The XC2S200-6FGG765C represents a powerful member of AMD Xilinx’s Spartan-II FPGA family, engineered to deliver exceptional programmable logic performance for cost-sensitive applications. This field programmable gate array combines 200,000 system gates with 5,292 logic cells in a robust Fine-Pitch Ball Grid Array package, making it an ideal solution for telecommunications, industrial automation, and embedded systems design.
As part of the proven Spartan-II architecture, the XC2S200-6FGG765C offers designers a flexible platform that eliminates the lengthy development cycles and high initial costs associated with traditional ASIC designs. The device’s in-field programmability allows for design upgrades and modifications without hardware replacement, providing unprecedented flexibility throughout your product lifecycle.
Key Technical Specifications
Core Performance Characteristics
| Specification |
Value |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum Clock Frequency |
263 MHz |
| Process Technology |
0.18μm CMOS |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Commercial) |
| Operating Temperature |
0°C to +85°C |
Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,320 bits) |
| Total Memory Bits |
131,584 bits |
Input/Output Capabilities
| I/O Feature |
Specification |
| Maximum User I/O Pins |
284 pins |
| Package Type |
Fine-Pitch Ball Grid Array (FGG) |
| Total Ball Count |
765 balls |
| I/O Standard Support |
Multiple voltage standards |
| Global Clock Inputs |
4 dedicated pins |
Advanced Architecture Features
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG765C incorporates 1,176 configurable logic blocks arranged in an efficient 28 x 42 array. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that enable complex combinational and sequential logic implementation. This architecture provides optimal balance between logic density and routing flexibility.
Block RAM Implementation
With 56K bits of dedicated block RAM, the XC2S200-6FGG765C supports high-speed data buffering, FIFO implementations, and embedded memory applications. The block RAM modules are strategically positioned across the die to minimize routing delays and maximize performance.
Delay-Locked Loop (DLL) Technology
Four integrated DLLs, positioned at each corner of the die, provide precise clock management and distribution. These DLLs enable:
- Clock de-skewing and multiplication
- Precise phase shifting
- Low-jitter clock distribution
- Multiple clock domain management
Package Information and Physical Characteristics
FGG765 Package Details
The Fine-Pitch Ball Grid Array package offers superior thermal performance and electrical characteristics:
- Package Code: FGG765
- Ball Pitch: Fine-pitch for high-density routing
- Thermal Performance: Enhanced heat dissipation capabilities
- Mounting: Surface mount technology compatible
- Industry Standard: RoHS compliant options available
Pin Configuration Benefits
The 765-ball configuration provides:
- High pin count for extensive I/O requirements
- Optimized signal integrity through controlled impedance
- Power and ground distribution for stable operation
- Dedicated configuration and programming pins
Application Areas and Use Cases
Telecommunications and Networking
The XC2S200-6FGG765C excels in communication systems where protocol implementation, data encoding/decoding, and channel coding are critical. Its 263 MHz clock capability supports high-speed data processing requirements in:
- Network routers and switches
- Protocol converters
- Data transmission equipment
- Wireless communication modules
Industrial Control Systems
Industrial automation benefits from the FPGA’s reliability and reconfigurability:
- Motor control and drive systems
- Process control automation
- PLC (Programmable Logic Controller) applications
- Sensor interface and data acquisition
Digital Signal Processing
With distributed and block RAM resources, the device handles DSP applications including:
- Audio processing and filtering
- Image processing algorithms
- Video codec implementation
- Real-time signal analysis
Consumer Electronics
The cost-effective Spartan-II architecture makes it suitable for:
- Set-top boxes
- Digital displays and controllers
- Gaming peripherals
- Multimedia processing devices
Configuration and Programming
Supported Configuration Modes
| Configuration Mode |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
Output |
1-bit |
Yes |
| Slave Serial |
Input |
1-bit |
Yes |
| Slave Parallel |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
No |
Configuration Memory Requirements
- Total Configuration Bits: 1,335,840 bits
- Programming Interface: JTAG and dedicated programming modes
- In-System Programming: Full support for field updates
Design Advantages
Cost-Effective Solution
Compared to traditional ASICs, the XC2S200-6FGG765C offers:
- Zero NRE (Non-Recurring Engineering) costs
- Rapid prototyping and time-to-market
- Lower initial investment requirements
- Volume pricing advantages
Flexibility and Scalability
The programmable nature provides:
- Field upgradeable designs
- Feature additions post-deployment
- Bug fixes without hardware changes
- Product differentiation through software
Development Tool Support
Compatible with industry-standard Xilinx development tools:
- ISE Design Suite support
- Schematic and HDL entry options
- Comprehensive simulation capabilities
- Timing analysis and optimization tools
Power Consumption Considerations
Voltage Requirements
| Supply Rail |
Voltage |
Purpose |
| VCCINT |
2.5V |
Core logic power |
| VCCO |
1.5V – 3.3V |
I/O bank power (varies by standard) |
Power Management Features
- Low static power consumption
- Dynamic power scaling based on utilization
- Power-down modes for inactive logic
- Efficient clock gating capabilities
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG765C is manufactured using proven 0.18μm CMOS technology, ensuring:
- High yield and reliability
- Consistent performance across production lots
- Extended operational lifetime
- Comprehensive quality testing
Temperature Specifications
- Commercial Grade (-6): 0°C to +85°C junction temperature
- Qualification: JEDEC standards compliant
- Thermal Resistance: Package-dependent θJA specifications
Comparison with Related Devices
Within Spartan-II Family
| Device |
System Gates |
Logic Cells |
CLBs |
Max I/O |
| XC2S100 |
100,000 |
2,700 |
600 |
176 |
| XC2S150 |
150,000 |
3,888 |
864 |
260 |
| XC2S200 |
200,000 |
5,292 |
1,176 |
284 |
Speed Grade Options
The -6 speed grade offers optimal performance for commercial applications, with timing specifications suitable for most high-speed digital designs operating up to 263 MHz.
Design Resources and Support
Documentation Availability
Engineers working with the XC2S200-6FGG765C have access to:
- Complete family datasheets
- Application notes and reference designs
- PCB layout guidelines
- Thermal management documentation
Technical Support Channels
AMD Xilinx provides comprehensive support through:
- Online knowledge base and forums
- Technical application engineers
- Design consultation services
- Training and certification programs
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG765C
- XC2S200: Device type (Spartan-II, 200K gates)
- 6: Speed grade (commercial)
- FGG: Package type (Fine-Pitch BGA)
- 765: Ball count
- C: Commercial temperature range
Package Marking
Standard package marking includes:
- Device identification
- Speed grade indicator
- Date code and lot traceability
- Country of origin
Why Choose XC2S200-6FGG765C?
Proven Technology Platform
The Spartan-II family has established itself as a reliable choice for millions of deployed systems worldwide. The XC2S200-6FGG765C continues this legacy with:
- Mature, well-characterized technology
- Extensive third-party IP core compatibility
- Large user community and knowledge base
- Long-term product availability
Optimal Balance
This device strikes an ideal balance between:
- Performance: 263 MHz operation for demanding applications
- Capacity: 200K gates sufficient for complex designs
- I/O Count: 284 pins for extensive interfacing
- Cost: Competitive pricing for volume production
Migration Path
Designers can easily migrate between Spartan-II family members or upgrade to newer Xilinx FPGA families as project requirements evolve, protecting development investment.
Integration Guidelines
PCB Layout Recommendations
For optimal performance:
- Maintain clean power distribution with adequate decoupling
- Follow controlled impedance routing for high-speed signals
- Provide thermal relief for power and ground connections
- Allow sufficient clearance for ball grid array inspection
Schematic Design Considerations
- Proper termination of unused I/O pins
- Configuration pin pull-up/pull-down requirements
- Power sequencing guidelines
- Clock distribution best practices
Conclusion
The XC2S200-6FGG765C Field Programmable Gate Array delivers enterprise-class programmable logic performance in a cost-effective package. With 200,000 system gates, 5,292 logic cells, and 284 I/O pins, this Spartan-II device provides the resources needed for sophisticated digital designs across telecommunications, industrial, consumer, and automotive applications.
Its combination of proven architecture, comprehensive development tool support, and flexible configuration options makes the XC2S200-6FGG765C an excellent choice for engineers seeking reliable, high-performance programmable logic solutions. Whether you’re developing next-generation communication equipment, advanced industrial controllers, or innovative consumer products, this FPGA provides the performance and flexibility to bring your designs to market quickly and cost-effectively.
For detailed technical specifications, reference designs, and ordering information, consult the official AMD Xilinx documentation and authorized distributors.
