The XC2S200-6FGG834C is a premium field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance in digital logic applications. This commercial-grade FPGA features 200,000 system gates, 5,292 logic cells, and comes in an 834-ball fine-pitch BGA package, making it an ideal solution for complex embedded systems, communication infrastructure, and industrial automation projects.

As part of the Spartan-II series, the XC2S200-6FGG834C represents second-generation ASIC replacement technology that combines high-density programmable logic with cost-effective manufacturing. This device operates at speeds up to 263MHz and utilizes advanced 0.18-micron process technology, delivering robust performance for mission-critical applications.

Key Technical Specifications

Core Performance Features

Memory Architecture

Package and I/O Specifications

Advanced Architecture and Design Features

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG834C incorporates 1,176 Configurable Logic Blocks arranged in a 28×42 array, providing maximum design flexibility. Each CLB contains four logic slices, with each slice featuring two 4-input lookup tables (LUTs), two flip-flops, and dedicated arithmetic logic for efficient implementation of complex digital functions.

SelectRAM™ Hierarchical Memory System

This FPGA features Xilinx’s innovative SelectRAM technology, offering dual-port distributed RAM capabilities with 16 bits per LUT. The hierarchical memory system includes:

• Distributed RAM: 75,264 bits distributed throughout the logic fabric for fast, localized storage
• Block RAM: Seven dedicated 4K-bit dual-port block RAM modules totaling 56 Kbits
• Flexible Configuration: Block RAM can be configured as single-port or dual-port with various aspect ratios

Input/Output Architecture

The 834-ball FGG834 package provides extensive I/O capabilities, supporting multiple I/O standards including:

• LVTTL (3.3V)
• LVCMOS (2.5V, 3.3V)
• LVDS (Low-Voltage Differential Signaling)
• GTL/GTL+
• SSTL and HSTL standards

Each I/O block includes programmable pull-up/pull-down resistors, adjustable drive strength, and DDR register support for high-speed data transfer applications.

Clock Management with Delay-Locked Loops

Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide advanced clock management:

• Clock multiplication and division
• Phase shifting capabilities
• Duty cycle correction
• Clock deskew for zero-delay clock buffering

Applications and Use Cases

Communications and Networking

The XC2S200-6FGG834C excels in telecommunications applications, including:

• Network routers and switches
• Protocol converters and bridges
• Base station equipment
• Digital signal processing for voice and data

Industrial Control Systems

Industrial automation benefits from the FPGA’s reliability and reconfigurability:

• Motor control systems
• PLC (Programmable Logic Controller) applications
• Process monitoring and control
• Sensor interface modules
• Factory automation equipment

Medical Equipment

Healthcare technology leverages the device’s performance:

• Medical imaging systems
• Patient monitoring devices
• Diagnostic equipment
• Laboratory instrumentation

Automotive Electronics

Automotive applications utilize the robust architecture:

• Advanced driver assistance systems (ADAS)
• In-vehicle infotainment systems
• Engine control units
• Body electronics

Consumer Electronics

Consumer products benefit from cost-effective programmability:

• Digital set-top boxes
• Audio/video processing equipment
• Gaming peripherals
• Home automation controllers

Development Tools and Software Support

ISE Design Suite

The XC2S200-6FGG834C is fully supported by Xilinx ISE (Integrated Software Environment) Design Suite, offering:

• Schematic and HDL design entry
• Comprehensive simulation tools
• Synthesis and implementation
• Timing analysis and verification
• In-system debugging capabilities

Programming and Configuration

Multiple configuration modes are supported:

• Master Serial Mode: FPGA controls configuration PROM
• Slave Serial Mode: External controller manages configuration
• Boundary Scan (JTAG): For testing and programming
• SelectMAP: Parallel configuration interface

Advantages Over Traditional ASICs

Cost-Effective Development

The XC2S200-6FGG834C eliminates the substantial NRE (Non-Recurring Engineering) costs associated with ASIC development. Organizations can implement complex digital logic without million-dollar mask sets or lengthy fabrication cycles.

Rapid Time-to-Market

Field programmability enables:

• Instant design iteration
• Real-time testing and validation
• Quick response to market changes
• Reduced development risk

In-Field Upgradability

Unlike fixed-function ASICs, the XC2S200-6FGG834C supports:

• Firmware updates without hardware replacement
• Feature enhancements post-deployment
• Bug fixes through reconfiguration
• Extended product lifecycle

Design Considerations

Power Management

Effective power design requires attention to:

• Core voltage regulation (2.5V ±5%)
• I/O bank voltage requirements
• Decoupling capacitor placement
• Power sequencing for proper startup

PCB Layout Guidelines

The 834-ball BGA package demands careful PCB design:

• Controlled impedance traces for high-speed signals
• Adequate power and ground planes
• Via-in-pad or dog-bone routing for escape routing
• Thermal management considerations
• BGA pad design per IPC standards

Signal Integrity

High-speed operation requires:

• Impedance matching for differential pairs
• Termination strategies for long traces
• Ground referencing for signal integrity
• EMI/EMC compliance considerations

Package Marking and Identification

The XC2S200-6FGG834C features standardized package marking:

• Device type (XC2S200)
• Package designator (FGG834)
• Speed grade (-6)
• Operating temperature range (C for Commercial)
• Date code and lot traceability information

Supply Chain and Availability

AMD Xilinx maintains robust supply channels for the Spartan-II family. The XC2S200-6FGG834C is available through:

• Authorized distributors worldwide
• Direct factory orders for volume requirements
• Franchised electronic component suppliers
• Obsolescence management programs

Quality and Reliability

Manufacturing standards include:

• ISO 9001 certified production facilities
• RoHS and REACH compliance
• Automotive-grade quality options
• Extended temperature variants for harsh environments

Migration and Upgrade Path

Pin-Compatible Alternatives

Design flexibility is enhanced through package compatibility:

• Migration within Spartan-II family (XC2S100, XC2S150)
• Forward compatibility considerations with Spartan-3 series
• Package footprint commonality across speed grades

Future-Proofing Strategies

Long-term product planning should consider:

• Design portability to newer FPGA families
• IP core reusability
• Tool chain forward compatibility
• Supplier obsolescence notifications

Comparing XC2S200-6FGG834C to Other Packages

Package Variants Comparison

The FGG834 package provides the highest I/O count in the Spartan-II XC2S200 family, making it ideal for applications requiring extensive external connectivity.

Environmental and Regulatory Compliance

RoHS Compliance

Lead-free versions are identified by the “G” character in the package code (FGG vs FG), meeting European Union RoHS directives for hazardous substance restrictions.

Additional Certifications

• UL recognition for safety
• FCC compliance for electromagnetic compatibility
• REACH regulation adherence
• Conflict minerals reporting

Getting Started with XC2S200-6FGG834C

Development Resources

Engineers can accelerate development using:

• Reference designs and application notes
• Evaluation boards and development kits
• Online technical documentation
• Community forums and support networks

Technical Support

AMD Xilinx provides comprehensive support:

• Technical application engineers
• Online knowledge base
• Training and certification programs
• Design consultation services

Why Choose Xilinx FPGA Solutions

Xilinx FPGA technology has established itself as the industry standard for programmable logic solutions. With decades of innovation and billions of devices deployed worldwide, Xilinx FPGAs power critical infrastructure in telecommunications, aerospace, defense, automotive, and consumer electronics. The Spartan-II family, including the XC2S200-6FGG834C, continues to serve applications requiring reliable, cost-effective programmable logic with proven field performance.

Conclusion

The XC2S200-6FGG834C represents an excellent balance of performance, I/O capability, and cost-effectiveness for medium to high-complexity digital designs. With 200,000 system gates, 5,292 logic cells, and the extensive I/O options provided by the 834-ball BGA package, this FPGA addresses demanding applications across multiple industries.

Whether developing next-generation communication equipment, sophisticated industrial control systems, or innovative consumer products, the XC2S200-6FGG834C delivers the flexibility, performance, and reliability required for successful product deployment. Its proven architecture, comprehensive tool support, and field-programmable nature make it an ideal choice for organizations seeking to minimize development risk while maximizing design flexibility.

For engineers and procurement specialists evaluating FPGA solutions, the XC2S200-6FGG834C offers a compelling combination of technical capabilities and practical advantages that continue to make the Spartan-II family relevant for new designs and legacy system support.