The XC2S200-6FGG770C represents a powerful field-programmable gate array solution from Xilinx’s proven Spartan-II family, delivering exceptional performance in a compact 770-ball fine-pitch BGA package. This commercial-grade device combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal choice for high-volume applications requiring flexibility and cost-effectiveness.

Overview of XC2S200-6FGG770C FPGA

The XC2S200-6FGG770C is a member of the Spartan-II 2.5V FPGA family, engineered to provide designers with abundant logic resources, high system performance, and a comprehensive feature set at an exceptionally competitive price point. As a superior alternative to mask-programmed ASICs, this programmable logic device eliminates initial tooling costs, lengthy development cycles, and the inherent risks associated with traditional ASIC designs.

Key Features and Specifications

Understanding the FGG770 Package Configuration

What Makes the 770-Ball BGA Package Special?

The FGG770 package (Fine-Pitch Ball Grid Array with 770 balls) offers several significant advantages for professional electronic designs:

• High Pin Density: 770 solder ball connections provide extensive I/O capability
• Compact Footprint: Near-chip-scale package size optimizes PCB real estate
• Superior Thermal Performance: Direct substrate contact enables efficient heat dissipation
• Enhanced Signal Integrity: Shorter interconnect paths reduce inductance and improve high-speed performance
• Professional Assembly: Designed for automated reflow soldering processes

The “G” suffix in FGG770 indicates compatibility with lead-free (Pb-free) manufacturing processes, meeting modern environmental compliance standards.

Technical Architecture and Capabilities

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG770C features a robust array of 1,176 configurable logic blocks arranged in a 28 x 42 matrix. Each CLB contains:

• Four logic cells with flexible combinatorial and sequential logic functions
• Dedicated fast carry logic for arithmetic operations
• Distributed RAM capability for efficient data storage
• Support for shift register implementations

Memory Resources

Input/Output Capabilities

With 284 maximum user I/O pins, the XC2S200-6FGG770C supports:

• Multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL)
• Programmable drive strength and slew rate control
• Individual input/output buffer configuration
• Support for differential signaling standards

Delay-Locked Loops (DLLs)

Four integrated DLLs positioned at each corner of the die provide:

• Precise clock distribution and management
• Clock multiplication and division capabilities
• Duty cycle correction
• Phase shifting for timing optimization

Performance Specifications

Speed Grade -6 Advantages

The -6 speed grade represents the highest performance tier in the Spartan-II family, exclusively available for commercial temperature applications. This grade delivers:

• Minimum propagation delays for critical path optimization
• Maximum operating frequencies up to 200 MHz
• Enhanced setup and hold time margins
• Superior performance for timing-critical designs

Application Performance Metrics

Applications and Use Cases

Industrial Control Systems

The XC2S200-6FGG770C excels in industrial automation applications:

• Motor control and drive systems
• PLC (Programmable Logic Controller) implementations
• Real-time data acquisition and processing
• Industrial communication protocol bridges

Communication Infrastructure

Ideal for networking and telecommunications:

• Protocol conversion and packet processing
• Software-defined radio (SDR) components
• Digital signal processing applications
• Interface bridging between multiple standards

Consumer Electronics

Perfect for high-volume consumer products:

• Digital video processing and transformation
• Audio processing and effects
• Image processing pipelines
• Display controller implementations

Embedded System Development

Widely deployed in embedded applications:

• Custom peripheral interfaces
• Hardware acceleration modules
• System-on-chip (SoC) prototyping
• ASIC emulation and verification

Design and Development Advantages

ASIC Alternative Benefits

Choosing the XC2S200-6FGG770C over traditional ASICs provides:

1. Eliminated NRE Costs: No mask charges or minimum order quantities
2. Rapid Prototyping: Immediate implementation and testing cycles
3. Field Upgradability: In-system reprogrammability for feature updates
4. Risk Mitigation: Design modifications without hardware respins
5. Time-to-Market: Faster product launches with iterative development

Development Tool Support

The device integrates seamlessly with Xilinx development tools:

• ISE Design Suite for synthesis and implementation
• ChipScope Pro for in-system debugging
• CoreGen for IP core integration
• FPGA Editor for advanced placement optimization

Package and Assembly Considerations

FGG770 Physical Characteristics

Understanding the package specifications is crucial for PCB design:

• Ball Pitch: Fine-pitch solder ball spacing for high-density routing
• Package Height: Low-profile design for space-constrained applications
• Thermal Pad: Optional exposed die pad for enhanced heat dissipation
• Footprint: Standardized land pattern for manufacturing consistency

PCB Design Guidelines

When designing with the XC2S200-6FGG770C:

1. Layer Stack-Up: Multi-layer PCBs required for proper signal routing
2. Via-in-Pad: Often necessary for inner ball connections
3. Thermal Management: Consider heat sink or thermal via requirements
4. Signal Integrity: Controlled impedance traces for high-speed signals
5. Power Distribution: Adequate decoupling capacitor placement

Assembly Recommendations

Professional assembly processes ensure reliability:

• Automated pick-and-place equipment required
• Reflow soldering with controlled temperature profiles
• X-ray inspection for solder ball verification
• Comprehensive electrical testing post-assembly

Ordering and Availability Information

Part Number Breakdown

XC2S200-6FGG770C decoding:

• XC2S200: Device family and gate count
• -6: Speed grade (highest performance)
• FGG770: Package type (770-ball Fine-Pitch BGA)
• C: Commercial temperature range (0°C to +85°C)

Alternative Packages in XC2S200 Series

Comparison with Spartan-II Family Members

Family Position

The XC2S200-6FGG770C represents the flagship device in the Spartan-II family, offering maximum logic density and I/O capabilities.

Quality and Reliability Standards

Manufacturing Excellence

Xilinx devices undergo rigorous quality assurance:

• Comprehensive electrical parameter testing
• Temperature cycling and thermal shock testing
• Humidity resistance evaluation
• Long-term reliability qualification
• Industry-standard MTBF ratings

Compliance and Certifications

The XC2S200-6FGG770C meets international standards:

• RoHS compliant (Pb-free option with “G” designation)
• REACH regulation conformity
• ISO 9001 manufacturing processes
• Automotive quality standards (where applicable)

Support and Documentation Resources

Technical Documentation

Comprehensive resources available:

• Complete datasheet with electrical specifications
• Package mechanical drawings and dimensions
• PCB design guidelines and reference layouts
• Application notes for common implementations
• Migration guides from other FPGA families

Community and Technical Support

Access extensive support networks:

• Xilinx technical support and FAQs
• Community forums and design examples
• University program resources
• Third-party IP core libraries
• Reference designs and starter projects

Why Choose the XC2S200-6FGG770C?

Ideal Selection Criteria

This FPGA is the optimal choice when you need:

• High Logic Density: 200,000 gates for complex designs
• Maximum I/O Count: 284 pins for extensive connectivity
• Best Performance: -6 speed grade for timing-critical applications
• Compact Package: 770-ball BGA for space efficiency
• Proven Technology: Mature Spartan-II architecture with extensive design heritage
• Cost-Effectiveness: Competitive pricing for high-volume production

Competitive Advantages

The XC2S200-6FGG770C delivers:

1. Performance-to-Cost Ratio: Industry-leading value proposition
2. Design Security: Configuration memory encryption options
3. Low Power Consumption: Efficient 2.5V operation
4. Scalability: Easy migration within Spartan-II family
5. Legacy Support: Long-term product availability

Getting Started with XC2S200-6FGG770C

Development Kit Options

Accelerate your design process:

• Evaluation boards with XC2S200 devices
• Pre-configured reference designs
• Complete HDL code examples
• Demonstration applications

Design Flow Overview

Streamlined development process:

1. Design Entry: Verilog, VHDL, or schematic capture
2. Synthesis: Logic optimization and technology mapping
3. Implementation: Place and route with timing analysis
4. Verification: Simulation and timing verification
5. Configuration: Bitstream generation and device programming

Learn More About Xilinx FPGA Solutions

For comprehensive information about Xilinx FPGA product families, development tools, design resources, and application examples, explore our complete Xilinx FPGA technology guide.

Conclusion

The XC2S200-6FGG770C delivers an exceptional combination of logic density, I/O capability, and performance in the industry-standard 770-ball fine-pitch BGA package. As the flagship device in the Spartan-II family, it provides designers with 200,000 system gates, 284 user I/O pins, and the highest -6 speed grade for demanding applications.

Whether you’re developing industrial control systems, communications infrastructure, consumer electronics, or embedded solutions, the XC2S200-6FGG770C offers the programmable flexibility of an FPGA with performance approaching that of ASICs—all while eliminating the risks and costs associated with custom silicon development.

With proven reliability, comprehensive development tool support, and competitive pricing for volume production, the XC2S200-6FGG770C represents an intelligent choice for engineers seeking a powerful, flexible programmable logic solution.