The XC2S200-6FGG820C is a powerful field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for complex digital processing applications. This 820-pin FBGA package device combines high gate density, versatile I/O capabilities, and cost-effective technology to meet the demands of modern electronic designs.
Overview of XC2S200-6FGG820C FPGA Technology
The XC2S200-6FGG820C represents AMD Xilinx’s second-generation ASIC replacement technology, offering designers unprecedented flexibility in implementing custom digital logic. Built on a proven 0.18-micron process technology, this FPGA delivers reliable performance while maintaining low power consumption and competitive pricing.
Key Features and Specifications
This advanced programmable logic device incorporates 200,000 system gates and 5,292 logic cells, providing ample resources for implementing sophisticated digital designs. The architecture is based on the successful Virtex FPGA platform, ensuring proven reliability and comprehensive development tool support.
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG820C |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
1,176 |
| Total RAM Bits |
57,344 |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18 µm |
| Core Voltage |
2.5V (2.375V – 2.625V) |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
820 pins |
| Speed Grade |
-6 |
| Operating Temperature |
0°C to 85°C (Commercial) |
XC2S200-6FGG820C Architecture and Design
Configurable Logic Block Structure
The XC2S200-6FGG820C features 1,176 configurable logic blocks arranged in a flexible grid architecture. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, enabling designers to implement complex combinational and sequential logic functions efficiently.
Memory Resources and Capabilities
The device incorporates hierarchical SelectRAM technology, providing both distributed and block RAM options:
- Distributed RAM: 16 bits per LUT for small, scattered memory requirements
- Block RAM: Configurable 4Kbit blocks totaling 57,344 bits for larger data storage needs
- Flexible Configuration: Memory blocks can be configured for various width and depth combinations
Input/Output Architecture
The 820-pin FBGA package provides extensive I/O capabilities, supporting multiple I/O standards and offering maximum flexibility for interfacing with external components and systems.
Performance Characteristics
| Performance Metric |
Value |
| Maximum Operating Frequency |
263 MHz |
| Speed Grade |
-6 (Industrial Grade Performance) |
| Propagation Delay |
Optimized for high-speed applications |
| Clock Resources |
Dedicated global clock distribution network |
| PLL Support |
Advanced clock management capabilities |
XC2S200-6FGG820C Package Information
FBGA820 Package Advantages
The Fine-Pitch Ball Grid Array package offers several critical advantages for modern electronic designs:
- High Pin Density: 820 pins in a compact footprint
- Superior Thermal Performance: Efficient heat dissipation through ball grid array
- Reduced Inductance: Lower package inductance improves signal integrity
- Space Optimization: Compact form factor suitable for space-constrained applications
- Enhanced Reliability: Robust solder ball connections for industrial environments
Package Dimensions and Specifications
| Package Parameter |
Specification |
| Package Type |
FBGA (Fine-Pitch Ball Grid Array) |
| Total Pins |
820 |
| Body Material |
High-grade substrate material |
| Ball Pitch |
Fine-pitch design for high density |
| Moisture Sensitivity Level |
MSL 3 (Industry Standard) |
Application Areas for XC2S200-6FGG820C
Communications and Networking
The XC2S200-6FGG820C excels in communication infrastructure applications, supporting protocol implementation, network packet processing, and high-speed data transmission. Its 263 MHz performance capability and extensive I/O resources make it ideal for telecommunications equipment, routers, and network switches.
Industrial Automation and Control
In industrial environments, this FPGA provides reliable performance for motor control systems, process automation, and real-time control applications. The commercial temperature range and robust architecture ensure consistent operation in demanding industrial settings.
Medical Equipment and Instrumentation
Medical device manufacturers leverage the XC2S200-6FGG820C for imaging systems, diagnostic equipment, and patient monitoring devices. The device’s reconfigurability allows for field upgrades and customization to meet evolving medical standards.
Aerospace and Defense Systems
The proven reliability and performance characteristics make this FPGA suitable for aerospace applications, including avionics systems, radar signal processing, and secure communication systems.
Development and Programming
Design Tools and Software Support
The XC2S200-6FGG820C is fully supported by AMD Xilinx’s comprehensive development toolchain, including:
- Vivado Design Suite: Advanced synthesis and implementation tools
- ISE Design Suite: Legacy support for Spartan-II devices
- ChipScope Pro: Integrated logic analyzer for debugging
- System Generator: High-level DSP design tools
Configuration Options
Multiple configuration modes provide flexibility in system design:
- JTAG Configuration: For development and debugging
- Master Serial Mode: Independent configuration from external memory
- Slave Serial Mode: Configuration controlled by external processor
- SelectMAP Mode: Parallel configuration for faster programming
Competitive Advantages
| Advantage |
Benefit |
| Cost-Effective Solution |
Optimal performance-to-price ratio for mid-range applications |
| Proven Architecture |
Based on successful Virtex technology platform |
| Unlimited Reprogrammability |
SRAM-based configuration allows unlimited reconfiguration |
| Comprehensive IP Library |
Access to extensive intellectual property cores |
| Industry Standard Tools |
Supported by industry-leading development software |
XC2S200-6FGG820C vs. Alternative Solutions
Comparison with Other Package Options
While the Spartan-II family offers various package options, the FGG820 package provides the highest pin count and I/O flexibility, making it suitable for applications requiring extensive external interfacing. Designers should consider their specific I/O requirements when selecting between different package variants.
Migration Path and Compatibility
The Spartan-II architecture provides a clear migration path to more advanced FPGA families, allowing designers to scale their designs as requirements evolve. Pin compatibility considerations and design reuse opportunities make future upgrades more manageable.
Power Consumption and Thermal Management
Power Supply Requirements
| Power Rail |
Voltage |
Purpose |
| VCCINT |
2.5V ± 5% |
Core logic power supply |
| VCCO |
1.8V to 3.3V |
I/O bank power (configurable) |
| VCCAUX |
2.5V |
Auxiliary circuits |
Thermal Considerations
The FBGA820 package design incorporates thermal management features to ensure reliable operation across the full temperature range. Proper PCB design with adequate ground planes and thermal vias enhances heat dissipation and system reliability.
Quality and Reliability
Manufacturing Standards
AMD Xilinx manufactures the XC2S200-6FGG820C using advanced semiconductor fabrication processes with rigorous quality control:
- ISO 9001 Certified Manufacturing
- Automotive Quality Grade Options (where applicable)
- RoHS Compliant (Pb-free versions available)
- Comprehensive Testing including functional, parametric, and reliability testing
Reliability Metrics
The Spartan-II family demonstrates excellent reliability characteristics with extensive qualification testing including temperature cycling, high-temperature operating life (HTOL), and accelerated environmental stress testing.
Procurement and Availability
Ordering Information
When ordering the XC2S200-6FGG820C, the part number breakdown provides important specifications:
- XC2S200: Device family and gate count
- -6: Speed grade (industrial grade performance)
- FGG: Package type (Fine-Pitch BGA)
- 820: Pin count
- C: Commercial temperature range (0°C to 85°C)
Supply Chain Considerations
As a mature product in AMD Xilinx’s portfolio, the XC2S200-6FGG820C maintains availability through authorized distributors and electronic component suppliers worldwide. For volume production requirements, direct engagement with AMD Xilinx or authorized distribution partners ensures supply chain security.
Design Resources and Support
Documentation and References
Comprehensive technical documentation supports successful design implementation:
- Datasheet: Complete electrical specifications and characteristics
- User Guide: Detailed architecture and configuration information
- Application Notes: Design guidelines and best practices
- Reference Designs: Pre-verified design examples and IP cores
Technical Support Channels
AMD Xilinx provides multiple support channels for Xilinx FPGA designers, including online forums, technical support tickets, and field application engineer assistance for complex design challenges.
Integration and System Design
PCB Design Considerations
Successful implementation of the XC2S200-6FGG820C requires careful PCB design attention:
- Power Supply Decoupling: Multiple decoupling capacitors near each power pin
- Signal Integrity: Controlled impedance routing for high-speed signals
- Thermal Management: Adequate copper area and thermal vias
- Manufacturing Tolerances: BGA-compatible PCB fabrication capabilities
Signal Integrity and Timing
The device supports various I/O standards including LVTTL, LVCMOS, SSTL, and differential standards like LVDS, providing flexibility in system interface design while maintaining signal integrity at high frequencies.
Conclusion
The XC2S200-6FGG820C delivers exceptional value for designers requiring a high-performance, cost-effective FPGA solution with extensive I/O capabilities. Its proven Spartan-II architecture, comprehensive development tool support, and 820-pin package make it an excellent choice for communications, industrial, medical, and aerospace applications. With 200,000 system gates, 5,292 logic cells, and 263 MHz performance, this device provides the resources and speed necessary for implementing complex digital designs while maintaining the flexibility and reconfigurability that FPGAs are known for.
Whether you’re developing advanced communication protocols, implementing sophisticated control algorithms, or designing next-generation medical instrumentation, the XC2S200-6FGG820C offers the performance, reliability, and support infrastructure to bring your designs to successful completion.
