The XC2S200-6FGG762C is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-II family, engineered to deliver exceptional programmable logic capabilities for demanding digital applications. This commercial-grade FPGA combines robust performance with cost-effectiveness, making it an ideal choice for telecommunications, industrial automation, consumer electronics, and embedded system designs.

As part of the Spartan-II series, the XC2S200-6FGG762C offers a superior alternative to traditional mask-programmed ASICs, eliminating lengthy development cycles, substantial upfront costs, and the inherent risks associated with conventional ASIC implementations. The device’s programmability enables field upgrades without hardware replacement, providing unprecedented design flexibility.

Key Technical Specifications

Core Architecture Features

Performance Characteristics

The XC2S200-6FGG762C FPGA delivers impressive performance metrics that enable complex digital system implementations:

• Maximum Operating Frequency: Up to 263 MHz for high-speed applications
• System Performance: Supports operation up to 200 MHz in typical configurations
• Advanced Architecture: Regular, flexible, programmable structure with configurable logic blocks
• Four Delay-Locked Loops (DLLs): Positioned at each corner for precise clock management
• Hierarchical Routing Resources: Powerful interconnect system for optimal signal routing

Package Information and Physical Characteristics

FGG762 Package Details

The FGG762 package provides extensive I/O capabilities with 284 maximum available user I/O pins, making it suitable for applications requiring substantial external interfacing. The fine-pitch ball grid array ensures reliable connections, excellent electrical characteristics, and superior signal integrity for high-speed designs.

Architectural Components and Resources

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG762C features 1,176 configurable logic blocks arranged in a 28 x 42 array. Each CLB contains:

• Look-Up Tables (LUTs) for combinational logic implementation
• Flip-flops for sequential circuit design
• Multiplexers for signal routing
• Fast carry logic for arithmetic operations

Memory Resources

Distributed RAM: 75,264 bits of distributed memory integrated throughout the CLB array for efficient data storage and retrieval in proximity to processing logic.

Block RAM: 56K bits of dedicated block RAM organized in columns for high-speed data buffering, FIFO implementations, and memory-intensive applications.

I/O Capabilities

With 284 maximum available user I/O pins, the device supports:

• Multiple I/O standards including LVTTL, LVCMOS, PCI, and differential signaling
• Programmable drive strengths and slew rates
• Input/Output Blocks (IOBs) surrounding the CLB array perimeter
• Four dedicated global clock/user input pins for system timing

Clock Management

Four Delay-Locked Loops (DLLs) positioned at device corners provide:

• Clock deskewing and phase shifting
• Clock frequency synthesis and multiplication
• Reduced clock-to-output delays
• Enhanced system timing performance

Application Areas and Use Cases

Telecommunications and Networking

The XC2S200-6FGG762C excels in communication infrastructure applications, enabling implementation of:

• Network protocol processing and packet routing
• Data transmission and encoding/decoding systems
• High-speed serial communication interfaces
• Telecommunication switching and multiplexing

Industrial Automation and Control

Perfect for industrial environments requiring:

• Programmable Logic Controller (PLC) implementations
• Motor control and drive systems
• Process monitoring and automated control
• Sensor interfacing and data acquisition

Consumer Electronics

Ideal for consumer product development including:

• Digital video and image processing
• Audio signal processing and effects
• Gaming console logic and graphics acceleration
• Smart home device controllers

Medical Equipment

Supports medical device applications such as:

• Diagnostic imaging systems
• Patient monitoring equipment
• Laboratory instrumentation
• Medical data processing and analysis

Automotive Systems

Enables automotive electronic designs for:

• Engine control units and management systems
• Advanced driver assistance systems (ADAS)
• In-vehicle infotainment processing
• Automotive sensor fusion and processing

Design Tools and Development Support

Xilinx Design Software Compatibility

The XC2S200-6FGG762C is supported by comprehensive development tools:

• ISE Design Suite: Industry-standard FPGA design software for synthesis, implementation, and debugging
• ChipScope Pro: Integrated logic analyzer for real-time signal monitoring
• CORE Generator: Library of pre-verified IP cores for rapid design implementation
• iMPACT: Configuration and programming utility

Programming and Configuration Options

Multiple configuration methods supported:

• Master Serial mode with onboard clock generation
• Slave Serial mode for external clock control
• JTAG boundary-scan programming
• SelectMAP parallel configuration interface

Technical Advantages Over ASICs

Cost and Time Benefits

Design Flexibility

The XC2S200-6FGG762C programmability enables:

• In-system reconfiguration for feature updates
• Design modifications without hardware changes
• Rapid prototyping and proof-of-concept development
• Version control through firmware updates
• Multi-functional system implementations

Power Consumption and Thermal Management

Power Supply Requirements

• Core Voltage (VCCINT): 2.5V for internal logic operation
• I/O Voltage (VCCO): 1.5V to 3.3V depending on I/O standards
• Auxiliary Voltage (VCCAUX): 2.5V for DLL and configuration circuitry

Power Optimization Features

• Efficient 0.18µm CMOS technology for reduced static power
• Selective clock gating capabilities
• Unused logic resource power-down
• Optimized routing architecture minimizing dynamic power

Ordering Information and Part Number Breakdown

Part Number Decoding: XC2S200-6FGG762C

• XC: Xilinx Commercial temperature range device
• 2S200: Spartan-II family, 200K system gates
• -6: Speed grade (highest performance grade for commercial)
• FGG: Fine-pitch Ball Grid Array, Pb-free (Green) package
• 762: Pin count (762 balls)
• C: Commercial temperature range (0°C to +85°C)

Package Marking and Identification

Device markings include:

• Device type and density
• Speed grade designation
• Package and pin count
• Temperature range indicator
• Manufacturing lot code and date code

Quality and Reliability

Manufacturing Standards

• Advanced 0.18µm CMOS fabrication process
• Rigorous quality control and testing protocols
• Industry-standard reliability specifications
• ESD protection on all I/O pins

Environmental Compliance

• RoHS compliant Pb-free packaging available
• REACH regulation conformance
• Halogen-free options for environmentally sensitive applications

Design Resources and Documentation

Available Technical Documents

• Complete datasheet with electrical specifications
• Packaging and pinout documentation
• User guides for architecture and implementation
• Application notes for design best practices
• Reference designs and example projects

Getting Started with XC2S200-6FGG762C

For engineers beginning development:

1. Download ISE Design Suite development software
2. Review architectural documentation and user guides
3. Explore reference designs relevant to your application
4. Utilize Xilinx online resources and community forums
5. Consider evaluation boards for initial prototyping

Comparison with Other Spartan-II Family Members

Spartan-II Family Overview

The XC2S200 represents the highest density offering in the Spartan-II family, providing maximum resources for complex applications.

Procurement and Availability

Sourcing Recommendations

• Contact authorized Xilinx distributors for current pricing and availability
• Verify part number accuracy including speed grade and package type
• Consider lead times for volume production orders
• Request device qualification documentation for critical applications
• Inquire about educational pricing for academic institutions

Stock and Lead Time Considerations

Due to the mature status of the Spartan-II family, availability may vary. Engineers should:

• Plan procurement timelines with adequate lead time
• Consider authorized distributors maintaining stock
• Evaluate newer FPGA families for long-term production designs
• Maintain design flexibility for package and speed grade alternatives

Related Products and Alternatives

For designers exploring options, the Xilinx FPGA portfolio offers numerous alternatives including:

• Spartan-3 Family: Enhanced density and performance with additional features
• Spartan-6 Family: Modern low-power architecture with DSP capabilities
• Artix-7 Family: 7-series architecture with improved power efficiency
• Kintex Series: Higher performance for bandwidth-intensive applications

Frequently Asked Questions

What makes the -6 speed grade significant?

The -6 speed grade is the highest performance option available in commercial temperature range, exclusively designed for applications requiring maximum operating frequency and minimal propagation delays.

Can the XC2S200-6FGG762C be reprogrammed?

Yes, as a field-programmable device, it can be reconfigured unlimited times through JTAG or other supported programming interfaces, making it ideal for iterative development and field updates.

What development boards support this device?

While specific development boards vary, Xilinx and third-party vendors offer evaluation platforms for the Spartan-II family. Consult authorized distributors for current availability of development kits.

Is this device suitable for new designs?

The Spartan-II family is mature technology. For new production designs, evaluate current-generation Xilinx FPGA families offering enhanced features, lower power consumption, and improved tool support.

What thermal management is required?

Thermal requirements depend on utilization, operating frequency, and ambient conditions. Consult thermal characteristics in the complete datasheet and implement appropriate heatsinking or cooling based on power dissipation calculations.

Conclusion

The XC2S200-6FGG762C represents a powerful solution for engineers requiring substantial programmable logic resources in a high-I/O-count package. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins, this FPGA provides the capacity and flexibility needed for complex digital designs across telecommunications, industrial, medical, and consumer electronics applications.

Its -6 speed grade ensures maximum performance for timing-critical applications, while the FGG762 package delivers extensive connectivity options. The device’s programmability offers significant advantages over traditional ASICs, including zero NRE costs, rapid development cycles, and field-upgrade capabilities.

For comprehensive information on Xilinx programmable logic solutions and to explore the full range of FPGA options, visit the Xilinx FPGA resource center.