The XC2S200-6FGG824C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s acclaimed Spartan-II family, engineered to deliver exceptional performance for complex digital designs. This advanced FPGA features 200,000 system gates, 5,292 logic cells, and comes in an industry-standard 824-pin fine-pitch ball grid array (FGG824) package, making it an ideal solution for telecommunications, industrial automation, aerospace, and embedded system applications.

Key Features of XC2S200-6FGG824C FPGA

The XC2S200-6FGG824C stands out in the programmable logic market with its comprehensive feature set designed for demanding applications:

• 200,000 System Gates: Extensive logic capacity for implementing complex digital circuits
• 5,292 Logic Cells: Flexible configurable logic blocks (CLBs) for diverse design requirements
• 75,264 Distributed RAM Bits: High-speed on-chip memory for data buffering and processing
• 56K Block RAM: Dedicated memory blocks for efficient data storage
• 284 User I/O Pins: Maximum connectivity options for external interfacing
• Speed Grade -6: Optimized timing performance for high-speed applications
• Commercial Temperature Range: Reliable operation from 0°C to +85°C
• 824-Pin FGG Package: Fine-pitch ball grid array for high-density PCB designs

XC2S200-6FGG824C Technical Specifications

Core Architecture Specifications

Package and Electrical Specifications

Performance Specifications

Understanding XC2S200-6FGG824C Part Number

The part number XC2S200-6FGG824C contains critical information about device specifications:

• XC2S200: Device family (Spartan-II) and gate count (200K gates)
• -6: Speed grade indicating performance level (fastest commercial grade)
• FGG: Package type (Fine-Pitch Ball Grid Array)
• 824: Number of pins in the package
• C: Commercial temperature range (0°C to +85°C)

XC2S200-6FGG824C Applications and Use Cases

Telecommunications Equipment

The XC2S200-6FGG824C excels in telecommunications infrastructure where high-speed data processing and protocol implementation are essential. Its 200,000 system gates support complex communication protocols, digital signal processing algorithms, and multi-channel data handling.

Industrial Automation Systems

For industrial control applications, this FPGA provides reliable, real-time processing capabilities. Engineers utilize the XC2S200-6FGG824C for motor control systems, process automation, PLC interfaces, and sensor data acquisition systems requiring precise timing and extensive I/O connectivity.

Embedded System Development

The extensive logic resources and flexible I/O options make the XC2S200-6FGG824C ideal for embedded systems. Applications include custom computing platforms, hardware acceleration modules, and specialized processing units for aerospace and defense systems.

Digital Signal Processing (DSP)

With its distributed RAM and block memory resources, the XC2S200-6FGG824C handles demanding DSP applications including audio processing, video encoding/decoding, image filtering, and real-time signal analysis with exceptional performance.

XC2S200-6FGG824C vs Other Spartan-II Variants

Comparison with Different Package Options

Speed Grade Comparison

Design Considerations for XC2S200-6FGG824C

PCB Layout Requirements

When designing with the XC2S200-6FGG824C, engineers should consider:

1. Ball Grid Array Mounting: Proper PCB pad design for 824-pin FGG package
2. Power Distribution: Robust power plane design for clean 2.5V core voltage
3. Decoupling Capacitors: Strategic placement near power pins for noise reduction
4. Signal Integrity: Controlled impedance routing for high-speed signals
5. Thermal Management: Adequate heat dissipation for continuous operation

Configuration and Programming

The XC2S200-6FGG824C supports multiple configuration modes:

• Master Serial Mode: FPGA controls external configuration PROM
• Slave Serial Mode: External controller manages configuration
• JTAG Configuration: Ideal for prototyping and debugging
• Boundary Scan: Built-in test capabilities for production

Development Tools and Support

Xilinx ISE Design Suite

The XC2S200-6FGG824C is fully supported by Xilinx ISE Design Suite, providing:

• Complete design entry and synthesis
• Place and route optimization
• Timing analysis and verification
• Comprehensive simulation capabilities
• BitGen configuration file generation

For modern alternatives and additional resources, explore comprehensive Xilinx FPGA development tools and documentation.

IP Core Integration

Designers can accelerate development using pre-verified IP cores:

• Processor cores (MicroBlaze, PicoBlaze)
• Communication interfaces (UART, SPI, I2C)
• Memory controllers
• DSP function blocks
• Custom peripheral IP

XC2S200-6FGG824C Reliability and Quality

Manufacturing Standards

AMD Xilinx manufactures the XC2S200-6FGG824C following stringent quality standards:

• ISO 9001 Certified: Quality management systems
• Automotive Grade: AEC-Q100 qualified variants available
• RoHS Compliant: Lead-free package option (denoted by ‘G’ suffix)
• Reliability Testing: Comprehensive environmental and stress testing
• Traceability: Full manufacturing lot tracking

Environmental Specifications

Ordering and Availability

Standard Ordering Information

When procuring the XC2S200-6FGG824C, specify:

• Full Part Number: XC2S200-6FGG824C
• Package Type: Lead-free (add ‘G’ suffix) or standard
• Quantity: Volume pricing available
• Lead Time: Consult authorized distributors
• Support Requirements: Development kit, evaluation board

Package Variants

Frequently Asked Questions

What makes the XC2S200-6FGG824C different from other XC2S200 variants?

The primary difference lies in the package type. The FGG824 package offers the maximum number of user I/O pins (284) compared to smaller packages, making it ideal for applications requiring extensive external connectivity.

Can the XC2S200-6FGG824C operate in industrial temperature ranges?

The ‘C’ suffix indicates commercial temperature range (0°C to +85°C). For industrial applications requiring -40°C to +100°C operation, consider the ‘I’ suffix variant, though speed grade -6 is typically exclusive to commercial temperature range.

What development boards support the XC2S200-6FGG824C?

While dedicated development boards for the FGG824 package may be limited, the device is compatible with custom PCB designs. Xilinx ISE Design Suite provides complete support for FPGA development, simulation, and programming.

How does the speed grade -6 affect performance?

The -6 speed grade represents the fastest timing performance in the commercial range, offering minimum propagation delays and maximum operating frequencies. This enables implementation of high-speed digital designs and time-critical applications.

What programming cables work with XC2S200-6FGG824C?

Standard Xilinx programming cables supporting JTAG interface work with the XC2S200-6FGG824C, including Platform Cable USB II, Digilent HS2, and other compatible JTAG programmers.

Conclusion

The XC2S200-6FGG824C represents a robust FPGA solution for applications demanding high logic capacity, extensive I/O connectivity, and reliable performance. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in an 824-pin fine-pitch BGA package, this Spartan-II device delivers exceptional value for telecommunications, industrial automation, embedded systems, and digital signal processing applications.

Engineers choosing the XC2S200-6FGG824C benefit from AMD Xilinx’s proven FPGA architecture, comprehensive development tool support, and extensive documentation. Whether you’re designing communication equipment, industrial controllers, or custom computing platforms, the XC2S200-6FGG824C provides the flexibility, performance, and reliability needed for successful product development.