Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG798C: Versatile Spartan-II FPGA for High-Density Logic Designs

Product Details

The XC2S200-6FGG798C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family, engineered to deliver a cost-effective solution for high-volume applications. By leveraging a reliable 0.22-micron CMOS process, this device provides the perfect balance of logic density and on-chip memory, making it a preferred choice for designers working on budget-constrained yet performance-critical projects.

If you are seeking a programmable logic device that offers flexibility and robust signal integrity, the XC2S200-6FGG798C is designed to meet those challenges. For a broader look at available programmable solutions, you can visit the Xilinx FPGA LINK to explore compatible components.


Technical Specifications of XC2S200-6FGG798C

Designers need precise data to integrate FPGAs effectively. The XC2S200-6FGG798C offers substantial resources for logic implementation, including a rich array of Configurable Logic Blocks (CLBs) and dedicated memory.

Core Architecture and Logic Data

Feature Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total Block RAM 56,320 Bits
Speed Grade -6 (High Performance)
Package Type FGG798 (Fine-Pitch Ball Grid Array)
Core Voltage 2.5V

Key Features of the Spartan-II FGG798C Series

The XC2S200-6FGG798C distinguishes itself with a feature set typically found in more expensive Virtex devices, but optimized for the Spartan price point.

1. Robust Clock Management

Timing is everything in digital circuit design. This FPGA includes four dedicated Delay-Locked Loops (DLLs). These DLLs provide advanced clock management capabilities, including clock de-skewing and frequency multiplication, ensuring that high-speed signals remain synchronized across the chip.

2. Flexible Memory Architecture

The device features a dual-hierarchy memory system:

  • Distributed RAM: Utilizes the Look-Up Tables (LUTs) within the CLBs for small, localized storage.

  • Block RAM: 56K bits of dedicated embedded memory blocks, ideal for creating large buffers, FIFOs, and dual-port memory structures without consuming logic resources.

3. Versatile I/O Support

The XC2S200-6FGG798C supports a wide range of I/O standards, allowing it to interface seamlessly with legacy and modern components. Supported standards include LVTTL, LVCMOS, PCI, GTL+, and SSTL, making it highly adaptable for complex board designs.


Target Applications and Industries

With 200,000 gates and a high-pin-count package, the XC2S200-6FGG798C is capable of handling demanding processing tasks across various sectors.

Industrial Automation and Bridging

In industrial environments, reliability is paramount. This FPGA is frequently used for bus bridging (e.g., PCI interfaces), motor control logic, and sensor data aggregation, where its thermal stability and logic capacity excel.

Consumer Electronics and Networking

The device is well-suited for high-volume consumer products requiring custom logic, such as set-top boxes and residential gateways. Its ability to handle data encryption and protocol translation makes it a valuable asset in networking hardware.


Why Choose the FGG798 Package?

The selection of the FGG798 package offers specific advantages regarding physical implementation and system performance.

Enhanced Signal Integrity and Routing

Benefit Description
High I/O Access The 798-ball footprint allows for extensive user I/O distribution, reducing board congestion.
Thermal Performance The larger package surface area improves heat dissipation, often eliminating the need for active cooling in standard operations.
Ground Stability An optimized ball map ensures solid ground and power connections, reducing electromagnetic interference (EMI).

Frequently Asked Questions (FAQ)

What is the primary voltage requirement for the XC2S200-6FGG798C?

The internal core requires a 2.5V supply (VCCINT). However, the I/O banks are versatile and can operate at voltages ranging from 1.5V to 3.3V depending on the I/O standard selected.

Does the XC2S200-6FGG798C support reprogramming?

Yes, as an SRAM-based FPGA, it allows for unlimited reprogramming. Configuration can be loaded via Master Serial, Slave Serial, or Boundary Scan (JTAG) modes, facilitating easy field upgrades.

Is this device compatible with modern design tools?

The Spartan-II family is supported by legacy versions of Xilinx ISE. Designers should ensure they have the appropriate software environment to compile and bitstream designs for this specific architecture.


Conclusion

The XC2S200-6FGG798C stands as a testament to the enduring utility of the Spartan-II architecture. By providing 200K system gates, advanced memory management, and a high-density FGG798 package, it offers engineers a stable and cost-effective platform for realizing complex digital logic designs. Whether for maintenance of existing systems or new cost-sensitive deployments, this FPGA delivers the performance required to get the job done.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.