The XC2S200-6FGG764C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This programmable logic device delivers exceptional performance with 200,000 system gates and 5,292 configurable logic cells, making it an ideal solution for complex digital designs, embedded systems, and industrial control applications.
Manufactured using advanced 0.18µm CMOS technology, the XC2S200-6FGG764C FPGA operates at a core voltage of 2.5V and features the high-speed -6 speed grade for commercial temperature applications. The 764-ball Fine-pitch Ball Grid Array (FBGA) package provides maximum I/O density and thermal performance for demanding applications.
Key Specifications and Features
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG764C |
| Manufacturer |
AMD Xilinx |
| Product Family |
Spartan-II FPGA |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array |
28 x 42 (1,176 CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,336 bits) |
| Maximum User I/O |
Up to 284 pins |
| Speed Grade |
-6 (Commercial) |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm CMOS |
| Package Type |
FGG764 (764-ball FBGA) |
| Operating Frequency |
Up to 263 MHz |
| Temperature Range |
Commercial (0°C to +85°C) |
Performance Characteristics
| Feature |
Value |
| Configurable Logic Blocks |
1,176 CLBs |
| Total Distributed RAM |
75,264 bits |
| Block RAM Modules |
Multiple 4K-bit blocks |
| DLL (Delay-Locked Loops) |
4 DLLs for clock management |
| I/O Standards Support |
Multiple standards including LVTTL, LVCMOS, PCI |
| Maximum Toggle Rate |
263 MHz |
Architecture and Design Features
Configurable Logic Block (CLB) Architecture
The XC2S200-6FGG764C features an extensive array of 1,176 Configurable Logic Blocks arranged in a 28 x 42 matrix. Each CLB contains:
- Four logic slices with look-up tables (LUTs)
- Flip-flops and multiplexers for sequential logic
- Dedicated carry logic for arithmetic operations
- Distributed RAM capability for embedded memory functions
Memory Resources
Distributed RAM
The FPGA provides 75,264 bits of distributed RAM integrated within the CLB fabric, enabling flexible memory implementations for:
- Small buffers and FIFOs
- Lookup tables
- Shift registers
- Temporary data storage
Block RAM
With 56K bits of dedicated block RAM, the XC2S200-6FGG764C supports:
- Large data buffers
- High-speed memory interfaces
- Packet buffers for communications
- Video frame buffers
Clock Management System
Delay-Locked Loop (DLL) Features
Four DLLs positioned at each corner of the die provide:
- Clock deskewing for board-level synchronization
- Clock frequency synthesis and division
- Phase shifting capabilities
- Duty cycle correction for precise timing control
Package Information: FGG764
FGG764 Package Advantages
The 764-ball Fine-pitch Ball Grid Array (FBGA) package offers several benefits:
| Advantage |
Description |
| High I/O Density |
Maximum pin count for complex interfacing |
| Thermal Performance |
Excellent heat dissipation through ball grid |
| Compact Footprint |
Space-efficient design for dense PCB layouts |
| Signal Integrity |
Shorter bond wires reduce parasitic effects |
| Manufacturing |
Automated assembly-friendly design |
| Reliability |
Robust mechanical and electrical connections |
Package Physical Dimensions
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Total Balls: 764 balls
- Pitch: Fine-pitch spacing for high density
- Mounting: Surface mount technology (SMT)
- RoHS Compliance: Available in lead-free (FGG designation)
Application Areas
Industrial Automation and Control
The XC2S200-6FGG764C excels in industrial environments:
- Motor control systems
- Process automation
- Programmable logic controllers (PLCs)
- Sensor data acquisition
- Real-time monitoring systems
Communications and Networking
Ideal for communication infrastructure:
- Protocol converters
- Network routers and switches
- Data encryption engines
- Communication interfaces (UART, SPI, I2C)
- Signal processing applications
Medical Electronics
Healthcare applications benefit from:
- Diagnostic equipment control
- Patient monitoring devices
- Medical imaging systems
- Laboratory instrumentation
- Portable medical devices
Consumer Electronics
Perfect for consumer products:
- Digital video processing
- Audio signal processing
- Display controllers
- Gaming peripherals
- IoT edge devices
Aerospace and Defense
Trusted for critical systems:
- Avionics control systems
- Navigation equipment
- Communication systems
- Data acquisition modules
- Test and measurement instruments
Design Advantages Over ASIC Solutions
Cost-Effective Development
| FPGA Advantage |
Benefit |
| No NRE Costs |
Eliminate expensive mask costs |
| Rapid Prototyping |
Quick design iterations |
| Lower Initial Investment |
Reduce upfront development costs |
| Volume Flexibility |
Suitable for low to medium volumes |
Design Flexibility
- In-field reprogramming enables design updates
- No hardware changes required for functionality updates
- Risk mitigation compared to fixed-function ASICs
- Future-proof designs adaptable to changing requirements
Time-to-Market Benefits
- Immediate availability without foundry wait times
- Quick design modifications and bug fixes
- Parallel hardware-software development
- Reduced overall development cycle
Development Tools and Software Support
ISE Design Suite Compatibility
The XC2S200-6FGG764C is supported by Xilinx ISE (Integrated Software Environment):
- Schematic and HDL entry
- VHDL and Verilog synthesis
- Place and route optimization
- Timing analysis and simulation
- Bitstream generation
Programming Options
Multiple configuration modes supported:
- Master Serial Mode: PROM-based configuration
- Slave Serial Mode: External controller programming
- Slave Parallel Mode: Fast configuration interface
- JTAG Boundary Scan: Debug and programming
Electrical Characteristics
Power Supply Requirements
| Supply Rail |
Voltage |
Function |
| VCCINT |
2.5V |
Core logic supply |
| VCCO |
1.5V – 3.3V |
I/O bank supply (per bank) |
| VCCAUX |
2.5V |
Auxiliary circuitry |
Power Consumption
- Low static power consumption
- Dynamic power scales with design utilization
- Power optimization through design techniques
- Multiple power domains for efficient operation
I/O Capabilities and Standards
Supported I/O Standards
The XC2S200-6FGG764C supports numerous I/O standards:
- LVTTL (Low-Voltage TTL)
- LVCMOS (1.5V, 1.8V, 2.5V, 3.3V)
- PCI 33/66 MHz
- GTL and GTL+
- SSTL (Stub Series Terminated Logic)
- HSTL (High-Speed Transceiver Logic)
I/O Features
- Programmable slew rates for signal integrity control
- Programmable pull-up/pull-down resistors
- Three-state outputs for bus applications
- Differential signaling support
- Hot-swappable I/O capability
Quality and Reliability
Manufacturing Standards
- ISO 9001 certified manufacturing
- Rigorous quality control processes
- Automotive-grade options available
- Extended temperature range variants
Reliability Features
- Unlimited reprogramming cycles
- SEU (Single Event Upset) immunity in configuration
- Built-in self-test capabilities
- JTAG boundary scan for testing
- Long-term availability commitment
Competitive Advantages
Why Choose XC2S200-6FGG764C
- Proven Spartan-II Architecture: Battle-tested design used in millions of applications worldwide
- Cost-Performance Balance: Optimal price point for 200K gate designs
- Extensive I/O Options: FGG764 package maximizes connectivity
- Mature Toolchain: Well-supported development environment
- Supply Chain Stability: Established product with reliable availability
Integration and Design Guidelines
PCB Layout Considerations
- Adequate power plane design for 2.5V core
- Decoupling capacitors near power pins
- Controlled impedance for high-speed signals
- Thermal management for FBGA package
- Ground plane continuity
Design Best Practices
- Utilize hierarchical design methodology
- Implement proper clock domain crossing
- Apply timing constraints early
- Use block RAM efficiently
- Optimize logic utilization
Related Products and Alternatives
Spartan-II Family Members
For projects requiring different gate counts, consider these alternatives:
| Device |
System Gates |
Logic Cells |
CLBs |
User I/O |
| XC2S50 |
50,000 |
1,728 |
384 |
176 |
| XC2S100 |
100,000 |
2,700 |
600 |
176 |
| XC2S150 |
150,000 |
3,888 |
864 |
260 |
| XC2S200 |
200,000 |
5,292 |
1,176 |
284 |
Upgrade Path
For enhanced performance, explore the Xilinx FPGA portfolio including newer Spartan families and Artix series devices.
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG764C
- XC2S200: Device family and gate count
- 6: Speed grade (-6 for commercial)
- FGG764: Package type (764-ball FBGA)
- C: Commercial temperature range (0°C to +85°C)
Package Marking
The device marking includes:
- Xilinx logo
- Device type (XC2S200)
- Package and speed grade
- Date code and lot code
- Lead-free indicator
Technical Support and Resources
Documentation Available
- Complete datasheet with electrical specifications
- User guides for ISE Design Suite
- Application notes for common designs
- Reference designs and IP cores
- PCB layout guidelines
- Thermal management guides
Design Resources
- Free development tools (ISE WebPACK)
- Online training and tutorials
- Community forums and support
- Technical support from distributors
- Third-party IP core availability
Frequently Asked Questions
What makes the XC2S200-6FGG764C suitable for industrial applications?
The device offers robust performance with 200,000 system gates, commercial temperature operation, and reliable FPGA architecture proven in industrial environments. Its reprogrammability allows field updates without hardware replacement.
How does the -6 speed grade affect performance?
The -6 speed grade provides optimized timing characteristics for commercial temperature applications, supporting clock frequencies up to 263 MHz. It’s exclusively available for commercial temperature range devices.
What development tools are required?
Xilinx ISE Design Suite supports the XC2S200-6FGG764C. The free ISE WebPACK edition includes synthesis, implementation, and simulation tools sufficient for most designs.
Can the FPGA be reconfigured in the field?
Yes, the Spartan-II architecture supports unlimited reprogramming cycles through JTAG, serial, or parallel configuration interfaces, enabling field updates and design modifications.
What is the difference between distributed RAM and block RAM?
Distributed RAM uses LUTs within CLBs for small, flexible memory implementations, while block RAM provides dedicated 4K-bit memory modules for larger, more efficient storage requirements.
Conclusion
The XC2S200-6FGG764C represents an excellent choice for designers seeking a balance of performance, cost, and flexibility in FPGA solutions. With 200,000 system gates, 5,292 logic cells, and the high-density FGG764 package, this Spartan-II device delivers the resources needed for sophisticated digital designs across industrial, communications, medical, and consumer applications.
Its mature architecture, comprehensive toolchain support, and proven reliability make it ideal for both new designs and product upgrades. Whether you’re developing industrial automation systems, communication equipment, or consumer electronics, the XC2S200-6FGG764C provides the programmable logic resources and I/O capabilities to bring your designs to life.
For more information about Xilinx FPGA solutions and to explore the complete product portfolio, visit our comprehensive Xilinx FPGA resource center.
