The XC2S200-6FGG776C is a high-performance Field-Programmable Gate Array (FPGA) from the esteemed Xilinx Spartan-II family. Designed to deliver a robust combination of programmability and cost-efficiency, this device is engineered for high-volume applications where logic density and on-chip memory are critical. With 200,000 system gates and a versatile architecture, the XC2S200-6FGG776C serves as a superior alternative to traditional ASICs, offering unlimited reprogrammability without the risks associated with mask-programmed solutions.
This specific model features the “-6” speed grade, indicating its capability for higher performance logic execution compared to standard variants. Ideally suited for telecommunications, consumer electronics, and industrial control systems, the XC2S200-6FGG776C leverages advanced 0.18-micron process technology to ensure low power consumption while maintaining high-speed signal processing capabilities.
Key Architectural Features
High-Density Logic and Memory
At the core of the XC2S200-6FGG776C lies a highly flexible Configurable Logic Block (CLB) architecture. This device provides 5,292 logic cells, enabling the implementation of complex digital functions ranging from simple glue logic to sophisticated data processing algorithms. Additionally, the device integrates significant memory resources, including 56 Kbits of dedicated Block RAM and over 75 Kbits of distributed RAM, facilitating efficient data buffering and storage within the fabric.
Advanced Clock Management
To ensure reliable system timing, the XC2S200-6FGG776C is equipped with four dedicated Delay-Locked Loops (DLLs). These DLLs provide advanced clock control features such as clock deskewing, frequency synthesis, and phase shifting. This allows designers to implement high-speed interfaces and synchronize internal logic with external system clocks effectively, supporting system performance up to 200 MHz and beyond.
Technical Specifications
The following table outlines the primary technical characteristics of the XC2S200-6FGG776C, highlighting its capacity and operational parameters.
Device Capacity and Performance
| Feature |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array (R x C) |
28 x 42 |
| Total CLBs |
1,176 |
| Speed Grade |
-6 (High Performance) |
| Max Operating Frequency |
> 200 MHz |
Memory and I/O Capabilities
| Feature |
Specification |
| Block RAM |
56 Kbits |
| Distributed RAM |
75,264 bits |
| Max User I/O |
284 (Device Dependent) |
| I/O Voltage Support |
1.5V, 2.5V, 3.3V |
| Core Voltage |
2.5V |
| Package Type |
FGG776C (Fine-Pitch BGA) |
Advantages of the Spartan-II Architecture
Streamlined Design Integration
The XC2S200-6FGG776C streamlines the design process by offering full compliance with PCI standards and supporting over 16 high-performance interface standards, including LVTTL, LVCMOS, and GTL+. This versatility simplifies connectivity with legacy systems and modern high-speed peripherals alike. Furthermore, the device supports zero-hold-time specifications, which significantly eases the timing closure process during development.
Cost-Effective Scalability
As part of the Spartan-II series, this FPGA is optimized for cost-sensitive projects. It achieves a balance between logic capability and price, making it an attractive option for large-scale production runs. The “FGG” package designation implies a Fine-Pitch Ball Grid Array with eco-friendly lead-free composition, ensuring compliance with global environmental standards like RoHS, while the “776” footprint offers high-density connectivity options for complex board layouts.
Reliable Configuration and Support
The device supports multiple configuration modes, including Slave Serial, Master Serial, and Boundary Scan (JTAG), providing flexibility in how the FPGA is programmed in the system. Supported by industry-standard development tools, the XC2S200-6FGG776C allows for rapid prototyping and seamless transition to production, ensuring fast time-to-market for your innovative designs.
