The XC2S200-6FGG804C is a premium field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional programmable logic capabilities for demanding embedded systems and digital design applications. This advanced FPGA combines 200,000 system gates with a robust 804-pin Fine-Pitch Ball Grid Array package, making it the ideal choice for complex digital processing tasks.
Overview of XC2S200-6FGG804C Spartan-II FPGA
The XC2S200-6FGG804C represents a superior alternative to traditional mask-programmed ASICs, eliminating the substantial upfront costs, extended development cycles, and inherent risks associated with conventional application-specific integrated circuits. Built on proven 0.18-micron process technology, this programmable logic device offers engineers unprecedented design flexibility with the ability to upgrade and modify functionality in the field without hardware replacement.
Key Technical Specifications
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum User I/O |
284 pins |
| Package Type |
804-Pin FGG (Fine-Pitch Ball Grid Array) |
| Speed Grade |
-6 (Commercial temperature range) |
| Core Voltage |
2.5V |
| Maximum Operating Frequency |
263 MHz |
| Process Technology |
0.18μm |
XC2S200-6FGG804C Architecture and Features
Advanced Configurable Logic Blocks (CLBs)
The XC2S200-6FGG804C features 1,176 Configurable Logic Blocks arranged in an optimized 28 x 42 array, providing extensive logic density for implementing sophisticated digital circuits. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, enabling flexible implementation of complex combinational and sequential logic functions.
Memory Architecture
This Xilinx FPGA integrates dual memory architectures for maximum versatility:
Distributed RAM: 75,264 bits of distributed memory embedded throughout the logic fabric for high-speed data buffering and small memory requirements.
Block RAM: 56 Kbits of dedicated block RAM organized in columns, ideal for larger data storage needs, FIFO buffers, and lookup tables.
Enhanced I/O Capabilities
| Package Feature |
Specification |
| Total I/O Pins |
804 pins (FGG package) |
| User I/O Available |
284 maximum user-configurable I/O |
| Global Clock Inputs |
4 dedicated global clock pins |
| Delay-Locked Loops (DLLs) |
4 DLLs for clock management |
| I/O Standards Support |
Multiple LVCMOS, LVTTL, PCI, GTL+ standards |
XC2S200-6FGG804C Performance Characteristics
Speed Grade and Timing
The -6 speed grade designation ensures optimal performance under commercial temperature conditions (0°C to +85°C), providing:
- Maximum toggle frequency of 263 MHz
- Optimized routing delays for high-speed designs
- Commercial temperature range operation
- Enhanced signal integrity for demanding applications
Power Management Features
| Power Specification |
Details |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (bank-dependent) |
| Standby Power |
Low static power consumption |
| Configuration |
Multiple configuration modes available |
Applications of XC2S200-6FGG804C FPGA
Telecommunications and Networking
The XC2S200-6FGG804C excels in telecommunications infrastructure, supporting protocol implementation, baseband processing, and high-speed data routing applications. Its 200,000 gates and 284 I/O pins enable complex communication system designs.
Industrial Automation and Control
Industrial automation systems benefit from the device’s reliable operation and reconfigurability. Applications include:
- Programmable logic controllers (PLCs)
- Motor control systems
- Process automation equipment
- Real-time monitoring systems
- Sensor interface modules
Digital Signal Processing (DSP)
The integrated block RAM and high logic density make the XC2S200-6FGG804C suitable for DSP applications such as:
- Audio and video processing
- Image filtering and enhancement
- Data compression algorithms
- Adaptive filtering systems
Medical and Scientific Instrumentation
Medical device manufacturers utilize this FPGA for:
- Diagnostic imaging equipment
- Patient monitoring systems
- Laboratory instrumentation
- Biomedical signal processing
Aerospace and Defense Systems
The commercial-grade XC2S200-6FGG804C supports various aerospace applications requiring high reliability and reconfigurability.
XC2S200-6FGG804C Package Information
804-Pin FGG Package Advantages
The Fine-Pitch Ball Grid Array (FGG) package with 804 pins offers several critical benefits:
High Pin Count: Maximizes available I/O resources for complex interfacing requirements
Compact Footprint: Efficient use of PCB real estate despite high pin density
Enhanced Thermal Performance: Ball grid array configuration provides superior heat dissipation
Signal Integrity: Reduced lead inductance compared to traditional packages
Manufacturing Reliability: Industry-standard BGA mounting processes
Package Dimensions
| Package Parameter |
Specification |
| Package Type |
FGG804 (Fine-Pitch BGA) |
| Total Pins |
804 |
| Ball Pitch |
Fine-pitch configuration |
| Mounting |
Surface mount technology |
| RoHS Compliance |
Lead-free options available (FGG vs. FG) |
Design Tools and Development Support
Compatible Development Software
The XC2S200-6FGG804C is supported by comprehensive design tools:
- Xilinx ISE Design Suite: Complete design environment for Spartan-II devices
- Vivado Design Suite: Advanced synthesis and implementation (legacy support)
- IP Core Libraries: Extensive pre-verified IP for rapid development
- ChipScope Pro: Integrated logic analyzer for debugging
Configuration Options
| Configuration Method |
Description |
| Master Serial |
FPGA controls configuration PROM |
| Slave Serial |
External controller manages configuration |
| Boundary Scan (JTAG) |
IEEE 1149.1 compliant for programming and testing |
| SelectMAP |
Parallel configuration for faster loading |
XC2S200-6FGG804C vs. Other Spartan-II Packages
Package Comparison
| Feature |
FGG804 |
FG456 |
PQ208 |
FG256 |
| Total Pins |
804 |
456 |
208 |
256 |
| User I/O |
284 (max) |
284 |
140 |
176 |
| Package Type |
Fine-Pitch BGA |
Fine-Pitch BGA |
PQFP |
FBGA |
| Best For |
Maximum I/O density |
High I/O requirements |
Cost-sensitive designs |
Balanced applications |
Ordering Information and Part Number Breakdown
Part Number Decoding: XC2S200-6FGG804C
XC2S200: Spartan-II family, 200K gates -6: Speed grade (commercial temperature) FGG: Fine-Pitch Ball Grid Array, lead-free 804: Pin count C: Commercial temperature range (0°C to +85°C)
Speed Grade Options
| Speed Grade |
Application |
Temperature Range |
| -5 |
Standard performance |
Commercial/Industrial |
| -6 |
Enhanced performance |
Commercial only |
Reliability and Quality Standards
The XC2S200-6FGG804C meets stringent quality standards:
- Manufactured using mature 0.18μm process technology
- Comprehensive production testing and screening
- JEDEC-compliant package standards
- Extended operational lifetime
- Available with lead-free (RoHS-compliant) packaging
Getting Started with XC2S200-6FGG804C
Development Resources
Engineers can access extensive resources:
- Datasheets: Complete electrical and timing specifications
- Application Notes: Design guidelines and best practices
- Reference Designs: Proven starting points for common applications
- Technical Support: Expert assistance from AMD Xilinx and distributors
- Online Communities: Active FPGA development forums
Recommended Development Boards
While the XC2S200-6FGG804C requires custom PCB design due to its specialized 804-pin package, engineers often prototype with:
- Custom evaluation boards
- Spartan-II development platforms
- Third-party FPGA prototyping systems
Conclusion: Why Choose XC2S200-6FGG804C
The XC2S200-6FGG804C delivers exceptional value for applications requiring substantial logic capacity, extensive I/O resources, and flexible reconfigurability. Its 200,000 system gates, 5,292 logic cells, and 804-pin package make it the optimal choice for complex embedded systems, telecommunications equipment, industrial controllers, and high-performance digital processing applications.
Key advantages include:
- Cost-Effective Alternative to ASICs: Eliminate NRE costs and reduce time-to-market
- Maximum I/O Flexibility: 284 user-configurable I/O pins in 804-pin package
- Proven Reliability: Mature Spartan-II architecture with extensive field deployment
- In-Field Reconfigurability: Update functionality without hardware changes
- Comprehensive Tool Support: Industry-standard development environments
Whether you’re designing next-generation telecommunications infrastructure, advanced industrial automation systems, or sophisticated digital signal processing applications, the XC2S200-6FGG804C provides the performance, flexibility, and reliability demanded by today’s most challenging programmable logic applications.
