The XC2S200-6FGG828C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s Spartan-II family, designed to deliver exceptional performance for demanding digital processing applications. This advanced FPGA features 200,000 system gates, 5,292 logic cells, and 56K bits of block RAM, making it an ideal solution for industrial control systems, telecommunications equipment, medical devices, and high-performance computing applications.

As part of the legacy Spartan-II series, the XC2S200-6FGG828C represents a cost-effective alternative to mask-programmed ASICs while offering the flexibility of infinite reprogrammability. This device is packaged in a high-density 828-ball Fine-pitch Ball Grid Array (FBGA), providing maximum I/O capability and routing flexibility for complex system designs.

Key Features and Specifications

Core Architecture and Logic Resources

The XC2S200-6FGG828C FPGA delivers robust digital processing capabilities through its advanced architecture:

• System Gates: 200,000 gates (logic and RAM combined)
• Logic Cells: 5,292 configurable logic cells
• CLB Array: 28 x 42 array providing 1,176 total CLBs
• Maximum User I/O: 284 configurable I/O pins
• Speed Grade: -6 (higher performance grade)
• Operating Frequency: Up to 263 MHz system performance

Memory Architecture

Package Specifications

Technical Specifications Table

Electrical Characteristics

Configuration Options

Advanced Features and Capabilities

I/O Standards Support

The XC2S200-6FGG828C FPGA supports 16 different I/O standards, providing exceptional interface flexibility:

Delay-Locked Loop (DLL) Features

The XC2S200-6FGG828C includes four fully digital DLLs providing:

• Zero propagation delay clock distribution
• Clock multiplication (2x frequency doubling)
• Clock division (÷1.5, ÷2, ÷2.5, ÷3, ÷4, ÷5, ÷8, ÷16)
• Quadrature phase outputs (0°, 90°, 180°, 270°)
• Clock deskew for board-level synchronization
• Duty cycle correction for improved timing margins

Configurable Logic Blocks (CLBs)

Each CLB contains sophisticated logic resources:

• Four 4-input Look-Up Tables (LUTs)
• Four flip-flops/latches with set/reset
• Dedicated carry logic for high-speed arithmetic
• F5 and F6 multiplexers for wide function implementation
• Distributed RAM and shift register modes
• Support for complex combinational and sequential logic

Performance Characteristics

Timing Parameters

Design Capacity Comparison

Application Areas

Industrial Automation and Control

The XC2S200-6FGG828C excels in industrial environments:

• Motor control systems with precise PWM generation
• Process control for manufacturing equipment
• PLC interfaces and ladder logic implementation
• Sensor data acquisition and processing
• Machine vision preprocessing and analysis

Communications Infrastructure

Ideal for telecommunications applications:

• Protocol conversion between different standards
• Network packet processing and filtering
• SDH/SONET interface implementation
• Wireless base station signal processing
• Data encryption/decryption hardware acceleration

Medical Electronics

Reliable performance for medical devices:

• Diagnostic imaging systems processing
• Patient monitoring equipment interface
• Medical instrumentation control logic
• Ultrasound signal processing
• ECG/EEG data acquisition and filtering

Consumer Electronics

Versatile solutions for consumer products:

• Digital set-top boxes video processing
• Gaming console graphics acceleration
• Audio/video processing and enhancement
• Display controllers for LCD/LED panels
• High-speed data interfaces implementation

Design and Development

Software Tools Compatibility

Programming and Configuration

The XC2S200-6FGG828C offers flexible configuration options:

• Master Serial Mode: FPGA controls configuration from PROM
• Slave Serial Mode: External controller provides configuration
• Slave Parallel Mode: 8-bit wide high-speed configuration
• JTAG Boundary Scan: IEEE 1149.1 compliant programming

Development Resources

Comprehensive support available through AMD Xilinx:

• Complete datasheets and application notes
• Reference designs and IP cores
• Development board compatibility
• Technical support forums and documentation
• Training materials and video tutorials

Package and Pinout Information

FGG828 Package Advantages

The 828-ball FBGA package provides:

• Maximum I/O density for complex interfaces
• Excellent thermal performance for heat dissipation
• Small footprint relative to pin count
• Enhanced signal integrity with shorter bond wires
• Superior routing capabilities on PCB

Pin Configuration Overview

Ordering Information and Part Number Breakdown

Part Number Nomenclature: XC2S200-6FGG828C

• XC2S200: Device family and density (Spartan-II, 200K gates)
• -6: Speed grade (higher performance)
• FGG828: Package type (Fine-pitch BGA, 828 balls)
• C: Commercial temperature range (0°C to +85°C)

Available Variants

Design Considerations

Power Management

Efficient power design strategies:

• Core voltage regulation to 2.5V ±5%
• Multiple VCCO voltages supported per I/O bank
• Decoupling capacitors required for each power pin
• Power sequencing considerations for VCCINT and VCCO
• Static and dynamic power calculation tools available

Thermal Management

Proper thermal design ensures reliability:

• Junction temperature monitoring recommended
• Adequate PCB copper for heat spreading
• Consider airflow in high-utilization designs
• Thermal simulation tools available
• Package thermal resistance specifications in datasheet

Signal Integrity Guidelines

Best practices for high-speed design:

• Controlled impedance routing for high-speed signals
• Proper termination per I/O standard requirements
• Ground plane design for return current paths
• Power distribution network optimization
• Length matching for parallel buses

Migration and Compatibility

Family Migration Options

Designers can easily scale designs:

Pin Compatibility

The FGG828 package maintains compatibility with:

• Other XC2S200 package options for prototyping
• Standard FPGA development boards
• Third-party programming solutions
• Industry-standard PCB footprints

Quality and Reliability

Manufacturing Standards

• 0.18μm CMOS process technology
• Industrial-grade quality control
• RoHS compliant options available
• Long-term availability support
• Comprehensive testing and qualification

Reliability Data

Learn More About Xilinx FPGA

For comprehensive information about Xilinx FPGA solutions, design resources, and technical support, visit our dedicated Xilinx FPGA resource page. Explore additional Spartan-II family members, compare specifications, and access development tools to optimize your FPGA design project.

Frequently Asked Questions

What makes the XC2S200-6FGG828C suitable for high-performance applications?

The -6 speed grade, 263 MHz operation, four DLLs for clock management, and 284 I/O pins make this FPGA ideal for demanding applications requiring high-speed data processing and complex interface requirements.

How does the FGG828 package differ from other XC2S200 packages?

The FGG828 package offers the maximum I/O count (284 pins) among XC2S200 options, providing superior routing flexibility and interface capability compared to smaller packages like FG456 (284 I/O) or PQ208 (140 I/O).

Is the XC2S200-6FGG828C compatible with modern design tools?

This device is fully supported by Xilinx ISE Design Suite (version 14.7 and earlier). While Vivado does not support Spartan-II devices, ISE provides comprehensive design, synthesis, and implementation capabilities.

What configuration mode should I use for my application?

Master Serial mode is ideal for standalone operation with PROM storage. Slave Parallel offers fastest configuration for processor-controlled systems. JTAG provides convenient development and debugging access.

Can I mix different I/O standards on the XC2S200-6FGG828C?

Yes, the device supports 16 I/O standards with 8 independent I/O banks. Compatible standards can be mixed within banks based on VCCO voltage requirements. Refer to the datasheet for banking and voltage compatibility rules.

What is the difference between distributed RAM and block RAM?

Distributed RAM uses LUT resources flexibly throughout the design (75,264 bits total), ideal for small, distributed memories. Block RAM provides dedicated 4K-bit blocks (56K bits total) with dual-port access, optimized for larger data buffers and lookup tables.

How do I estimate power consumption for my design?

Xilinx provides XPower analysis tools integrated with ISE. Power depends on toggle rates, clock frequencies, I/O standards, and resource utilization. Preliminary estimates can guide thermal and power supply design.

Is technical support available for legacy Spartan-II devices?

Yes, AMD Xilinx continues to provide documentation, application notes, and community forum support for Spartan-II devices. While production status should be verified, extensive design resources remain available.

Conclusion

The XC2S200-6FGG828C FPGA represents a proven, reliable solution for applications requiring substantial logic resources, flexible I/O options, and high-performance operation. With 200,000 system gates, 284 configurable I/O pins, advanced clock management through four DLLs, and support for 16 I/O standards, this device delivers exceptional versatility for industrial, communications, medical, and consumer electronics applications.

The 828-ball Fine-pitch BGA package maximizes routing flexibility while maintaining a compact footprint, making it ideal for space-constrained, high-complexity designs. Whether you’re developing new products or maintaining existing systems, the XC2S200-6FGG828C provides the performance, flexibility, and reliability needed for successful FPGA implementation.