The XC2S200-6FGG816C is a premium field programmable gate array from AMD Xilinx’s renowned Spartan-II FPGA family. This powerful FPGA delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital design projects. Featuring a robust 816-ball Fine-Pitch Ball Grid Array (FBGA) package, this device offers superior connectivity and reliability for demanding applications across telecommunications, industrial automation, medical devices, and embedded systems.
Key Features and Specifications
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG816C |
| Family |
Spartan-II FPGA |
| Manufacturer |
AMD Xilinx |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (57,344 bits) |
| Maximum User I/O |
284 pins |
| Package Type |
816-ball FGG (Fine-Pitch Ball Grid Array) |
| Speed Grade |
-6 (High Performance) |
| Operating Voltage |
2.5V |
| Temperature Range |
Commercial (0°C to 85°C) |
| Technology Node |
0.18μm |
| Maximum Frequency |
263 MHz |
Core Architecture and Performance
The XC2S200-6FGG816C FPGA features a sophisticated architecture designed for optimal performance and flexibility. At its core, the device contains a configurable logic block (CLB) array arranged in a 28 x 42 matrix, providing 1,176 total CLBs for implementing complex digital logic functions. Each CLB incorporates look-up tables (LUTs), flip-flops, and multiplexers, enabling designers to create custom logic circuits tailored to specific application requirements.
Memory and Storage Capabilities
Memory Configuration Table
| Memory Type |
Capacity |
Usage |
| Distributed RAM |
75,264 bits |
Fast access for small data buffers and registers |
| Block RAM |
56K bits (57,344 bits) |
High-speed data storage for larger datasets |
| Total Memory |
132,608 bits |
Combined storage for versatile applications |
The dual-memory architecture of the XC2S200-6FGG816C provides exceptional flexibility for data management. The distributed RAM integrates directly within the CLB structure, offering ultra-fast access times for critical data paths. Meanwhile, dedicated block RAM modules deliver high-density storage for buffering, lookup tables, and temporary data storage, making this FPGA ideal for signal processing and communication applications.
Package and Pin Configuration
FGG816 Package Advantages
The 816-ball Fine-Pitch Ball Grid Array package offers several distinct advantages for high-density applications:
- Maximum I/O Capacity: 284 user-configurable I/O pins plus 4 dedicated global clock inputs
- Superior Signal Integrity: Fine-pitch BGA design minimizes signal path lengths
- Enhanced Thermal Performance: Large surface area for efficient heat dissipation
- Compact Footprint: High pin count in a space-efficient package
- Improved Reliability: Robust solder ball connections for industrial environments
I/O Pin Distribution Table
| Feature |
Count |
Description |
| Maximum User I/O |
284 |
Configurable digital I/O pins |
| Global Clock Pins |
4 |
Dedicated high-speed clock inputs |
| Total Package Pins |
816 |
Complete ball grid array |
| Power/Ground Pins |
~150+ |
Distributed power delivery network |
| Signal Pins |
~660+ |
Available for I/O and configuration |
Applications and Use Cases
Industrial and Commercial Applications
The XC2S200-6FGG816C excels in a wide range of professional applications:
Digital Signal Processing (DSP)
- Audio and video processing systems
- Image recognition and machine vision
- Real-time data filtering and transformation
- Adaptive algorithm implementation
Communication Systems
- Protocol implementation and conversion
- Network routing and switching equipment
- Data encoding and decoding systems
- Telecommunications infrastructure
Industrial Automation
- Motor control and drive systems
- Process control and monitoring
- Programmable logic controllers (PLC)
- Factory automation equipment
Medical Equipment
- Diagnostic imaging systems
- Patient monitoring devices
- Medical signal processing
- Laboratory instrumentation
Security and Surveillance
- Biometric identification systems
- Secure access control systems
- Video surveillance processing
- Encryption and security protocols
Performance Characteristics
Speed and Timing Specifications
| Performance Metric |
XC2S200-6 Specification |
| Speed Grade |
-6 (Fastest commercial grade) |
| Maximum Frequency |
263 MHz |
| Toggle Rate |
Up to 526 MT/s (Million Toggles/second) |
| Propagation Delay |
Optimized for high-speed applications |
| Clock-to-Output Time |
Minimal latency for synchronous designs |
The -6 speed grade designation indicates this device operates at the highest commercial performance level within the Spartan-II family, making it suitable for timing-critical applications that demand maximum processing speed.
Design Advantages and Benefits
Why Choose XC2S200-6FGG816C?
Cost-Effective ASIC Alternative
The XC2S200-6FGG816C provides a superior alternative to mask-programmed ASICs by eliminating high initial costs, lengthy development cycles, and inherent manufacturing risks. The FPGA’s programmable nature enables rapid prototyping, iterative design improvements, and field upgrades without hardware replacement.
Development Flexibility
- In-System Reconfiguration: Update logic designs without physical component changes
- Rapid Prototyping: Quickly test and validate design concepts
- Design Iteration: Modify functionality based on real-world testing
- Future-Proof Solutions: Adapt to changing requirements over product lifetime
Resource Optimization Table
| Resource |
Utilization Benefit |
| Logic Cells |
Implement complex state machines and control logic |
| Block RAM |
Store configuration data, lookup tables, buffers |
| Distributed RAM |
Create fast FIFO buffers and shift registers |
| I/O Pins |
Interface with multiple external devices simultaneously |
| DLLs |
Generate precise clocks for synchronous systems |
Power and Thermal Management
Operating Conditions
The XC2S200-6FGG816C operates reliably within commercial temperature ranges and features efficient power management:
- Core Voltage: 2.5V for logic operations
- I/O Voltage: Flexible VCCO banks support multiple I/O standards
- Commercial Temperature Range: 0°C to 85°C
- Power Consumption: Optimized for 0.18μm CMOS technology
- Thermal Performance: Enhanced by FGG816 package design
Development Tools and Support
Design Software Compatibility
The XC2S200-6FGG816C is fully supported by industry-standard FPGA development tools:
- Xilinx ISE Design Suite: Comprehensive design entry, synthesis, and implementation
- Vivado Design Suite: Advanced development environment for complex projects
- Third-Party Tools: Compatible with various simulation and verification software
- Programming Options: JTAG, SPI, and parallel configuration modes
Comparison with Related Devices
Spartan-II Family Comparison Table
| Device |
System Gates |
Logic Cells |
Block RAM |
Max I/O |
Best For |
| XC2S150 |
150,000 |
3,888 |
48K bits |
260 |
Medium complexity projects |
| XC2S200 |
200,000 |
5,292 |
56K bits |
284 |
High-performance applications |
| XC2S300 |
300,000 |
6,912 |
64K bits |
284 |
Maximum resource requirements |
Package Options for XC2S200
| Package |
Pin Count |
Size |
Application |
| FG256 |
256-ball BGA |
17×17 mm |
Space-constrained designs |
| FGG816 |
816-ball BGA |
Larger |
Maximum I/O and connectivity |
Quality and Reliability
Manufacturing Excellence
AMD Xilinx maintains rigorous quality standards throughout the manufacturing process:
- ISO 9001:2015 Certified: Ensuring consistent quality management
- 100% Functional Testing: Every device verified before shipment
- ESD Protection: Built-in electrostatic discharge protection
- Long-Term Reliability: Proven performance in harsh environments
- Pb-Free Options: Environmental compliance with RoHS directives
Ordering and Availability
Part Number Nomenclature
Understanding the XC2S200-6FGG816C part number:
- XC2S200: Device family and gate count (Spartan-II, 200K gates)
- -6: Speed grade (highest commercial performance)
- FGG: Package type (Fine-pitch Ball Grid Array, lead-free)
- 816: Ball count (816-ball package)
- C: Commercial temperature range (0°C to 85°C)
Where to Buy
The XC2S200-6FGG816C is available through authorized distributors and electronic component suppliers worldwide. For comprehensive information about Xilinx FPGA products, technical documentation, and purchasing options, visit specialized FPGA component distributors.
Technical Resources
Documentation and Support Materials
Engineers working with the XC2S200-6FGG816C can access comprehensive technical resources:
- Datasheet: Complete electrical and timing specifications
- User Guide: Detailed architectural information and design guidelines
- Application Notes: Industry-specific implementation examples
- Reference Designs: Proven starter projects and IP cores
- Community Forums: Access to experienced FPGA developers
Conclusion: Superior FPGA Solution for Demanding Applications
The XC2S200-6FGG816C represents an excellent choice for engineers requiring high-performance programmable logic with extensive I/O capabilities. Its combination of 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and 284 user I/O pins in an 816-ball FBGA package makes it ideal for complex digital designs across telecommunications, industrial automation, medical devices, and embedded systems.
The device’s -6 speed grade ensures maximum performance for timing-critical applications, while the programmable architecture provides flexibility that traditional ASIC solutions cannot match. Whether you’re developing communication protocols, implementing signal processing algorithms, or designing industrial control systems, the XC2S200-6FGG816C delivers the resources, performance, and reliability your project demands.
With robust development tool support, comprehensive documentation, and proven reliability in commercial applications, this Spartan-II FPGA continues to serve as a cost-effective solution for engineers seeking high-quality programmable logic devices.
