The XC2S200-6FGG831C is a powerful field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for demanding digital applications. With 200,000 system gates and 5,292 logic cells, this FPGA provides engineers with a cost-effective, reconfigurable solution for complex digital designs across telecommunications, industrial automation, medical devices, and embedded systems.
This commercial-grade device features speed grade -6 performance, offering optimal balance between processing speed and power efficiency. The FGG831C package variant provides extended I/O capabilities in a fine-pitch ball grid array format, making it ideal for applications requiring maximum connectivity and signal routing flexibility.
Key Technical Specifications
Core Performance Characteristics
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 x 42 |
| Total CLBs |
1,176 |
| Speed Grade |
-6 (Commercial) |
| Maximum I/O Pins |
284 (device capability) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm |
| Package Type |
FGG831C (831-Ball Fine-Pitch BGA) |
Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,320 bits) |
| Total Memory |
131,584 bits |
Advanced Features and Capabilities
Programmable Logic Architecture
The XC2S200-6FGG831C implements a sophisticated hierarchical architecture built around configurable logic blocks (CLBs). Each CLB contains four logic cells with look-up tables, flip-flops, and multiplexers, enabling complex Boolean functions and sequential logic implementation. This flexible structure allows designers to create custom digital circuits tailored to specific application requirements.
High-Speed I/O Interface
With support for up to 284 user I/O pins (excluding dedicated clock inputs), the FGG831C package delivers exceptional connectivity for complex multi-interface designs. The multivolt I/O interface supports various voltage standards, enabling seamless integration with different logic families and external components.
Delay-Locked Loops (DLLs)
Four delay-locked loops positioned at each corner of the die provide advanced clock management capabilities, ensuring precise timing control and reduced clock skew across the device. This feature is essential for high-speed designs requiring synchronized operations across multiple clock domains.
Block RAM Architecture
The device integrates dedicated block RAM modules arranged in two columns flanking the CLB array. This dual-column configuration provides efficient access to high-speed memory resources, ideal for data buffering, FIFO implementations, and look-up table storage in DSP applications.
Application Areas
Telecommunications and Networking
The XC2S200-6FGG831C excels in communication infrastructure applications, including:
- Protocol converters and bridges
- Network packet processors
- Base station signal processing
- Data encryption engines
- Communication interface controllers
Industrial Automation Systems
Industrial environments benefit from the device’s robust architecture:
- Motor control systems
- Programmable logic controllers (PLC)
- Process control automation
- Machine vision systems
- Sensor data acquisition and processing
Medical Electronics
Healthcare applications leverage the FPGA’s reliability and reconfigurability:
- Medical imaging equipment
- Patient monitoring systems
- Diagnostic instrument interfaces
- Laboratory automation equipment
- Ultrasound signal processing
Automotive and Transportation
The commercial temperature range supports various automotive applications:
- Advanced driver assistance systems (ADAS)
- Vehicle networking interfaces
- Infotainment system controllers
- Engine control unit interfaces
- Dashboard display controllers
Performance Specifications
Timing Characteristics
| Parameter |
Specification |
| Maximum Operating Frequency |
Up to 200 MHz (design-dependent) |
| Pin-to-Pin Delay |
Speed grade -6 optimized |
| Clock Distribution |
Four DLL resources |
| Setup Time |
Optimized for high-speed operation |
Power Specifications
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
2.5V ± 5% |
| I/O Supply Voltage (VCCO) |
1.5V to 3.3V (bank-dependent) |
| Typical Power Consumption |
Application-dependent |
| Low-Power Design |
Optimized for efficiency |
Package Information: FGG831C
Physical Characteristics
| Feature |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Balls |
831 |
| Ball Pitch |
Fine-pitch configuration |
| Package Marking |
Pb-free with “G” designation |
| Temperature Range |
Commercial (0°C to +85°C) |
Environmental Compliance
The XC2S200-6FGG831C features lead-free (Pb-free) packaging, denoted by the “G” character in the part number, ensuring compliance with RoHS directives and modern environmental standards.
Design Advantages and Benefits
Reconfigurability and Flexibility
Unlike mask-programmed ASICs, the XC2S200-6FGG831C offers:
- In-field programmability for design updates
- Reduced time-to-market compared to ASIC development
- Lower NRE costs and development risk
- Multiple design iterations without hardware changes
- Adaptability to evolving standards and requirements
Cost-Effective Solution
The Spartan-II architecture provides:
- Competitive pricing for 200K gate capacity
- Lower total cost of ownership versus ASIC alternatives
- Reduced inventory requirements through single-device flexibility
- Minimal upfront investment for prototyping
Superior Alternative to ASICs
The FPGA approach eliminates traditional ASIC challenges:
- No lengthy fabrication cycles
- Immediate design verification and testing
- Risk mitigation through iterative development
- Faster product launch timelines
Configuration and Programming
Configuration Modes
| Mode |
Description |
Data Width |
| Master Serial |
Self-configuring from external ROM |
1-bit |
| Slave Serial |
External controller configuration |
1-bit |
| Slave Parallel |
High-speed parallel configuration |
8-bit |
| Boundary Scan (JTAG) |
IEEE 1149.1 compliant programming |
1-bit |
Configuration Memory Size
The XC2S200 requires 1,335,840 configuration bits, determining the size of required configuration memory (PROM or flash).
Development and Design Tools
Supported Design Software
Engineers can develop for the XC2S200-6FGG831C using:
- Xilinx ISE Design Suite (legacy support)
- Vivado Design Suite (for compatible workflows)
- Third-party synthesis tools
- VHDL and Verilog HDL support
- Schematic capture tools
Evaluation and Prototyping
Development boards and starter kits facilitate rapid prototyping and design validation, though specific XC2S200 evaluation boards may require consultation with distributors.
Ordering and Availability
Part Number Breakdown
XC2S200-6FGG831C decodes as:
- XC2S200: Device type (Spartan-II, 200K gates)
- 6: Speed grade (commercial performance)
- FGG831: Package (831-ball Fine-Pitch BGA)
- C: Commercial temperature range (0°C to +85°C)
Alternative Package Options
Other XC2S200 variants include:
- FG256/FGG256 (256-pin FBGA)
- PQ208/PQG208 (208-pin PQFP)
- CS144/CSG144 (144-pin chip-scale)
Technical Support and Resources
Documentation
Essential resources for XC2S200-6FGG831C implementation:
- Spartan-II Family Data Sheet (DS001)
- Configuration and Readback
- Pinout and packaging specifications
- Application notes and design guides
Related Products
Designers may also consider the Xilinx FPGA family for comprehensive solutions across different performance tiers and application requirements.
Comparison Table: XC2S200 vs. Family Members
| Device |
Logic Cells |
System Gates |
CLBs |
Max I/O |
Block RAM |
Distributed RAM |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
32K |
24,576 bits |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
40K |
38,400 bits |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
48K |
55,296 bits |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
56K |
75,264 bits |
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG831C is manufactured using proven 0.18μm CMOS technology, ensuring:
- High reliability across commercial temperature ranges
- Consistent electrical performance
- Long product lifecycle
- Excellent yield and quality control
Testing and Validation
Each device undergoes comprehensive testing:
- Functional verification
- Timing characterization
- Boundary scan testing
- Quality assurance protocols
Frequently Asked Questions
What makes the XC2S200-6FGG831C suitable for industrial applications?
The device combines robust architecture with commercial temperature range operation, ample I/O resources, and proven reliability, making it ideal for industrial control, automation, and embedded systems requiring field-programmable logic.
Can the XC2S200-6FGG831C be reprogrammed multiple times?
Yes, as an SRAM-based FPGA, the device supports unlimited reconfiguration cycles, allowing design updates, bug fixes, and feature enhancements throughout the product lifecycle without hardware replacement.
What is the difference between standard and Pb-free packaging?
The “G” designation in FGG831C indicates lead-free (Pb-free) packaging compliant with RoHS environmental standards, while standard packages contain lead-based solder balls. Both variants offer identical electrical performance.
How does speed grade -6 compare to other options?
Speed grade -6 represents the commercial-grade performance tier, balancing speed and cost-effectiveness. It’s suitable for most applications not requiring maximum performance (-5 grade) specifications.
Summary
The XC2S200-6FGG831C represents an excellent choice for engineers seeking a proven, cost-effective FPGA solution with substantial logic resources and extensive I/O capabilities. Its 200,000 system gates, robust architecture, and reconfigurable nature make it ideal for diverse applications across telecommunications, industrial automation, medical equipment, and embedded systems.
With comprehensive development tool support, flexible configuration options, and AMD Xilinx’s legacy of quality, the XC2S200-6FGG831C continues to serve as a reliable platform for digital designs requiring programmable logic without ASIC complexity and cost.
For procurement, technical support, or application-specific guidance regarding the XC2S200-6FGG831C and related FPGA solutions, consult with authorized distributors who can provide up-to-date availability, pricing, and technical documentation.
