The XC2S200-6FGG805C represents a powerful field-programmable gate array from AMD Xilinx’s proven Spartan-II family. This FPGA combines 200,000 system gates with advanced programmable logic capabilities, delivering exceptional performance for demanding embedded applications. Manufactured using cutting-edge 0.18-micron process technology, this device offers designers a cost-effective alternative to traditional ASICs while maintaining superior flexibility and shorter development cycles.
This Spartan-II FPGA excels in applications requiring high-density logic implementation, making it an ideal choice for telecommunications equipment, industrial automation systems, and advanced digital signal processing projects. The 805-ball fine-pitch BGA package provides enhanced thermal performance and extensive I/O capabilities for complex system integration.
Technical Specifications
Core Performance Features
| Specification |
Value |
| Logic Cells |
5,292 cells |
| System Gates |
200,000 gates |
| CLB Array Configuration |
28 × 42 (1,176 total CLBs) |
| Maximum Operating Frequency |
263 MHz |
| Speed Grade |
-6 (fastest available) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Temperature Range |
Commercial (0°C to +85°C) |
Memory Architecture
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Total On-Chip Memory |
131,264 bits |
Package Specifications
| Package Parameter |
Specification |
| Package Type |
FGG805 (Fine-Pitch BGA) |
| Ball Count |
805 balls |
| Ball Pitch |
1.0mm fine pitch |
| Package Technology |
Lead-free (RoHS compliant) |
| Thermal Performance |
Enhanced with BGA design |
| User I/O Pins |
Up to 284 maximum |
Key Features and Benefits
Advanced Programmable Logic Architecture
The XC2S200-6FGG805C incorporates 1,176 Configurable Logic Blocks (CLBs) arranged in an optimized 28×42 array. Each CLB contains four logic slices with look-up tables (LUTs), flip-flops, and multiplexers, enabling implementation of complex combinational and sequential logic functions. This architecture provides designers with maximum flexibility for custom digital circuit implementation.
Superior Memory Resources
With over 75,000 bits of distributed RAM and 56K bits of dedicated block RAM, this FPGA offers substantial on-chip memory for data buffering, lookup tables, and small memory arrays. The distributed RAM architecture allows memory to be implemented directly within the logic fabric, while block RAM modules provide efficient storage for larger data structures.
High-Speed Interface Capabilities
Operating at clock frequencies up to 263 MHz, the XC2S200-6FGG805C supports demanding high-speed applications. The -6 speed grade represents the fastest timing performance in the Spartan-II family, ensuring minimal propagation delays and maximum system throughput for time-critical designs.
Enhanced Package Technology
The FGG805 package utilizes fine-pitch ball grid array technology with 1.0mm ball spacing, offering several advantages:
- Reduced PCB footprint compared to traditional leaded packages
- Superior electrical performance through shorter interconnect lengths
- Enhanced thermal dissipation via direct die-to-substrate attachment
- Lead-free construction meeting modern environmental standards (RoHS compliant)
- High reliability for industrial and commercial applications
Applications and Use Cases
Telecommunications Infrastructure
The XC2S200-6FGG805C excels in telecommunications applications including:
- Protocol processing and conversion
- Network packet routing and switching
- Digital signal conditioning
- Communication interface bridging
- Software-defined radio implementations
Industrial Automation and Control
This FPGA provides robust solutions for industrial environments:
- Motor control and drive systems
- Process automation controllers
- Real-time monitoring and data acquisition
- Programmable logic controller (PLC) implementations
- Sensor interface and signal processing
Digital Signal Processing
High-performance DSP applications benefit from the XC2S200-6FGG805C:
- Audio and video signal processing
- Image processing and enhancement
- Digital filtering implementations
- FFT and transform operations
- Adaptive algorithm implementations
Embedded System Development
Designers leverage this FPGA for various embedded applications:
- Custom processor implementations
- Hardware acceleration modules
- Protocol controllers
- System-on-chip (SoC) prototyping
- Interface bridging and conversion
Configurable Logic Block Architecture
The XC2S200-6FGG805C features an advanced CLB architecture optimized for logic density and performance. Each CLB contains:
- Four logic slices with independent configurations
- 8 four-input LUTs for combinational logic
- 8 flip-flops for sequential logic storage
- Dedicated carry logic for fast arithmetic operations
- Distributed RAM capability up to 64 bits per CLB
This structure enables efficient implementation of wide variety of digital functions, from simple glue logic to complex state machines and arithmetic units.
I/O Block Features
Flexible Input/Output Architecture
The XC2S200-6FGG805C provides extensive I/O capabilities:
- Up to 284 user-configurable I/O pins
- Multiple I/O standards support (LVTTL, LVCMOS, PCI, GTL)
- Programmable slew rate control
- Individual pull-up/pull-down resistors
- Input delay compensation
- Output drive strength adjustment
Advanced I/O Capabilities
Each I/O block includes:
- Registered inputs and outputs for improved timing
- 3-state output control for bus applications
- Boundary scan support (IEEE 1149.1 JTAG)
- Hot-swapping capability for live insertion
- ESD protection on all pins
Clock Management System
Delay-Locked Loop (DLL) Resources
The XC2S200-6FGG805C incorporates four DLLs positioned at each corner of the die:
- Clock de-skewing for improved timing margins
- Clock frequency synthesis and multiplication
- Phase shifting capabilities
- Duty cycle correction
- Low-jitter clock distribution
Global Clock Distribution
A hierarchical clock distribution network ensures:
- Low-skew clock delivery to all logic resources
- Multiple independent clock domains
- Four dedicated global clock inputs
- Efficient clock tree synthesis
Development and Design Tools
Comprehensive Design Software Support
The XC2S200-6FGG805C integrates seamlessly with industry-standard development tools:
- Xilinx ISE Design Suite for synthesis and implementation
- Vivado Design Suite compatibility
- Third-party synthesis tool support (Synplify, Precision)
- Simulation tool integration (ModelSim, VCS)
Design Implementation Flow
- HDL Entry – VHDL or Verilog design capture
- Synthesis – Logic optimization and mapping
- Implementation – Place and route operations
- Timing Analysis – Static timing verification
- Bitstream Generation – Configuration file creation
- Programming – Device configuration via JTAG or serial interfaces
Configuration and Programming
Flexible Configuration Options
The XC2S200-6FGG805C supports multiple configuration modes:
- Master serial mode with external PROM
- Slave serial mode for processor-based systems
- Boundary scan (JTAG) programming
- SelectMAP parallel configuration
Configuration Memory
- Volatile SRAM-based configuration
- Fast reconfiguration capability (milliseconds)
- Partial reconfiguration support for dynamic designs
- Configuration data compression available
Power Management Features
Optimized Power Consumption
The XC2S200-6FGG805C provides several power optimization features:
- Core voltage operation at 2.5V
- Independent I/O bank voltage control (1.5V to 3.3V)
- Programmable unused I/O management
- Clock gating for inactive logic regions
Thermal Considerations
The FGG805 package offers enhanced thermal performance:
- Efficient heat dissipation through BGA substrate
- Compatible with standard heat sink attachments
- Thermal resistance optimized for high-reliability operation
- Junction temperature monitoring capability
Quality and Reliability
Manufacturing Standards
AMD Xilinx manufactures the XC2S200-6FGG805C to stringent quality standards:
- ISO 9001 certified production facilities
- Comprehensive electrical and functional testing
- Extended burn-in testing for critical applications
- Full traceability and lot control
Reliability Specifications
- MTBF ratings exceeding 1 million hours
- Automotive-grade options available (contact manufacturer)
- Extended temperature range variants
- Radiation-tolerant screening available for aerospace applications
PCB Design Recommendations
Layout Guidelines
For optimal performance with the FGG805 package:
- Use controlled impedance traces for high-speed signals
- Implement proper power plane decoupling
- Follow recommended via-in-pad strategies for BGA mounting
- Maintain adequate clearances around package perimeter
Assembly Considerations
- Standard SMT reflow profile compatibility
- Non-solder mask defined (NSMD) pad recommendations
- X-ray inspection for BGA solder joint verification
- Moisture sensitivity level (MSL) 3 handling requirements
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG805C
- XC2S200: Device family and gate count
- -6: Speed grade (fastest)
- FGG805: Package type (fine-pitch BGA, 805-ball)
- C: Commercial temperature range
Related Products
For different application requirements, consider these Spartan-II alternatives:
- XC2S100 series for lower gate count needs
- XC2S150 series for mid-range applications
- Alternative package options (PQ208, FG256, FG456)
Why Choose the XC2S200-6FGG805C?
Proven Technology Platform
The Spartan-II family has established itself as a reliable, cost-effective FPGA solution across numerous industries. The XC2S200-6FGG805C combines this proven architecture with advanced packaging technology.
Cost-Effective Alternative to ASICs
Compared to mask-programmed ASICs, the XC2S200-6FGG805C offers:
- Zero NRE costs – no mask set charges
- Rapid prototyping – same-day design iterations
- Field upgradability – design changes without hardware replacement
- Lower risk – no long-term manufacturing commitments
- Faster time-to-market – immediate design implementation
Extensive Ecosystem Support
Benefit from comprehensive resources:
- Active user community and technical forums
- Extensive application notes and reference designs
- Technical support from AMD Xilinx
- Third-party IP core availability
- Development board options
Technical Support Resources
For more information about Xilinx FPGA products and comprehensive design resources, engineers can access detailed documentation, application notes, and reference designs. The extensive support ecosystem ensures successful implementation of projects using the XC2S200-6FGG805C.
Conclusion
The XC2S200-6FGG805C represents an excellent choice for engineers requiring high-performance programmable logic with extensive I/O capabilities. Its combination of 200,000 system gates, advanced memory resources, and high-speed operation in a compact FGG805 package makes it suitable for diverse applications across telecommunications, industrial, automotive, and consumer electronics markets.
Whether implementing complex digital signal processing algorithms, developing custom communications protocols, or creating sophisticated control systems, the XC2S200-6FGG805C delivers the performance, flexibility, and reliability needed for successful product development. The device’s compatibility with industry-standard design tools and extensive technical support ensures efficient development cycles and reduced time-to-market for innovative electronic products.
