The XC2S200-6FGG821C represents a powerful field-programmable gate array solution from AMD Xilinx’s proven Spartan-II family, delivering exceptional performance for demanding embedded systems, telecommunications, and industrial automation projects. This commercial-grade FPGA combines 200,000 system gates with advanced programmable logic resources in a robust 821-ball fine-pitch BGA package, making it an ideal choice for engineers seeking reliable, high-density digital design capabilities.
Overview of XC2S200-6FGG821C FPGA Technology
The XC2S200-6FGG821C is engineered to provide superior performance and flexibility for complex digital applications. Built on Xilinx’s advanced 0.18-micron CMOS technology, this programmable logic device offers designers the ability to implement sophisticated digital circuits while maintaining cost-effectiveness and rapid time-to-market advantages over traditional ASIC solutions.
Key Features and Specifications
The XC2S200-6FGG821C delivers impressive technical capabilities that set it apart in the field-programmable gate array market:
| Feature |
Specification |
| Logic Cells |
5,292 cells |
| System Gates |
200,000 gates |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Operating Voltage |
2.5V |
| Package Type |
821-ball Fine-Pitch BGA (FGG821) |
| Speed Grade |
-6 (highest performance) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Technology Node |
0.18μm |
Understanding the XC2S200-6FGG821C Part Number
Breaking down the part number helps engineers quickly identify critical specifications:
- XC2S200: Spartan-II family, 200K system gates
- -6: Speed grade (fastest performance option)
- FGG: Fine-Pitch Ball Grid Array package style
- 821: 821-ball pin count
- C: Commercial temperature range
Technical Architecture and Core Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG821C features 1,176 configurable logic blocks arranged in a 28 x 42 matrix, providing extensive resources for implementing complex combinatorial and sequential logic functions. Each CLB contains multiple lookup tables (LUTs), flip-flops, and multiplexers, enabling efficient implementation of digital circuits.
Memory Resources and Storage Options
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Small, fast storage integrated within CLBs |
| Block RAM |
56K bits |
Efficient data buffering and FIFO implementations |
| Total On-Chip Memory |
132,608 bits |
Combined distributed and block RAM resources |
Input/Output Capabilities
With 284 maximum user I/O pins, the XC2S200-6FGG821C supports extensive external interfacing requirements. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, and differential signaling options, ensuring compatibility with diverse system architectures.
Performance Characteristics and Speed Specifications
Operating Frequency and Timing
The -6 speed grade designation indicates the XC2S200-6FGG821C delivers optimal performance characteristics:
| Performance Metric |
Specification |
| Maximum System Frequency |
Up to 200 MHz |
| Internal Clock Distribution |
Four delay-locked loops (DLLs) |
| Clock Management |
Low-jitter clock multiplication and division |
| Propagation Delay |
Optimized for high-speed applications |
Package Information: FGG821 Fine-Pitch BGA
The 821-ball fine-pitch BGA package offers several advantages for high-density applications:
- Compact footprint: Maximizes board space efficiency
- Enhanced thermal performance: Superior heat dissipation characteristics
- Signal integrity: Reduced inductance and improved electrical characteristics
- High I/O density: Accommodates 284 user I/O plus configuration and power pins
- Industry-standard footprint: Compatible with established PCB design practices
Package Dimensions and Specifications
| Package Parameter |
Value |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Total Ball Count |
821 balls |
| Ball Pitch |
Fine-pitch spacing for high-density routing |
| Moisture Sensitivity Level |
MSL 3 (industry standard) |
| Lead-Free Option |
Available (denoted by ‘G’ suffix) |
Applications and Use Cases
Telecommunications and Networking
The XC2S200-6FGG821C excels in telecommunications infrastructure applications including:
- Network routers and switches
- Protocol conversion systems
- Digital signal processing platforms
- Base station equipment
- Optical network interfaces
Industrial Automation and Control
Manufacturing and process control applications benefit from the XC2S200-6FGG821C’s reliability:
- Programmable logic controllers (PLCs)
- Motor control systems
- Factory automation equipment
- Real-time control interfaces
- Data acquisition systems
Embedded Systems Development
The device serves diverse embedded computing applications:
- Custom peripheral controllers
- System-on-chip (SoC) prototyping
- Reconfigurable computing platforms
- Embedded vision processing
- Cryptographic acceleration
Development Tools and Design Resources
Xilinx ISE Design Suite Compatibility
The XC2S200-6FGG821C integrates seamlessly with Xilinx ISE Design Suite, providing comprehensive development capabilities:
- Design Entry: Schematic capture and HDL (VHDL/Verilog) support
- Synthesis: Optimized logic synthesis for Spartan-II architecture
- Implementation: Place-and-route with timing-driven optimization
- Simulation: Comprehensive functional and timing verification
- Programming: Multiple configuration modes including JTAG, SelectMAP, and serial
IP Core Libraries and Reference Designs
Engineers can leverage extensive intellectual property resources:
| Resource Type |
Description |
| CoreGen IP |
Pre-verified cores for common functions |
| Communication Protocols |
UART, SPI, I2C, Ethernet MAC implementations |
| DSP Functions |
Filters, FFT, and signal processing blocks |
| Memory Controllers |
SDRAM, SRAM, and Flash interfaces |
| Reference Designs |
Application-specific starting points |
Configuration and Programming Options
The XC2S200-6FGG821C supports multiple configuration methodologies:
Configuration Modes
| Mode |
Description |
Use Case |
| Master Serial |
FPGA controls configuration device |
Standalone applications |
| Slave Serial |
External controller manages configuration |
System-level integration |
| JTAG |
Boundary-scan configuration |
Development and debugging |
| SelectMAP |
Parallel configuration interface |
Fast reconfiguration requirements |
Configuration Memory Requirements
- Bitstream Size: Approximately 786,432 bits
- Compatible PROMs: XC18V02, XC18V04 serial configuration PROMs
- Configuration Time: Typically under 100ms for serial modes
Power Consumption and Thermal Management
Power Supply Requirements
| Power Rail |
Voltage |
Purpose |
| VCCINT |
2.5V |
Core logic power |
| VCCO |
1.5V to 3.3V |
I/O bank power (bank-dependent) |
| VCCAUX |
2.5V |
Auxiliary circuits (DLLs, clock networks) |
Thermal Considerations
The XC2S200-6FGG821C’s 821-ball BGA package provides excellent thermal characteristics:
- Junction Temperature: 0°C to +85°C (commercial grade)
- Package Thermal Resistance: θJA optimized for forced-air cooling
- Power Dissipation: Design-dependent, typically 0.5W to 2.5W
- Thermal Management: Heat sink compatible package design
Quality, Reliability, and Compliance
Manufacturing Standards
The XC2S200-6FGG821C meets rigorous quality standards:
- Process Technology: Advanced 0.18μm CMOS
- Reliability Testing: Extensive HTOL, temperature cycling, and qualification
- Quality Management: ISO 9001 certified manufacturing
- Traceability: Full lot code and date code tracking
Environmental Compliance
| Standard |
Compliance Status |
| RoHS |
Compliant (lead-free option available) |
| REACH |
Compliant with EU regulations |
| Conflict Minerals |
Certified conflict-free sourcing |
Comparing XC2S200 Package Options
Understanding package variations helps optimize design decisions:
| Package |
Ball/Pin Count |
Board Area |
I/O Availability |
Typical Application |
| PQ208 |
208 pins |
Larger footprint |
Lower I/O density |
Cost-sensitive designs |
| FG256 |
256 balls |
Medium footprint |
Moderate I/O |
Balanced applications |
| FGG821 |
821 balls |
Compact footprint |
Maximum I/O (284) |
High-density systems |
Design Considerations and Best Practices
PCB Layout Guidelines
Successful XC2S200-6FGG821C implementation requires careful PCB design:
- Power Distribution: Robust power plane design with adequate decoupling
- Signal Integrity: Controlled impedance routing for high-speed signals
- Thermal Management: Thermal vias and appropriate copper pour
- Configuration Interface: Proper JTAG chain design and pull-up/pull-down resistors
Clock Distribution Strategy
Maximize performance through proper clock network utilization:
- Utilize the four dedicated DLL resources for clock management
- Implement proper clock domain crossing techniques
- Leverage global clock networks for low-skew distribution
- Consider clock gating for power optimization
Competitive Advantages and Value Proposition
Benefits Over ASIC Solutions
The XC2S200-6FGG821C offers significant advantages compared to application-specific integrated circuits:
- No NRE Costs: Eliminate expensive mask set charges
- Rapid Prototyping: Implement and test designs within days
- Field Upgradability: Update functionality post-deployment
- Design Flexibility: Modify specifications without silicon respins
- Lower Risk: Proven, tested silicon platform
Cost-Effective Performance
The Spartan-II family delivers optimal price-performance:
- Competitive per-unit pricing for volume production
- Lower total cost of ownership versus custom ASIC development
- Reduced time-to-market accelerates revenue generation
- Minimal inventory risk through programmable flexibility
Ordering Information and Availability
Part Number Breakdown for Procurement
When ordering the XC2S200-6FGG821C, verify complete part number specifications:
Standard Part: XC2S200-6FGG821C Lead-Free Part: XC2S200-6FGG821I (if required)
Package Marking and Identification
Physical devices include marking for traceability:
- Device type (XC2S200)
- Speed grade (-6)
- Package code (FGG821)
- Temperature range (C)
- Lot code and date code
- “SPARTAN” family designation
Technical Support and Documentation
Essential Documentation Resources
| Document Type |
Content |
Purpose |
| Datasheet |
Complete electrical specifications |
Design reference |
| User Guide |
Architecture and features |
Understanding device capabilities |
| PCB Design Guide |
Layout best practices |
Board design implementation |
| BSDL Files |
Boundary-scan description |
Test and programming |
| IBIS Models |
Signal integrity simulation |
SI/PI analysis |
Getting Technical Assistance
Engineers can access comprehensive support through:
- Online documentation libraries
- Community forums and user groups
- Application notes and white papers
- FAE (Field Application Engineer) support
- Training webinars and workshops
Alternative and Replacement Options
Within Spartan-II Family
Consider these alternatives based on resource requirements:
| Device |
System Gates |
Logic Cells |
When to Choose |
| XC2S100 |
100,000 |
2,700 |
Lower complexity designs |
| XC2S150 |
150,000 |
3,888 |
Mid-range applications |
| XC2S200 |
200,000 |
5,292 |
Maximum Spartan-II capability |
Migration to Current-Generation FPGAs
For new designs, explore modern Xilinx FPGA families offering enhanced capabilities:
- Spartan-6: Improved power efficiency and integrated features
- Spartan-7: Modern architecture with lower cost
- Artix-7: Higher performance with advanced DSP blocks
Frequently Asked Questions
What is the main difference between speed grades?
The -6 speed grade provides the fastest performance characteristics with lowest propagation delays, while lower speed grades (-5, -4) offer adequate performance at potentially lower cost for less timing-critical applications.
Can the XC2S200-6FGG821C be used in industrial temperature applications?
The “C” suffix designates commercial temperature range (0°C to +85°C). For industrial applications (-40°C to +100°C), specify the industrial temperature grade variant if available.
What programming languages are supported?
The XC2S200-6FGG821C supports industry-standard HDL languages including VHDL and Verilog for design entry, along with schematic capture for simpler designs.
How long does configuration take?
Configuration time depends on the mode selected. Master serial mode typically requires 50-100ms, while parallel SelectMAP mode offers faster configuration in 10-20ms.
Is the device still in production?
While the Spartan-II family is considered mature, availability should be verified with authorized distributors for current production status and recommended alternatives for new designs.
Conclusion: Maximizing XC2S200-6FGG821C Performance
The XC2S200-6FGG821C field-programmable gate array delivers exceptional value for engineers requiring high-performance programmable logic in a compact, high-I/O-count package. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in the space-efficient FGG821 package, this device enables sophisticated digital designs across telecommunications, industrial, and embedded applications.
Whether developing network infrastructure equipment, industrial automation systems, or advanced embedded platforms, the XC2S200-6FGG821C provides the resources, performance, and reliability required for demanding applications. Its compatibility with Xilinx ISE Design Suite ensures access to comprehensive development tools, while the established Spartan-II architecture offers proven reliability and extensive documentation.
For engineers evaluating FPGA solutions, the XC2S200-6FGG821C represents a compelling choice that balances performance, I/O capability, and cost-effectiveness. Explore the complete Xilinx FPGA portfolio to find the optimal programmable logic solution for your next design project.
