The XC2S200-6FGG836C is a sophisticated Field Programmable Gate Array (FPGA) from AMD Xilinx’s proven Spartan-II family, engineered to deliver exceptional performance for demanding digital design applications. This advanced programmable logic device combines 200,000 system gates with 5,292 logic cells in an 836-ball Fine-Pitch Ball Grid Array (FGG836) package, making it an ideal solution for high-density applications requiring maximum I/O availability and robust processing capabilities.
As a member of the Spartan-II family, this FPGA represents a cost-effective alternative to traditional mask-programmed ASICs, eliminating lengthy development cycles and high initial costs while providing field-upgradeable flexibility that custom silicon cannot match.
Key Features and Technical Specifications
Core Architecture Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II FPGA |
| Manufacturer |
AMD Xilinx |
| Part Number |
XC2S200-6FGG836C |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array Configuration |
28 x 42 matrix |
| Total CLBs |
1,176 Configurable Logic Blocks |
| Speed Grade |
-6 (fastest commercial grade) |
| Operating Temperature |
Commercial (0°C to +85°C) |
| Core Voltage |
2.5V |
| Manufacturing Process |
0.18μm CMOS technology |
| Maximum Frequency |
263 MHz |
Memory and I/O Capabilities
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (56,000 bits) |
| Total Embedded Memory |
131,264 bits |
| Maximum User I/O Pins |
284 pins |
| Global Clock Inputs |
4 dedicated pins |
| Delay-Locked Loops (DLLs) |
4 units |
Package Information
| Package Detail |
Description |
| Package Type |
FGG836 – Fine-Pitch Ball Grid Array |
| Total Ball Count |
836 balls |
| Package Configuration |
Lead-free (Pb-free) with “G” designation |
| Form Factor |
High-density BGA for maximum I/O |
| Mounting Type |
Surface Mount Technology (SMT) |
Advanced Architecture and Design Elements
Configurable Logic Block Structure
The XC2S200-6FGG836C features a sophisticated CLB architecture organized in a 28 x 42 array, providing 1,176 total configurable logic blocks. Each CLB contains:
- Look-Up Tables (LUTs) for implementing combinational logic functions
- Flip-flops for sequential logic and state machine implementation
- Multiplexers for flexible signal routing
- Carry logic for high-speed arithmetic operations
Memory Architecture Benefits
This Xilinx FPGA incorporates dual-column block RAM architecture positioned on opposite sides of the die, delivering:
- High-speed data buffering capabilities
- Efficient memory utilization for data-intensive applications
- Distributed RAM across CLBs for flexible memory implementation
- Total of 56 Kbits block RAM plus 75,264 bits distributed RAM
Clock Management System
Four strategically placed Delay-Locked Loops (DLLs) at each corner of the die provide:
- Precise clock distribution and management
- Clock deskewing capabilities
- Frequency multiplication and division
- Phase shifting for timing optimization
Performance Specifications and Speed Grade
Speed Grade -6 Characteristics
The -6 speed grade represents the fastest performance tier in the commercial temperature range Spartan-II family:
| Performance Metric |
Value |
| Maximum Operating Frequency |
263 MHz |
| Logic Delay |
Optimized for fastest propagation |
| Setup Time |
Minimized for high-speed designs |
| Clock-to-Output Delay |
Fastest in Spartan-II series |
| Temperature Range |
Commercial (0°C to +85°C) |
I/O Performance Features
| I/O Feature |
Capability |
| Maximum User I/O |
284 pins (FGG836 package) |
| I/O Standards Support |
Multiple standards (LVTTL, LVCMOS, etc.) |
| Programmable Drive Strength |
Yes |
| Slew Rate Control |
Programmable |
| Input Delay |
Programmable per pin |
| Output Delay |
Programmable per pin |
Target Applications and Use Cases
Communications and Networking
The XC2S200-6FGG836C excels in communication systems requiring:
- Protocol implementation (Ethernet, USB, Serial)
- Network router and switch logic
- Data packet processing
- Signal modulation and demodulation
- High-speed data transmission interfaces
Industrial Automation and Control
Ideal for industrial applications including:
- Motor control systems
- Process automation controllers
- PLC (Programmable Logic Controller) implementation
- Sensor interface and data acquisition
- Real-time control systems
Digital Signal Processing
Optimized for DSP applications such as:
- Audio signal processing and filtering
- Image processing algorithms
- Video encoding/decoding
- Software-defined radio (SDR)
- Digital filtering implementations
Medical Equipment
Suitable for medical device applications:
- Diagnostic imaging systems
- Patient monitoring equipment
- Medical data acquisition
- Signal conditioning and processing
- Healthcare automation systems
Consumer Electronics
Perfect for consumer product development:
- Display controllers
- Multimedia processing
- Gaming hardware
- Smart home devices
- IoT edge processing
Design and Development Advantages
Benefits Over Traditional ASICs
| Aspect |
XC2S200-6FGG836C FPGA |
Traditional ASIC |
| Initial Cost |
Low – no NRE charges |
High – significant NRE investment |
| Development Time |
Days to weeks |
Months to years |
| Design Flexibility |
Field-upgradeable |
Fixed after fabrication |
| Risk Level |
Low – rapid prototyping |
High – cannot change post-manufacturing |
| Time to Market |
Fastest |
Slow |
| Design Iterations |
Unlimited reprogramming |
Requires new mask set |
Programming and Configuration
- Supports JTAG boundary scan for testing
- In-System Programming (ISP) capability
- Multiple configuration modes
- Bitstream encryption available
- Flash-based or SRAM-based configuration options
Development Tool Support
Xilinx Design Software Compatibility
The XC2S200-6FGG836C is fully supported by:
- ISE Design Suite – Complete design entry and implementation
- Vivado – Advanced design capabilities (backward compatible)
- ChipScope Pro – Integrated logic analyzer
- CORE Generator – Optimized IP cores
- Timing Analyzer – Comprehensive timing closure
Simulation and Verification
Compatible with industry-standard tools:
- ModelSim for functional simulation
- ISim integrated simulator
- Third-party verification tools
- Hardware-in-the-loop testing support
Package and Pinout Considerations
FGG836 Package Advantages
The 836-ball Fine-Pitch BGA package offers:
- Maximum I/O availability – 284 user I/O pins
- Excellent thermal performance – Efficient heat dissipation
- High-density integration – Compact PCB footprint
- Superior signal integrity – Short bond wire connections
- Reliable manufacturing – Industry-standard BGA process
PCB Design Requirements
| Design Parameter |
Requirement |
| Ball Pitch |
Fine-pitch spacing |
| PCB Layers |
Minimum 6-8 layers recommended |
| Via Technology |
Micro-vias may be required |
| Power Plane Design |
Dedicated VCC and GND planes |
| Decoupling Capacitors |
Multiple per power rail |
| Thermal Management |
Heat sink or thermal vias |
Power Management and Consumption
Power Supply Requirements
| Power Rail |
Voltage |
Purpose |
| VCCINT |
2.5V |
Core logic power |
| VCCO |
Variable (1.5V-3.3V) |
I/O bank power |
| VCCAUX |
2.5V/3.3V |
Auxiliary circuits |
Power Consumption Characteristics
- Dynamic power based on toggle rate and design utilization
- Low standby power consumption
- Power optimization through design techniques
- Clock gating support for power reduction
- Multiple power domains for efficient management
Quality and Reliability Standards
Manufacturing Quality
- ISO 9001 certified manufacturing
- RoHS compliant (Pb-free package)
- Extended temperature testing
- Stringent quality control procedures
- Full traceability of components
Reliability Metrics
- High MTBF (Mean Time Between Failures)
- ESD protection on all I/O pins
- Latch-up resistant design
- Radiation tolerance for industrial environments
- Long-term availability commitment
Ordering Information and Package Marking
Part Number Breakdown
XC2S200-6FGG836C
- XC2S200 – Device type (Spartan-II, 200K gates)
- -6 – Speed grade (fastest commercial)
- FGG – Package type (Fine-Pitch BGA, lead-free)
- 836 – Pin count (836 balls)
- C – Commercial temperature range (0°C to +85°C)
Availability and Lead Times
Contact authorized distributors for:
- Current stock availability
- Volume pricing information
- Lead time estimates
- Technical support resources
- Development board options
Comparison with Other Spartan-II Devices
Family Member Comparison
| Device |
Logic Cells |
System Gates |
Distributed RAM |
Block RAM |
Max I/O (FGG) |
| XC2S50 |
1,728 |
50,000 |
24,576 bits |
32K |
176 |
| XC2S100 |
2,700 |
100,000 |
38,400 bits |
40K |
176 |
| XC2S150 |
3,888 |
150,000 |
55,296 bits |
48K |
260 |
| XC2S200 |
5,292 |
200,000 |
75,264 bits |
56K |
284 |
Design Best Practices
Optimization Techniques
- Timing Closure – Utilize pipelining for high-speed designs
- Resource Utilization – Balance logic and memory usage
- Clock Domain Management – Minimize clock domain crossings
- I/O Planning – Strategic pin assignment for signal integrity
- Power Optimization – Clock gating and resource sharing
Common Applications Tips
- Use block RAM for large memory requirements
- Leverage distributed RAM for small FIFOs
- Implement DLLs for clock management
- Utilize multiple I/O standards when needed
- Follow thermal design guidelines
Technical Support and Resources
Documentation Available
- Complete datasheet (DS001)
- User guide and application notes
- Package specifications
- Thermal management guides
- PCB design guidelines
- Programming and configuration manuals
Design Resources
- Reference designs and examples
- IP core library access
- Community forums and support
- Training materials and webinars
- Technical application notes
Why Choose XC2S200-6FGG836C
The XC2S200-6FGG836C represents an optimal balance of performance, flexibility, and cost-effectiveness for complex digital designs. Its 836-ball package provides maximum I/O density while the -6 speed grade ensures fastest performance in commercial applications.
Key Advantages Summary
✓ High gate density – 200,000 system gates for complex designs
✓ Maximum I/O availability – 284 user pins in FGG836 package
✓ Fastest speed grade – -6 grade for highest performance
✓ Proven reliability – Mature Spartan-II architecture
✓ Cost-effective – Lower than ASIC development costs
✓ Field-upgradeable – Unlimited design iterations
✓ Comprehensive support – Extensive tools and documentation
✓ Industry standard – Widely adopted in commercial applications
Conclusion
The XC2S200-6FGG836C delivers exceptional value for engineers and designers requiring a high-performance, flexible FPGA solution with maximum I/O capability. Whether you’re developing communication systems, industrial controllers, signal processing applications, or consumer electronics, this device provides the resources, speed, and reliability needed for successful product development.
For more information about Xilinx FPGA solutions and to explore the complete Spartan-II family, visit Xilinx FPGA resources.
