Package (indicated by “G” in part number): RoHS-compliant lead-free option
- Environmental Compliance: Meets international regulations
Product Lifecycle Status
- Availability: Check with authorized distributors
- Legacy Product: Part of mature Spartan-II family
- Replacement Recommendations: Contact Xilinx for current alternatives
- Long-term Support: Documentation and tools remain available
Comparison with Similar FPGA Devices
Spartan-II Family Comparison
| Device |
Gates |
CLBs |
Block RAM |
Max I/O |
| XC2S50 |
50,000 |
384 |
32 Kbits |
176 |
| XC2S100 |
100,000 |
600 |
40 Kbits |
176 |
| XC2S150 |
150,000 |
864 |
48 Kbits |
260 |
| XC2S200 |
200,000 |
1,176 |
56 Kbits |
284 |
Package Comparison
| Package |
Pins |
Size |
Application |
| PQ208 |
208 |
28 x 28 mm |
Moderate I/O |
| FG256 |
256 |
17 x 17 mm |
Compact designs |
| FGG837 |
837 |
31 x 31 mm |
Maximum I/O |
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG837C is manufactured to:
- ISO 9001: Quality management certification
- Automotive Standards: Available in automotive grades
- RoHS Compliance: Environmental standards
- Lead-Free Options: Green packaging available
Testing and Qualification
Each device undergoes:
- 100% Electrical Testing: Comprehensive parametric tests
- Functional Testing: Pattern verification
- Burn-in Testing: Extended reliability testing (on request)
- Quality Assurance: Rigorous inspection procedures
Reliability Features
Built-in reliability includes:
- ESD Protection: Robust I/O protection circuits
- Latch-up Immunity: CMOS latch-up prevention
- Power-on Reset: Automatic initialization
- Bitstream Encryption: Design security (when configured)
Technical Support and Resources
Documentation Available
- Data Sheet: Complete electrical specifications
- User Guide: Detailed architectural information
- Application Notes: Design guidelines and examples
- Package Drawings: Mechanical specifications
- PCB Design Guide: Layout recommendations
Online Resources
Access comprehensive support through:
- Xilinx Support Portal: Technical documentation
- Community Forums: User discussions and solutions
- Knowledge Base: Searchable technical articles
- Video Tutorials: Step-by-step design guides
- Webinars: Training and advanced topics
Development Boards
Evaluation platforms available:
- Spartan-II Starter Kits: Complete development systems
- Evaluation Boards: Various configurations
- Third-Party Boards: Compatible development platforms
- Custom Boards: Design your own system
Frequently Asked Questions
What makes the XC2S200-6FGG837C different from other packages?
The FGG837 package provides the maximum number of user I/O pins (284) in the XC2S200 family, making it ideal for applications requiring extensive external connectivity. The 837-ball configuration offers superior signal integrity and thermal performance compared to smaller packages.
Is the XC2S200-6FGG837C suitable for new designs?
While the Spartan-II family is a mature product line, it remains suitable for many applications. For new designs requiring the latest features, consider exploring newer Spartan families (Spartan-6, Spartan-7) or consult with AMD Xilinx for current recommendations.
What development tools are required?
The ISE Design Suite (available free for WebPACK edition) is the primary development environment. You’ll also need a JTAG programmer for device configuration and debugging tools for system verification.
Can I upgrade my design after deployment?
Yes, one of the key advantages of FPGAs is field programmability. You can update the device configuration in deployed systems without hardware changes, enabling bug fixes, feature additions, and performance improvements.
What is the typical power consumption?
Power consumption varies significantly based on design utilization, clock frequencies, and I/O activity. Use the Xilinx XPower tool to accurately estimate power requirements for your specific design.
Are there automotive-grade versions available?
The commercial-grade XC2S200-6FGG837C operates from 0°C to +85°C. Industrial-grade versions with extended temperature ranges are available. Contact AMD Xilinx for automotive-qualified devices if required.
Conclusion: Why Choose XC2S200-6FGG837C
The XC2S200-6FGG837C represents an excellent choice for engineers seeking a high-performance, cost-effective FPGA solution with maximum I/O capability. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in a compact 837-ball BGA package, this device delivers the resources needed for sophisticated digital designs.
Whether you’re developing telecommunications equipment, industrial control systems, consumer electronics, or medical devices, the XC2S200-6FGG837C provides the flexibility, performance, and reliability your application demands. Its reprogrammability offers significant advantages over traditional ASICs, including reduced development costs, faster time-to-market, and the ability to implement field upgrades.
For engineers and designers looking to implement complex digital logic with extensive I/O requirements, the XC2S200-6FGG837C stands as a proven, reliable solution backed by comprehensive development tools and technical support from AMD Xilinx.
