Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG799C: Advanced Spartan-II FPGA for Complex Logic Designs

Product Details

The XC2S200-6FGG799C is a robust and versatile Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family, engineered to deliver high-performance logic integration for cost-sensitive applications. Leveraging a proven 0.22-micron CMOS process, this device balances power efficiency with substantial processing capability, making it a preferred choice for embedded system designers.

With its expansive 799-ball Fine-Pitch Ball Grid Array (FBGA) package, the XC2S200-6FGG799C offers enhanced signal integrity and thermal management, ensuring reliable operation in demanding industrial and commercial environments. For those exploring the broader ecosystem of programmable logic, you can visit the Xilinx FPGA LINK for more resources.


Technical Specifications of XC2S200-6FGG799C

The XC2S200-6FGG799C is defined by its impressive logic density and flexible architecture. Below are the core specifications that distinguish this device in the Spartan-II lineup.

Core Performance Parameters

Feature Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total Block RAM 56,320 Bits
Distributed RAM 75,264 Bits
Speed Grade -6 (High Performance)
Package Type FGG799 (799-ball FBGA)
Operating Temperature 0°C to +85°C (Commercial)

Key Features and Architectural Advantages

The XC2S200-6FGG799C incorporates a suite of system-level features designed to streamline the development of complex digital systems.

1. Robust Clock Management

This FPGA includes four dedicated Delay-Locked Loops (DLLs), providing advanced clock control capabilities. These DLLs are essential for:

  • Clock De-skew: Eliminating clock distribution delays across the chip.

  • Frequency Synthesis: Generating multiplied or divided clock signals.

  • Phase Shifting: Precise management of clock edges for high-speed interfaces.

2. Versatile Memory Hierarchy

To support data-intensive applications, the device features a dual-level memory architecture:

  • Block RAM: Dedicated 4K-bit blocks for implementing efficient FIFOs, large buffers, and dual-port memory structures.

  • Distributed RAM: Utilizing the Look-Up Tables (LUTs) within the CLBs for smaller, flexible storage needs near the logic.

3. Comprehensive I/O Support

The XC2S200-6FGG799C supports a wide array of I/O standards, allowing seamless connectivity with legacy and modern components. Supported standards include:

  • LVTTL / LVCMOS

  • PCI (33 MHz and 66 MHz)

  • GTL / GTL+

  • SSTL (Stub Series Terminated Logic)

  • HSTL (High-Speed Transceiver Logic)


Target Applications for XC2S200-6FGG799C

The combination of 200,000 system gates and the extensive connectivity of the FGG799 package makes this FPGA ideal for a variety of sectors.

Telecommunications and Networking

The device handles protocol translation, packet processing, and interface bridging with ease. Its high I/O count allows for parallel data buses required in networking switches and routers.

Industrial Automation

Reliability is key in industrial settings. The XC2S200-6FGG799C is frequently deployed in Programmable Logic Controllers (PLCs), motor drive control systems, and sensor aggregation hubs where real-time logic execution is critical.

Digital Signal Processing (DSP)

With its efficient carry logic and multiplier support, the Spartan-II architecture is well-suited for DSP tasks such as digital filtering, image enhancement, and audio signal processing.


Advantages of the FGG799 Package

The 799-ball Fine-Pitch BGA package provides distinct advantages over smaller footprints:

  • Superior Thermal Performance: The larger package surface area and ball matrix improve heat dissipation, often reducing the need for aggressive active cooling.

  • Enhanced Signal Integrity: Improved power and ground pin distribution minimizes simultaneous switching noise (SSN) and electromagnetic interference (EMI).

  • PCB Layout Flexibility: The ball assignment allows for more optimized routing on the printed circuit board, reducing layer count in some designs.


Frequently Asked Questions (FAQ)

What is the core voltage requirement?

The XC2S200-6FGG799C operates with a core supply voltage (VCCINT) of 2.5V, while the I/O banks (VCCO) can be powered at 1.5V, 1.8V, 2.5V, or 3.3V depending on the interface standard used.

Does this device support reprogramming?

Yes, as an SRAM-based FPGA, the XC2S200-6FGG799C offers unlimited reprogramming cycles. Configuration data can be loaded via Master Serial, Slave Serial, Slave Parallel, or Boundary Scan (JTAG) modes.

Is the -6 speed grade the fastest option?

For the Spartan-II family, the -6 speed grade represents the highest performance tier available, offering faster clock rates and shorter propagation delays compared to the standard -5 grade.


Conclusion

The XC2S200-6FGG799C stands out as a high-capacity, reliable solution within the Xilinx Spartan-II family. By combining 200,000 gates of logic with the connectivity benefits of the FGG799 package, it provides engineers with the resources needed to tackle complex design challenges. Whether for legacy system maintenance or new cost-optimized designs, this FPGA delivers the performance and flexibility required for success.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.