Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG796C: Advanced Spartan-II FPGA for High-Density Applications

Product Details

The XC2S200-6FGG796C is a distinguished member of the Xilinx Spartan-II family, engineered to deliver a robust combination of programmable logic density and I/O flexibility. Built on a proven 0.18-micron process technology, this Field Programmable Gate Array (FPGA) offers a cost-effective solution for designers who need to integrate complex system functions without the high overhead of custom ASICs.

With its expansive 796-pin package, this device addresses the growing demand for high-connectivity hardware in industrial and communication sectors. For a broader look at available programmable logic solutions, you can visit the Xilinx FPGA LINK.


Technical Specifications of XC2S200-6FGG796C

The XC2S200-6FGG796C is defined by its substantial logic resources and versatile architecture. Below is a detailed breakdown of its key operational parameters.

Core Logic and Performance

Feature Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total Block RAM 56,320 Bits
Speed Grade -6 (High Performance)
Package Type FGG796 (796-ball Fine-Pitch BGA)

Electrical Characteristics

Parameter Value
Core Voltage (VCCINT) 2.5 V
I/O Voltage Support 1.5V to 3.3V
Operating Temperature 0°C to +85°C (Commercial)
Process Technology 0.18 µm / 0.22 µm

Key Features Driving System Integration

The architecture of the XC2S200-6FGG796C is derived from the powerful Virtex series, bringing high-end capabilities to a cost-optimized platform.

1. Superior Clock Management

Timing is critical in high-speed designs. This FPGA incorporates four dedicated Delay-Locked Loops (DLLs), one at each corner of the silicon. These DLLs provide zero-propagation-delay clock buffering and precise frequency synthesis, ensuring that data remains synchronized across the extensive logic fabric.

2. Versatile Memory Hierarchy

To support data-intensive applications, the device features a dual-level memory architecture:

  • Distributed RAM: Implemented within the Configurable Logic Blocks (CLBs) for small, fast scratchpad memory.

  • Block RAM: Dedicated 4K-bit blocks ideal for implementing large buffers, FIFOs, and dual-port memory structures, totaling 56K bits.

3. Comprehensive I/O Standards

The FGG796 package is designed to maximize connectivity. It supports a wide array of I/O standards, making it compatible with legacy and modern peripherals:

  • LVTTL / LVCMOS

  • PCI (33 MHz and 66 MHz)

  • GTL / GTL+

  • SSTL / HSTL (High-speed transceiver logic)


Strategic Advantages of the FGG796 Package

The selection of the 796-pin Fine-Pitch Ball Grid Array (BGA) sets the XC2S200-6FGG796C apart from lower pin-count variants.

High I/O Density for Complex Routing

In systems requiring parallel data buses or extensive sensor interfacing, the increased pin count allows designers to route more signals directly to the FPGA without needing external multiplexers. This reduces board complexity and latency.

Thermal and Signal Integrity

The BGA packaging offers superior thermal performance due to the efficient heat path through the solder balls to the PCB. Additionally, the distribution of power and ground pins within the array helps minimize ground bounce and improves signal integrity for high-frequency operations.


Target Applications

The versatility of the XC2S200-6FGG796C makes it a preferred choice for various demanding industries:

  • Telecommunications: Ideal for protocol conversion, packet switching, and interface bridging where high I/O counts are necessary.

  • Industrial Automation: Used in complex motor controllers and PLCs that require simultaneous monitoring of numerous sensor inputs.

  • Digital Signal Processing: Capable of handling real-time arithmetic functions for audio and video processing pipelines.


Conclusion

The XC2S200-6FGG796C stands as a testament to the longevity and utility of the Spartan-II family. By combining 200,000 system gates with an expansive 796-pin package, it offers the “sweet spot” for engineers requiring significant logic density and massive I/O capabilities. Whether maintaining legacy infrastructure or developing cost-sensitive new products, this FPGA provides the reliability and performance essential for success.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.