The XC2S200-6FGG801C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This high-performance programmable logic device delivers exceptional processing capabilities with 200,000 system gates, making it an ideal solution for complex digital designs across industrial, telecommunications, and embedded systems applications. The 801-ball Fine-Pitch Ball Grid Array package provides maximum I/O flexibility and superior thermal performance for demanding environments.

Key Technical Specifications

Core Architecture Features

Package and Environmental Specifications

Advanced Features and Capabilities

Programmable Logic Resources

The XC2S200-6FGG801C incorporates a sophisticated architecture designed for maximum flexibility. With 1,176 Configurable Logic Blocks arranged in a 28×42 matrix, this FPGA enables implementation of intricate digital circuits and complex algorithms. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, providing the building blocks for virtually any digital logic function.

Memory Architecture

This device features dual memory systems:

Distributed RAM: 75,264 bits spread throughout the CLB array for fast, localized data storage Block RAM: 56K bits organized in dedicated memory blocks for efficient buffering and data processing

High-Speed I/O Capabilities

The FGG801 package configuration supports up to 284 user I/O pins, enabling extensive connectivity options for:

• Multi-channel data acquisition systems
• Complex communication protocols
• High-speed digital interfaces
• Parallel processing applications
• Sensor array management

Delay-Locked Loop (DLL) Technology

Four integrated DLLs positioned at each corner of the die provide precision clock management, enabling:

• Clock de-skewing and phase shifting
• Frequency synthesis and multiplication
• Reduced clock distribution delays
• Enhanced system timing performance

Performance Specifications

Speed Grade Characteristics

Target Applications

Industrial Automation and Control

The XC2S200-6FGG801C excels in industrial environments, powering:

• Motor control systems with precise PWM generation
• Process control automation
• PLC (Programmable Logic Controller) implementations
• Machine vision systems
• Factory automation networks

Telecommunications Infrastructure

Deploy this Xilinx FPGA in telecommunications equipment including:

• Network routers and switches
• Protocol converters and bridges
• Digital signal processing units
• Base station controllers
• Data encryption modules

Medical Equipment

Healthcare applications benefit from the reliability and reconfigurability:

• Medical imaging systems (ultrasound, X-ray processing)
• Patient monitoring devices
• Diagnostic equipment
• Laboratory instrumentation
• Therapeutic device control

Consumer Electronics

Enable innovative consumer products:

• High-definition video processing
• Audio/video codecs
• Gaming peripherals
• Smart home controllers
• Wearable device processing

Security and Surveillance

Implement robust security solutions:

• Video surveillance systems
• Biometric authentication
• Access control systems
• Data encryption engines
• Intrusion detection systems

Development and Configuration

Programming Methods

Design Tools Compatibility

The XC2S200-6FGG801C integrates seamlessly with industry-standard development environments:

• AMD Xilinx Vivado Design Suite
• ISE Design Suite (legacy support)
• Third-party synthesis tools
• Simulation and verification platforms
• Hardware co-simulation capabilities

Advantages Over Alternative Solutions

FPGA vs. ASIC Benefits

Cost Efficiency: Eliminates expensive NRE (Non-Recurring Engineering) costs associated with ASIC development

Time-to-Market: Immediate prototyping and deployment without fabrication delays

Field Upgradability: Update functionality through reconfiguration without hardware replacement

Risk Mitigation: Modify designs post-deployment to fix bugs or add features

Lower MOQ: No minimum order quantities required unlike ASIC production

Spartan-II Family Advantages

The XC2S200-6FGG801C represents the optimal balance in the Spartan-II lineup:

• Sufficient logic resources for complex applications
• Cost-effective compared to larger devices
• Proven reliability in production environments
• Extensive third-party IP core availability
• Long-term product availability

Design Considerations

Power Management

Core Power Consumption: Optimized 2.5V core architecture for efficient operation I/O Power Options: Flexible I/O banking supports multiple voltage standards Thermal Design: FGG801 package provides excellent heat dissipation

PCB Layout Guidelines

Quality and Reliability

Manufacturing Standards

AMD Xilinx manufactures the XC2S200-6FGG801C to stringent quality standards:

• ISO 9001 certified production facilities
• Automotive-grade quality options available
• RoHS compliant (Pb-free versions)
• REACH regulation compliance
• Comprehensive reliability testing

Testing and Validation

Each device undergoes rigorous testing:

• 100% functional testing
• Burn-in testing for high-reliability applications
• Temperature cycling validation
• Electrical parameter verification
• Package integrity inspection

Pin Configuration and Interface

I/O Standards Support

The XC2S200-6FGG801C supports multiple I/O standards:

• LVTTL (Low Voltage TTL)
• LVCMOS (2.5V, 3.3V)
• PCI 33/66 MHz
• GTL/GTL+
• HSTL (High-Speed Transceiver Logic)
• SSTL (Stub Series Terminated Logic)

Global Clock Resources

Primary Clock Inputs: 4 dedicated global clock pins Secondary Clocks: Additional GCLK resources via IOBs DLL Outputs: Distributed clock networks with minimal skew

Technical Support and Resources

Documentation Availability

Comprehensive technical documentation includes:

• Complete datasheet with AC/DC specifications
• User guides and application notes
• Package mechanical drawings
• PCB design guidelines
• Software user manuals

Development Resources

Access extensive development support:

• Reference designs and example projects
• IP core libraries
• Online training materials
• Technical forums and communities
• Direct technical support channels

Ordering Information and Part Number Breakdown

Part Number Decoding: XC2S200-6FGG801C

XC2S200: Device family and logic capacity (Spartan-II, 200K gates) -6: Speed grade (commercial temperature range) FGG: Package type (Fine-pitch BGA, Pb-free) 801: Pin count (801 balls) C: Commercial temperature range (0°C to +85°C)

Comparison with Related Devices

Spartan-II Family Positioning

Competitive Advantages

Performance Benefits

High Logic Density: Maximum gates-per-dollar ratio in Spartan-II family Extensive I/O: 801-ball package maximizes connectivity options Proven Architecture: Field-tested and production-validated design Tool Maturity: Comprehensive, debugged development tool support

Application Versatility

The XC2S200-6FGG801C adapts to diverse requirements:

• Scales from prototype to production
• Supports iterative development methodology
• Enables platform-based design approaches
• Accommodates future feature additions

Best Practices for Implementation

Design Optimization Tips

Resource Utilization: Balance logic, RAM, and I/O usage for optimal performance Timing Closure: Leverage DLL resources for clock domain management Power Optimization: Implement clock gating and power-aware design techniques Verification: Comprehensive simulation before hardware deployment

Common Applications Examples

Digital Signal Processing: Implement filters, FFTs, and custom DSP algorithms Communication Protocols: Create custom interfaces and protocol converters State Machines: Complex control logic with multiple states Data Acquisition: Multi-channel ADC interfacing with preprocessing

Environmental and Compliance

Regulatory Certifications

• RoHS Directive compliance (Pb-free options)
• REACH SVHC compliant
• Conflict minerals reporting available
• ECCN classification documented

Environmental Operating Conditions

Storage Temperature: -65°C to +150°C Operating Humidity: 5% to 95% non-condensing ESD Sensitivity: Class 1 (HBM model)

Long-Term Availability

AMD Xilinx maintains long product lifecycles for the Spartan-II family, ensuring:

• Extended manufacturing commitment
• Stable pricing for volume production
• Backward compatibility support
• Migration paths to newer families

Conclusion

The XC2S200-6FGG801C represents a proven, high-performance FPGA solution for demanding digital applications. With 200,000 system gates, 284 I/O pins, and comprehensive development tool support, this device enables rapid development and deployment of sophisticated electronic systems. Whether you’re designing industrial controllers, telecommunications equipment, medical devices, or consumer electronics, the XC2S200-6FGG801C delivers the performance, flexibility, and reliability required for success.

Its combination of logic capacity, memory resources, and extensive I/O makes it suitable for applications requiring complex processing with multiple external interfaces. The mature development tools, extensive documentation, and proven track record in production environments reduce project risk and accelerate time-to-market.

For engineers seeking a cost-effective, reliable FPGA with substantial logic resources and maximum I/O flexibility, the XC2S200-6FGG801C from AMD Xilinx’s Spartan-II family remains an excellent choice for both new designs and production applications.