The XC2S200-6FGG818C represents a powerful field-programmable gate array (FPGA) solution from AMD Xilinx’s acclaimed Spartan-II family. Engineered with 200,000 system gates and 5,292 logic cells, this FPGA delivers exceptional programmable logic capabilities for demanding applications across telecommunications, industrial automation, and embedded systems. The 818-ball Fine-Pitch Ball Grid Array (FBGA) package provides extensive I/O connectivity while maintaining compact board footprint requirements.
Manufactured using advanced 0.18-micron CMOS technology, the XC2S200-6FGG818C operates at a core voltage of 2.5V, balancing performance with power efficiency. The -6 speed grade designation ensures reliable operation in commercial temperature ranges, making this device ideal for cost-sensitive applications requiring robust digital processing capabilities.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (56,384 bits) |
| Process Technology |
0.18μm CMOS |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
2.5V / 3.3V compatible |
Package Specifications
| Parameter |
Specification |
| Package Type |
818-ball Fine-Pitch BGA (FGG818) |
| Speed Grade |
-6 (Commercial) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Ball Pitch |
Fine-pitch configuration |
| RoHS Compliance |
Lead-free available (G designation) |
Advanced Architecture and Design Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG818C incorporates 1,176 Configurable Logic Blocks arranged in a 28 x 42 array, providing extensive resources for implementing complex digital circuits. Each CLB contains:
- Four logic slices with Look-Up Tables (LUTs)
- Fast carry logic for arithmetic operations
- Distributed RAM capability for embedded memory
- Dedicated multiplexers for efficient routing
Memory Resources
This Xilinx FPGA provides dual-tier memory architecture:
Distributed RAM: With 75,264 bits of distributed memory integrated within CLBs, designers can implement small, fast memory structures including FIFOs, shift registers, and lookup tables directly within the logic fabric.
Block RAM: Eight dedicated 7 Kbit block RAM modules deliver 56 Kbits total capacity, supporting larger data buffers, packet memories, and coefficient storage for DSP applications.
Input/Output Architecture
The 818-ball package configuration offers maximum I/O flexibility with 284 user-accessible pins supporting:
- Multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL)
- Programmable drive strength and slew rate control
- Individual I/O banking for voltage flexibility
- Input-registered and output-registered modes
- Tri-state capability for bidirectional signals
Performance Characteristics
Speed Grade Analysis
| Speed Grade |
Maximum Frequency |
Application Focus |
| -6 |
263 MHz (typical) |
Commercial applications, cost-optimized designs |
| Clock-to-output |
Low propagation delay |
High-speed synchronous designs |
| Setup/Hold Times |
Optimized timing margins |
Reliable data capture |
The -6 speed grade delivers balanced performance for commercial applications, supporting system clock frequencies up to 263 MHz in typical logic configurations. This performance level accommodates most communication protocols, digital signal processing tasks, and control applications without requiring premium speed grades.
Clocking Resources
Four Delay-Locked Loops (DLLs) positioned at die corners provide:
- Clock deskewing and phase shifting
- Frequency multiplication and division
- Duty cycle correction
- Reduced clock distribution delays
Application Areas and Use Cases
Telecommunications Equipment
The XC2S200-6FGG818C excels in telecommunications infrastructure:
- Protocol Processing: Implementation of Ethernet, USB, UART, and proprietary communication protocols
- Data Packet Handling: High-speed packet parsing and routing with integrated block RAM
- Signal Conditioning: Digital filtering and signal processing for transmission systems
- Interface Bridging: Protocol conversion between different communication standards
Industrial Automation and Control
Manufacturing and process control applications benefit from:
- Motor Control Systems: PWM generation, encoder interfaces, and closed-loop control algorithms
- PLC Functionality: Programmable logic controller implementations with customizable I/O
- Sensor Integration: Multi-channel data acquisition from analog and digital sensors
- Machine Vision: Image preprocessing and pattern recognition algorithms
Consumer Electronics
High-volume consumer products leverage the cost-effectiveness:
- Display Controllers: LCD/LED driver circuits with custom timing generation
- Audio/Video Processing: Digital signal processing for multimedia applications
- Gaming Peripherals: Custom input device controllers and protocol handlers
- Smart Home Devices: IoT edge processing and local decision-making logic
Medical Instrumentation
Healthcare applications requiring reliability:
- Diagnostic Equipment: Real-time signal analysis for medical imaging systems
- Patient Monitoring: Multi-parameter vital sign processing and alarm generation
- Laboratory Analyzers: Data acquisition and analysis for test equipment
- Imaging Systems: Preprocessing for ultrasound, X-ray, and optical systems
Design Implementation Advantages
Versus ASIC Solutions
| Comparison Factor |
XC2S200-6FGG818C |
Traditional ASIC |
| Development Time |
Weeks to months |
12-18+ months |
| NRE Costs |
Minimal |
$500K – $2M+ |
| Design Iteration |
Instant reprogramming |
New mask set required |
| Time-to-Market |
Rapid deployment |
Extended development cycle |
| Field Updates |
In-system upgradable |
Hardware replacement only |
The programmable nature of the XC2S200-6FGG818C eliminates non-recurring engineering costs associated with ASIC development while enabling rapid prototyping and field upgrades. Design changes require only software reconfiguration rather than hardware respins.
Development Ecosystem
Xilinx ISE Design Suite provides comprehensive tools:
- Synthesis: Optimized logic synthesis from HDL descriptions (VHDL/Verilog)
- Implementation: Place-and-route with timing closure automation
- Simulation: Behavioral and timing-accurate verification
- Debugging: ChipScope integrated logic analyzer for in-system analysis
Power Consumption Profile
Operating Power Considerations
| Power Component |
Typical Range |
Optimization Strategy |
| Core Static (VCCINT) |
50-150 mA |
Design-dependent leakage |
| Core Dynamic |
Function of toggle rate |
Clock gating, resource minimization |
| I/O Power (VCCO) |
Per-bank load |
Output drive strength selection |
| Total System Power |
<1W typical |
Application-optimized configuration |
Power consumption scales with design complexity, operating frequency, and I/O utilization. The 2.5V core voltage provides favorable power efficiency compared to older 3.3V FPGA architectures.
Package and PCB Design Considerations
FGG818 Ball Grid Array Layout
The 818-ball configuration requires careful PCB design:
- Ball Pitch: Fine-pitch solder balls demand precise manufacturing tolerances
- Layer Count: Minimum 6-8 layer PCBs recommended for signal routing and power distribution
- Via Strategy: Blind/buried vias may be necessary for dense fanout regions
- Thermal Management: Ground plane connectivity essential for heat dissipation
Assembly Requirements
- Reflow Profile: Standard lead-free or leaded solder process compatibility
- Inspection: X-ray inspection required for solder joint quality verification
- Rework Capability: BGA rework station necessary for field repairs
- Underfill: Optional underfill for high-reliability applications
Reliability and Quality Standards
Environmental Specifications
| Parameter |
Specification |
| Storage Temperature |
-55°C to +125°C |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Humidity |
Non-condensing environments |
| MTBF |
>1 million hours (typical) |
Industry Certifications
The XC2S200-6FGG818C meets stringent industry requirements:
- JEDEC standards compliance for package reliability
- RoHS environmental directives (lead-free variants)
- Moisture sensitivity level (MSL) rating for storage and handling
- ESD protection to Human Body Model (HBM) standards
Competitive Alternatives and Selection Guide
Spartan-II Family Comparison
| Device |
System Gates |
Logic Cells |
Max User I/O |
Block RAM |
Best For |
| XC2S50 |
50,000 |
1,728 |
176 |
32 Kbits |
Low-complexity designs |
| XC2S100 |
100,000 |
2,700 |
176 |
40 Kbits |
Medium applications |
| XC2S200 |
200,000 |
5,292 |
284 |
56 Kbits |
High-performance systems |
| XC2S150 |
150,000 |
3,888 |
260 |
48 Kbits |
Mid-range solutions |
Migration Path Considerations
When evaluating upgrades or alternatives:
- Higher Capacity: Spartan-3 family offers more gates in similar packages
- Lower Power: Spartan-3L provides reduced power consumption
- Enhanced Performance: Spartan-6 delivers superior speed grades
- Modern Architecture: UltraScale+ for latest technology nodes
Procurement and Availability
Ordering Information
Full Part Number: XC2S200-6FGG818C
Part Number Breakdown:
- XC2S200: Device family and gate count
- -6: Speed grade (commercial temperature, standard performance)
- FGG818: Package type (818-ball Fine-Pitch BGA)
- C: Commercial temperature range (0°C to +85°C)
Lead-Free Options
For RoHS-compliant applications, specify the “G” variant:
- XC2S200-6FGG818CG: Green/lead-free version
Conclusion: Why Choose XC2S200-6FGG818C
The XC2S200-6FGG818C delivers compelling value for applications requiring substantial logic resources, flexible I/O connectivity, and rapid development cycles. With 200,000 system gates, comprehensive memory resources, and the extensive 818-ball package offering maximum pin availability, this FPGA addresses diverse engineering challenges across multiple industries.
Key advantages include proven Spartan-II architecture reliability, mature development tool support, cost-effective pricing for production volumes, and the flexibility to accommodate evolving design requirements through field reprogramming. Whether developing telecommunications equipment, industrial controllers, or embedded systems, the XC2S200-6FGG818C provides the programmable logic foundation for successful product implementations.
For technical support, design resources, and procurement information, consult authorized Xilinx distributors and access comprehensive documentation through AMD’s official design centers.
