The XC2S200-6FGG780C is a high-performance Field-Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. Designed to deliver a cost-effective yet powerful alternative to ASICs, this device offers 200,000 system gates and robust programmable logic capabilities. It is engineered for high-volume applications where versatility and speed are paramount. With its advanced 0.18-micron CMOS process technology, the XC2S200-6FGG780C ensures reliable performance for complex digital designs, ranging from telecommunications to industrial control systems.
This FPGA features a speed grade of -6, offering enhanced timing parameters for demanding high-speed circuits. The “FGG780” designation indicates a high-density, lead-free Fine-Pitch Ball Grid Array (FBGA) package, providing superior signal integrity and thermal management for dense board layouts. Whether you are prototyping a new embedded system or scaling up production, the XC2S200-6FGG780C provides the flexibility and reprogrammability needed to accelerate your time-to-market.
Key Benefits of the Spartan-II XC2S200 Platform
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Cost-Effective Scalability: Offers the programming flexibility of an FPGA at a price point competitive with mask-programmed ASICs, eliminating high NRE costs.
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High Logic Density: Packed with 5,292 logic cells and 200,000 system gates to handle complex state machines and signal processing tasks.
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Advanced Memory Architecture: Features versatile SelectRAM+ capabilities, including both distributed and block RAM, maximizing data throughput.
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Seamless Integration: Supports 16 high-performance I/O standards, ensuring compatibility with a wide range of external devices and buses.
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Reliable Clock Management: Equipped with four Delay-Locked Loops (DLLs) for precise clock deskewing and frequency synthesis.
Technical Specifications for XC2S200-6FGG780C
The following tables outline the critical technical parameters and operating conditions for the XC2S200-6FGG780C.
General Specifications
| Feature |
Specification |
| Part Number |
XC2S200-6FGG780C |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Total CLBs |
1,176 |
| Speed Grade |
-6 (High Performance) |
| Core Voltage |
2.5 V |
| Process Technology |
0.18 µm CMOS |
| Reprogrammability |
Unlimited |
Memory and I/O Configuration
| Parameter |
Value |
| Total Block RAM |
56 Kbits |
| Distributed RAM |
75,264 bits |
| Max User I/O |
Dependent on Package (High Density) |
| I/O Voltage Support |
1.5V, 2.5V, 3.3V |
| Supported I/O Standards |
LVTTL, LVCMOS, GTL, GTL+, SSTL, HSTL, PCI |
| Delay-Locked Loops (DLLs) |
4 |
| Global Clock Networks |
4 Low-Skew Nets |
Operating Conditions
| Condition |
Rating |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Supply Voltage Range |
2.375 V to 2.625 V |
| Junction Temperature (Max) |
+125°C |
| Package Type |
FGG780 (Lead-Free FBGA) |
Advanced Features of the XC2S200-6FGG780C
Flexible Configurable Logic Blocks (CLBs)
At the heart of the XC2S200-6FGG780C lies a flexible CLB architecture. Each CLB contains four logic cells, organized in two slices. This structure allows for efficient implementation of logic functions, arithmetic operations, and distributed memory storage. The dedicated carry logic enhances the performance of arithmetic functions such as adders, counters, and comparators, making this device highly suitable for digital signal processing (DSP) applications.
Superior Clock Management
Timing is critical in high-speed digital designs. The XC2S200-6FGG780C includes four digital Delay-Locked Loops (DLLs), located at each corner of the die. These DLLs provide zero-propagation-delay clock buffering and precise phase shifting. This ensures that clock signals are distributed evenly across the chip, minimizing skew and enabling system clock rates up to 200 MHz. This level of control is essential for synchronizing data transfer in complex communication protocols.
Robust I/O Versatility
The input/output blocks (IOBs) of the XC2S200-6FGG780C are individually programmable, supporting a wide array of interface standards. Designers can configure each I/O pin to comply with standards such as LVTTL, PCI, and GTL+, allowing the FPGA to interface directly with high-speed memory, processors, and other peripherals without the need for external level shifters. This versatility significantly reduces board complexity and bill of materials (BOM) costs.
Why Choose the XC2S200-6FGG780C?
Choosing the XC2S200-6FGG780C means investing in a proven, reliable solution for your logic integration needs. Its balance of logic density, memory capacity, and I/O flexibility makes it a “Swiss Army knife” for electronics design. Whether you are developing legacy system upgrades or innovative new products, this Spartan-II device delivers the performance you need with the low power consumption and affordability that the series is famous for.
For more information on sourcing and integrating this powerful component into your next project, explore our comprehensive Xilinx FPGA solutions. We specialize in providing high-quality programmable logic devices to meet your specific design requirements.
Application Areas
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Industrial Automation: Programmable Logic Controllers (PLCs) and motor control systems.
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Telecommunications: Protocol bridging, packet processing, and interface aggregation.
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Consumer Electronics: Video image processing and custom display controllers.
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Automotive: Infotainment systems and gateway controllers.
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Medical Devices: Portable diagnostic equipment and real-time monitoring systems.
