The XC2S200-6FGG797C is a high-density member of the Xilinx Spartan-II family, engineered to deliver a robust programmable logic solution for cost-sensitive yet demanding applications. By combining the proven architecture of the Spartan-II series with a high-pin-count FGG797 package, this device offers exceptional I/O flexibility and thermal performance.
As a versatile Field Programmable Gate Array (FPGA), the XC2S200-6FGG797C provides 200,000 system gates, making it an ideal choice for engineers looking to replace ASIC risks with programmable reliability. For a broader look at available solutions, visit the Xilinx FPGA LINK.
Technical Specifications of XC2S200-6FGG797C
Designed for high-volume production, the XC2S200-6FGG797C balances power consumption with processing speed. Its architecture supports complex digital signal processing and high-speed data buffering.
Core Architecture and Performance
| Feature |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total Block RAM |
56,320 Bits |
| Distributed RAM |
75,264 Bits |
| Package Type |
FGG797 (797-pin Fine-Pitch BGA) |
| Speed Grade |
-6 (High Performance) |
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5 V |
| I/O Voltage Support |
1.5V to 3.3V |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Process Technology |
0.18 µm / 0.22 µm CMOS |
Key Features of the XC2S200-6FGG797C
The XC2S200-6FGG797C is distinguished by its specific packaging and robust logic fabric, providing several advantages for system-level integration.
1. Enhanced Package Stability (FGG797)
The 797-pin Fine-Pitch Ball Grid Array (BGA) package offers superior signal integrity compared to smaller footprints. The abundant ground and power pins within the 797-ball matrix reduce ground bounce and improve electromagnetic interference (EMI) performance, which is critical for high-speed designs.
2. Flexible Memory Hierarchy
Designers can utilize the device’s dual-hierarchy memory architecture. The dedicated 56K bits of Block RAM are ideal for implementing efficient FIFOs and buffers, while the distributed RAM within the Look-Up Tables (LUTs) handles shallow memory requirements, ensuring that logic resources are used efficiently.
3. Advanced Clock Management
The device features four dedicated Delay-Locked Loops (DLLs). These DLLs provide zero-propagation-delay clock buffering and precise frequency synthesis, enabling the FPGA to meet strict timing closure requirements in synchronous systems.
Ideal Applications for XC2S200-6FGG797C
With its extensive gate count and high-reliability package, the XC2S200-6FGG797C is suited for a variety of industrial and consumer electronics sectors.
Industrial Automation
The ruggedness of the Spartan-II architecture makes this FPGA perfect for PLC (Programmable Logic Controller) backplanes and motor control drivers where consistent operation over long lifecycles is required.
Communications and Networking
The device supports 16 high-performance I/O standards, including PCI (33/66 MHz), LVDS, and HSTL. This makes it an excellent bridge chip for networking routers and switches that need to manage data flow between different interface protocols.
Digital Signal Processing (DSP)
Capable of running at system speeds up to 200 MHz, the XC2S200-6FGG797C can handle real-time arithmetic tasks, such as digital filtering and image pre-processing in embedded vision systems.
Frequently Asked Questions (FAQ)
What is the advantage of the FGG797 package?
The FGG797 package provides a high number of physical pins, which improves thermal dissipation and signal integrity. It allows for more stable power distribution to the die, which is beneficial for designs operating in electrically noisy environments.
Does the XC2S200-6FGG797C support 3.3V I/O?
Yes, while the internal core operates at 2.5V, the I/O banks are fully configurable to support 3.3V LVTTL and LVCMOS standards, allowing direct interfacing with legacy 3.3V components.
Is this FPGA suitable for new designs?
The Spartan-II series is a mature product line. While excellent for maintaining legacy systems and ensuring long-term availability for existing industrial designs, for brand-new high-performance designs, engineers might also consider newer Xilinx families depending on specific speed requirements.
Conclusion
The XC2S200-6FGG797C stands out as a reliable and cost-effective FPGA solution. By offering 200,000 system gates in a stable FGG797 package, it provides the necessary resources for complex logic integration without the high cost of newer, cutting-edge silicon. Whether for industrial control or legacy system support, this Xilinx FPGA delivers the performance and flexibility needed for successful hardware deployment.
