The XC2S200-6FGG819C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family. This commercial-grade device delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it ideal for cost-sensitive applications requiring programmable logic solutions. Built on advanced 0.18µm process technology, this FPGA operates at 2.5V and features the premium 819-ball Fine-pitch Ball Grid Array (FBGA) package configuration.
Whether you’re developing telecommunications equipment, industrial control systems, or embedded computing platforms, the XC2S200-6FGG819C provides the flexibility and performance needed for modern digital design challenges.
Key Technical Specifications
Core FPGA Characteristics
| Specification |
Value |
| Device Family |
Spartan-II |
| Part Number |
XC2S200-6FGG819C |
| Logic Cells |
5,292 |
| System Gates |
200,000 (Logic and RAM) |
| Speed Grade |
-6 (Commercial) |
| Operating Voltage |
2.5V |
| Process Technology |
0.18µm CMOS |
| Maximum Frequency |
263 MHz |
| Temperature Range |
0°C to +85°C (Commercial) |
Memory and Logic Resources
| Resource Type |
Capacity |
| Total CLBs |
1,176 (28 x 42 array) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum User I/O |
284 pins |
| Global Clock Inputs |
4 |
| Delay-Locked Loops |
4 DLLs |
Package Information: FGG819C
Fine-Pitch BGA Package Details
The FGG819C package represents an advanced 819-ball Fine-pitch Ball Grid Array configuration, offering superior electrical performance and thermal characteristics for demanding applications.
| Package Attribute |
Specification |
| Package Type |
Fine-pitch BGA (FBGA) |
| Total Balls |
819 |
| Ball Material |
Lead-free (RoHS compliant with “G” designation) |
| Mounting Technology |
Surface mount |
| Package Code |
FGG819 |
| Thermal Performance |
Enhanced heat dissipation |
Lead-Free Compliance
The “G” character in FGG819C indicates Pb-free (lead-free) packaging, ensuring compliance with modern environmental regulations and RoHS directives. This makes the component suitable for use in environmentally-conscious applications worldwide.
Architecture and Design Features
Configurable Logic Block (CLB) Architecture
The XC2S200-6FGG819C features a robust 28 x 42 CLB array totaling 1,176 configurable logic blocks. Each CLB contains:
- Four logic cells with lookup tables (LUTs)
- Dedicated carry logic for arithmetic operations
- Distributed RAM capability for local data storage
- Fast interconnect to adjacent CLBs
Input/Output Capabilities
With up to 284 user I/O pins available, this FPGA provides extensive connectivity options:
- Flexible I/O standards support
- Programmable drive strength
- Individual pull-up/pull-down configuration
- Slew rate control for signal integrity
Memory Architecture
Distributed RAM
The 75,264 bits of distributed RAM are embedded within the CLB structure, enabling:
- Fast local storage for state machines
- Small FIFO implementations
- Lookup table-based memory
Block RAM
The 56 Kbits of dedicated block RAM provides:
- High-density data buffering
- Efficient memory implementation
- Dual-port operation capability
Performance Specifications
Speed Grade -6 Characteristics
The -6 speed grade offers optimized performance for commercial applications:
- Maximum system frequency: 263 MHz
- Fast toggle rates: Ideal for high-speed digital interfaces
- Low propagation delays: Minimized signal latency
- Commercial temperature operation: 0°C to +85°C
Timing and Clock Management
| Timing Feature |
Specification |
| DLL Count |
4 Delay-Locked Loops |
| Clock Distribution |
Global low-skew networks |
| Clock Frequency |
Up to 263 MHz |
| Phase Shifting |
DLL-based phase adjustment |
Application Areas
Industrial Control Systems
The XC2S200-6FGG819C excels in industrial automation applications:
- Motor control and drive systems
- Process monitoring and control
- Factory automation protocols
- Real-time data acquisition
Telecommunications Equipment
Ideal for communication infrastructure:
- Protocol converters and bridges
- Line card implementations
- Signal processing applications
- Network interface controllers
Embedded Computing
Perfect for embedded system development:
- Custom processor interfaces
- Peripheral controllers
- System-on-Chip (SoC) prototyping
- Hardware acceleration
Consumer Electronics
Cost-effective solution for consumer products:
- Digital signal processing
- Video/audio processing
- Display controllers
- Interface bridging
Development Tools and Software Support
Xilinx ISE Design Suite
The XC2S200-6FGG819C is fully supported by Xilinx ISE (Integrated Software Environment):
- Automatic place and route
- Timing analysis and optimization
- Logic synthesis
- Simulation and verification tools
Design Implementation
| Development Stage |
Tool Support |
| HDL Entry |
VHDL, Verilog support |
| Synthesis |
XST (Xilinx Synthesis Technology) |
| Implementation |
Automatic mapping and routing |
| Verification |
ISim simulator included |
| Programming |
JTAG and configuration options |
Competitive Advantages
Superior Alternative to ASICs
The XC2S200-6FGG819C offers significant advantages over traditional ASICs:
- No NRE costs: Eliminate expensive mask charges
- Rapid development: Faster time-to-market
- Field upgradability: Update designs without hardware changes
- Lower risk: Modify designs before production commitment
- Flexible production: Scale volumes without tooling changes
Cost-Effective Programmable Logic
- Optimized price-performance ratio
- Volume pricing advantages
- Reduced inventory costs through programmability
- Lower total cost of ownership
Power Consumption Profile
Voltage Requirements
| Supply Rail |
Voltage |
Purpose |
| VCCINT |
2.5V |
Core logic supply |
| VCCO |
Variable |
I/O bank supply |
| VCCAUX |
2.5V/3.3V |
Auxiliary circuits |
Power Management Features
- Low static power consumption
- Dynamic power scaling
- Optimized routing for reduced power
- Efficient block RAM power management
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG819C is manufactured to the highest quality standards:
- ISO 9001 certified production
- Rigorous quality control testing
- Extended burn-in options available
- Full traceability documentation
Reliability Specifications
| Reliability Metric |
Specification |
| MTBF |
High reliability rating |
| ESD Protection |
Human Body Model compliant |
| Latch-up Immunity |
JEDEC standard compliant |
| Temperature Cycling |
Commercial grade tested |
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG819C decodes as:
- XC = Xilinx FPGA
- 2S = Spartan-II family
- 200 = 200K gate count device
- -6 = Speed grade (commercial)
- FGG819 = Package type (819-ball FBGA)
- C = Commercial temperature range
Package Availability
This device is available through authorized Xilinx distributors worldwide and electronic component suppliers specializing in programmable logic solutions.
Design Considerations
PCB Layout Guidelines
When designing with the FGG819 package:
- Use appropriate ball grid array footprint design
- Implement proper power plane distribution
- Follow decoupling capacitor placement guidelines
- Consider thermal management requirements
- Plan for JTAG programming access
Signal Integrity
- Match trace impedances for high-speed signals
- Use controlled impedance routing
- Minimize stub lengths on critical nets
- Implement proper termination schemes
Comparison with Other Spartan-II Devices
| Device |
Logic Cells |
System Gates |
Max I/O |
Block RAM |
| XC2S50 |
1,728 |
50,000 |
176 |
32 Kbits |
| XC2S100 |
2,700 |
100,000 |
176 |
40 Kbits |
| XC2S150 |
3,888 |
150,000 |
260 |
48 Kbits |
| XC2S200 |
5,292 |
200,000 |
284 |
56 Kbits |
Migration Path and Future Considerations
Device Compatibility
The Spartan-II architecture provides clear migration paths:
- Pin-compatible package options available
- Upward compatibility within family
- Consistent development tool support
- Proven architecture reduces risk
Long-Term Support
While the Spartan-II family is a mature product line, it continues to serve legacy applications and cost-sensitive designs where proven technology is preferred over cutting-edge features.
Technical Support Resources
Documentation
Access comprehensive technical resources:
- Complete datasheets and specifications
- Application notes and design guides
- Reference designs and IP cores
- Community forums and knowledge base
Where to Learn More About Xilinx FPGA
For additional information on Xilinx FPGA products, development tools, and design resources, visit the comprehensive Xilinx FPGA resource center. This platform provides detailed guides, technical documentation, and expert insights on implementing Xilinx programmable logic solutions across various applications.
Conclusion
The XC2S200-6FGG819C represents a proven, cost-effective FPGA solution for applications requiring substantial logic resources and I/O capability. With its 200,000-gate capacity, 5,292 logic cells, and versatile 819-ball BGA package, this device delivers reliable performance for industrial, telecommunications, and embedded computing applications.
Its combination of mature architecture, comprehensive development tool support, and competitive pricing makes it an excellent choice for designs where proven technology and cost-effectiveness are paramount. Whether you’re upgrading legacy systems or developing new products with established requirements, the XC2S200-6FGG819C provides the programmable logic capabilities needed for successful implementation.
