The XC2S200-6FGG768C represents a powerful solution in the Spartan-II FPGA family, engineered to deliver exceptional programmable logic capabilities for demanding embedded system applications. This industrial-grade field-programmable gate array combines 200,000 system gates with advanced packaging technology, making it ideal for telecommunications, automotive electronics, industrial automation, and complex digital signal processing applications.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
768 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Speed Grade |
-6 (highest performance) |
| Operating Voltage |
2.5V |
| Technology Node |
0.18μm |
Package Specifications
| Package Feature |
Details |
| Package Type |
FGG768 (Fine-Pitch Ball Grid Array) |
| Total Pin Count |
768 pins |
| Package Technology |
Lead-free compatible (RoHS) |
| Ball Pitch |
1.0mm fine-pitch |
| Temperature Range |
Commercial (0°C to +85°C) |
Advanced Performance Capabilities
High-Speed Digital Design
The XC2S200-6FGG768C achieves system clock frequencies up to 200 MHz, enabling high-throughput data processing for communications infrastructure and real-time control systems. The -6 speed grade designation ensures maximum performance across all operating conditions, making this FPGA suitable for timing-critical applications.
Extensive I/O Resources
With 768 user-configurable I/O pins, this device provides unparalleled connectivity options. The generous pin count supports multiple communication protocols simultaneously, including:
- High-speed serial interfaces
- Parallel data buses
- Memory controller interfaces
- Custom peripheral connections
Flexible Memory Architecture
The dual-memory configuration combines distributed RAM and dedicated block RAM resources:
Distributed RAM Benefits:
- 75,264 bits of flexible embedded memory
- Integrated within CLBs for low-latency access
- Ideal for small buffers and lookup tables
Block RAM Advantages:
- 56K bits of high-density storage
- Optimized for large data buffers
- Efficient FIFO and frame buffer implementation
Application Areas
Telecommunications Equipment
The XC2S200-6FGG768C excels in telecommunications applications requiring high I/O density and processing power. Network switching equipment, wireless base stations, and protocol converters benefit from the extensive pin count and high-speed capabilities.
Industrial Control Systems
Industrial automation systems leverage this FPGA for:
- Multi-axis motion control
- Real-time data acquisition
- Factory automation protocols
- Sensor fusion applications
Automotive Electronics
The robust commercial temperature range and high reliability make this device suitable for:
- Advanced driver assistance systems (ADAS)
- In-vehicle networking
- Engine control modules
- Infotainment processing
Medical Instrumentation
Medical device manufacturers utilize the XC2S200-6FGG768C for:
- Diagnostic imaging systems
- Patient monitoring equipment
- Laboratory analysis instruments
- Therapeutic device controllers
Design and Development Advantages
Comprehensive Tool Support
Engineers developing with the XC2S200-6FGG768C benefit from industry-standard FPGA design tools. The device integrates seamlessly with synthesis, simulation, and implementation software, accelerating time-to-market for complex designs.
PCB Design Considerations
The 768-pin FGG package requires careful PCB layout planning:
| Design Parameter |
Recommendation |
| Layer Count |
8-12 layers recommended |
| Via Technology |
Microvias for inner pin access |
| Trace Width |
Fine-pitch routing (4-5 mil) |
| Power Plane Strategy |
Multiple power/ground planes |
| Thermal Management |
Thermal vias and heatsink provision |
Migration Path
The Spartan-II family offers vertical migration capability within the same package footprint, allowing designers to scale logic resources without board redesign. This flexibility reduces development risk and enables design reuse across product lines.
Power Management Features
The XC2S200-6FGG768C incorporates several power optimization features:
- Low-voltage 2.5V core operation
- Selective I/O voltage banking
- Dynamic power management capabilities
- Efficient clock distribution networks
Quality and Reliability
Manufacturing Standards
This FPGA adheres to stringent manufacturing protocols:
- RoHS Compliant: Lead-free packaging option available
- Industrial Quality: Extended temperature screening
- Reliability Testing: JEDEC-standard qualification
- ESD Protection: Built-in protection circuitry
Long-Term Availability
As part of the established Spartan-II family, the XC2S200-6FGG768C benefits from long-term production commitments, ensuring component availability for products with extended lifecycles.
Comparison with Alternative Packages
| Feature |
FGG768 |
FGG456 |
PQ208 |
| Pin Count |
768 |
456 |
208 |
| User I/O |
Maximum |
High |
Moderate |
| Package Size |
Largest |
Medium |
Smallest |
| Routing Complexity |
Highest |
Medium |
Lowest |
| Application Fit |
Complex systems |
Balanced designs |
Cost-sensitive |
Implementation Best Practices
Clock Distribution Strategy
Effective clock network design maximizes the XC2S200-6FGG768C performance:
- Utilize dedicated global clock buffers
- Implement proper clock domain crossing techniques
- Apply timing constraints accurately
- Minimize clock skew through balanced routing
I/O Planning Guidelines
Optimize I/O utilization through strategic pin assignment:
- Group related signals by I/O bank
- Minimize cross-talk on high-speed signals
- Match differential pair routing lengths
- Consider signal integrity in placement
Support and Documentation
Comprehensive technical resources support XC2S200-6FGG768C implementation:
- Detailed datasheets with electrical specifications
- Application notes for specific design challenges
- Reference designs for common applications
- Packaging and handling guidelines
Ordering Information
The XC2S200-6FGG768C part number breaks down as follows:
- XC2S200: Device family and gate count
- -6: Speed grade (highest performance)
- FG: Fine-pitch Ball Grid Array package
- G768: Lead-free compatible, 768-pin configuration
- C: Commercial temperature range (0°C to +85°C)
Why Choose the XC2S200-6FGG768C
This FPGA delivers the optimal combination of:
✓ Maximum I/O Density: 768 pins for extensive system connectivity ✓ High Performance: -6 speed grade for demanding applications ✓ Proven Architecture: Mature Spartan-II technology with broad support ✓ Design Flexibility: Extensive logic and memory resources ✓ Cost-Effective Solution: Competitive pricing for high-pin-count FPGAs
For engineers requiring maximum I/O count combined with robust logic capabilities, the XC2S200-6FGG768C provides an excellent platform for complex digital system implementation. Whether developing next-generation telecommunications equipment, advanced industrial controllers, or sophisticated automotive systems, this FPGA offers the resources and performance needed for successful product development.
Related FPGA Solutions
Explore additional programmable logic options from the Xilinx FPGA product portfolio to find the perfect device for your specific application requirements. The comprehensive Xilinx FPGA family offers solutions ranging from low-cost, low-power devices to high-performance FPGAs with advanced features.
