The XC2S200-6FGG833C is a premium field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, offering exceptional performance and versatility in a robust 833-pin Fine-Pitch Ball Grid Array (FBGA) package. This advanced FPGA delivers 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital designs requiring high I/O density and computational power.

Engineered with 0.18µm CMOS technology and operating at 2.5V, the XC2S200-6FGG833C represents a cost-effective alternative to custom ASICs while providing the flexibility of field-programmable logic. The -6 speed grade ensures optimal performance at 263 MHz, suitable for demanding commercial applications.

Key Features and Specifications

Core Architecture Specifications

Package Information

Technical Advantages of XC2S200-6FGG833C

Enhanced I/O Capabilities

The 833-pin FGG package provides maximum I/O access with up to 284 user-configurable I/O pins, enabling seamless integration with multiple peripheral devices and high-speed interfaces. This extensive I/O capability makes the XC2S200-6FGG833C perfect for applications requiring numerous external connections.

Configurable Logic Blocks (CLBs)

With 1,176 CLBs arranged in a 28×42 array, designers can implement sophisticated digital circuits efficiently. Each CLB contains:

• Look-Up Tables (LUTs) for combinational logic
• Flip-flops for sequential logic
• Multiplexers for data routing
• Carry logic for arithmetic operations

Integrated Memory Resources

The XC2S200-6FGG833C incorporates dual memory architectures:

• Distributed RAM: 75,264 bits spread throughout CLBs for fast local storage
• Block RAM: 56 Kbits organized in dedicated columns for efficient data buffering

Delay-Locked Loop (DLL) Technology

Four integrated DLLs positioned at each corner of the die provide:

• Clock de-skewing capabilities
• Frequency multiplication and division
• Phase shifting for timing optimization
• Reduced clock distribution delay

Application Areas

Industrial Automation and Control

The XC2S200-6FGG833C excels in industrial environments, powering:

• Motor control systems with precise PWM generation
• PLC (Programmable Logic Controller) implementations
• Process monitoring and control equipment
• Sensor interface modules
• Factory automation systems

Communication Systems

Ideal for telecommunications infrastructure:

• Protocol conversion and bridging
• Network packet processing
• Data encryption/decryption engines
• Communication interface controllers
• Signal routing and switching matrices

Medical Equipment

Healthcare applications benefit from its reliability:

• Medical imaging processing systems
• Patient monitoring devices
• Diagnostic equipment controllers
• Laboratory instrumentation
• Biometric data acquisition systems

Consumer Electronics

Perfect for high-volume consumer products:

• Digital set-top boxes
• Audio/video processing equipment
• Gaming peripherals and controllers
• Home automation systems
• Smart appliance controllers

Automotive Systems

Automotive-grade implementations include:

• Dashboard display controllers
• Sensor fusion systems
• In-vehicle infotainment (IVI) platforms
• Advanced driver assistance systems (ADAS)
• Electronic control units (ECUs)

Performance Comparison Table

Design Tools and Software Support

ISE Design Suite Compatibility

The XC2S200-6FGG833C is fully supported by Xilinx ISE (Integrated Software Environment):

• Design Entry: Schematic capture and HDL editors (VHDL/Verilog)
• Synthesis: XST (Xilinx Synthesis Technology) for optimal logic implementation
• Implementation: Place and route tools optimized for Spartan-II architecture
• Simulation: ModelSim integration for functional and timing verification
• Programming: iMPACT for device configuration via JTAG

Development Workflow

HDL Design → Synthesis → Implementation → Timing Analysis → Bitstream Generation → Programming

Programming Options

Power Consumption Characteristics

Operating Voltage Requirements

Power Management Features

• Low static power consumption due to CMOS technology
• Dynamic power scaling based on logic utilization
• Programmable I/O standards for power optimization
• Multiple voltage I/O support for interface flexibility

Ordering Information and Package Marking

Part Number Breakdown

XC2S200-6FGG833C

• XC2S200: Device family and gate count (Spartan-II, 200K gates)
• -6: Speed grade (fastest commercial grade)
• FGG: Package type (Fine-Pitch BGA, Green)
• 833: Pin count (833 balls)
• C: Commercial temperature range (0°C to +85°C)

Lead-Free Options

The XC2S200-6FGG833C is available in environmentally friendly lead-free packaging, denoted by the “G” character in FGG833. This version complies with RoHS (Restriction of Hazardous Substances) directives, making it suitable for global markets with strict environmental regulations.

Design Implementation Guidelines

PCB Layout Considerations

When designing with the XC2S200-6FGG833C:

1. Power Distribution: Implement robust power plane design with adequate decoupling capacitors
2. Signal Integrity: Maintain controlled impedance for high-speed signals
3. Thermal Management: Ensure proper heat dissipation with thermal vias and adequate airflow
4. BGA Routing: Follow manufacturer guidelines for via-in-pad and escape routing
5. Ground Planning: Create solid ground reference planes for noise reduction

Best Practices

• Use differential signaling for high-speed interfaces
• Implement proper termination networks
• Group related I/Os by functionality and voltage standard
• Reserve adequate space for configuration components
• Plan for test points and JTAG access

Advantages Over ASIC Solutions

The XC2S200-6FGG833C offers compelling benefits compared to traditional ASICs:

Cost Benefits

• Zero NRE (Non-Recurring Engineering) costs
• No minimum order quantities
• Immediate availability for prototyping
• Lower total cost for low to medium volume production

Time-to-Market

• Rapid design iterations without fab delays
• In-field updates and bug fixes
• Quick response to specification changes
• Reduced development risk

Flexibility

• Design modifications post-deployment
• Feature enhancements through firmware updates
• Hardware reconfiguration capabilities
• Future-proof investment protection

Quality and Reliability

Manufacturing Standards

AMD Xilinx maintains strict quality control:

• ISO 9001 certified manufacturing facilities
• Automotive-grade quality testing available
• Extensive burn-in and testing procedures
• Comprehensive failure analysis programs

Reliability Metrics

Frequently Asked Questions

What makes the FGG833 package special?

The 833-pin Fine-Pitch BGA package provides maximum I/O connectivity in a compact footprint, offering all 284 user I/O pins with optimal signal integrity and reduced parasitic effects compared to larger pitch packages.

Is the XC2S200-6FGG833C suitable for new designs?

While the Spartan-II family is mature technology, it remains excellent for cost-sensitive applications where proven reliability matters. For cutting-edge features, consider exploring newer Xilinx FPGA families from AMD.

What development boards support this device?

Several third-party vendors offer development platforms compatible with XC2S200 devices. Contact your local distributor for current availability and specific board recommendations.

Can I migrate from smaller packages?

Yes, the XC2S200 is available in multiple package options. Pin compatibility varies by package, so careful design review is recommended when migrating between package types.

What configuration file format does it use?

The XC2S200-6FGG833C uses Xilinx .bit file format generated by ISE Design Suite. Configuration can be stored in PROM devices or loaded dynamically via JTAG.

Support and Resources

Technical Documentation

• Complete datasheet with AC/DC specifications
• User guide covering architecture details
• Application notes for specific use cases
• Package mechanical drawings and footprints
• Development tool user manuals

Community and Support

Access extensive resources through:

• AMD Xilinx Community Forums
• Technical support portal
• Application engineers for design assistance
• Training materials and webinars
• Reference designs and IP cores

Conclusion

The XC2S200-6FGG833C represents an outstanding choice for designers requiring high-performance programmable logic with extensive I/O capabilities. Its combination of 200,000 system gates, 5,292 logic cells, and 833-pin BGA packaging delivers the perfect balance of functionality, performance, and cost-effectiveness.

Whether you’re developing industrial control systems, communication infrastructure, medical devices, or consumer electronics, the XC2S200-6FGG833C provides the flexibility and reliability needed for successful product deployment. Its field-programmable nature allows rapid prototyping and in-field updates, significantly reducing development risk compared to traditional ASIC approaches.

For comprehensive information about AMD Xilinx FPGA solutions and to explore the complete product portfolio, visit our Xilinx FPGA resource center.