The XC2S200-6FGG761C represents a powerful solution in the Spartan-II FPGA family from Xilinx (now AMD). This high-density field programmable gate array delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it ideal for complex digital design implementations. Housed in a robust 761-ball Fine-Pitch Ball Grid Array (FBGA) package, this device offers maximum flexibility for demanding applications across telecommunications, industrial automation, and digital signal processing.
Key Technical Specifications
Core Features and Performance Metrics
| Specification |
Value |
| Logic Cells |
5,292 cells |
| System Gates |
200,000 gates |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Speed Grade |
-6 (highest performance) |
| Operating Voltage |
2.5V |
| Package Type |
761-ball Fine-Pitch BGA |
| Technology Node |
0.18μm process |
Package and Environmental Specifications
| Parameter |
Details |
| Package Designation |
FGG761 |
| Total Ball Count |
761 balls |
| Temperature Range |
Commercial (0°C to +85°C) |
| Lead-Free Option |
Yes (denoted by “G” in part number) |
| Assembly Type |
Surface mount |
| Pb-Free Compliance |
RoHS compliant |
Advanced Architecture and Design Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG761C features 1,176 configurable logic blocks arranged in a 28×42 matrix, providing exceptional routing flexibility and logic density. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that enable implementation of complex combinational and sequential logic functions.
Memory Resources
This FPGA offers dual-tier memory architecture:
- Distributed RAM: 75,264 bits integrated within CLBs for fast, localized data storage
- Block RAM: 56 Kbits organized in dedicated memory columns for efficient data buffering and processing
High-Speed I/O Capabilities
With 284 maximum user I/O pins, the XC2S200-6FGG761C supports extensive external connectivity requirements. The 761-ball FBGA package provides optimal pin density for high-bandwidth applications and complex interface protocols.
Application Areas and Use Cases
Telecommunications Infrastructure
The XC2S200-6FGG761C excels in telecommunications equipment, supporting protocol implementation, signal processing, and high-speed data routing. Its substantial I/O count makes it perfect for multi-channel communication systems.
Industrial Control Systems
For industrial automation applications, this FPGA provides reliable performance in motor control, process automation, and real-time monitoring systems. The robust design ensures consistent operation in demanding industrial environments.
Digital Signal Processing (DSP)
With 56 Kbits of block RAM and 5,292 logic cells, the XC2S200-6FGG761C handles complex DSP algorithms including filtering, FFT operations, and image processing applications efficiently.
Embedded System Development
The device serves as an excellent platform for embedded system prototyping and deployment, offering reconfigurability for iterative design refinement and field upgrades.
Performance Characteristics
Speed Grade -6 Advantages
| Metric |
Benefit |
| Maximum Frequency |
Up to 200 MHz system performance |
| Propagation Delay |
Minimized signal latency |
| Setup/Hold Times |
Optimized for high-speed operation |
| Clock Distribution |
Four Delay-Locked Loops (DLLs) for precise timing |
Power Efficiency
Operating at 2.5V core voltage, the XC2S200-6FGG761C balances performance with power consumption, making it suitable for both portable and fixed-installation applications.
Design and Development Tools
Compatible Software
- ISE Design Suite: Primary development environment for Spartan-II family
- FPGA Editor: For detailed place-and-route optimization
- ChipScope Pro: For in-system debugging and verification
- Impact: Configuration and programming tool
Programming Options
| Method |
Description |
| JTAG |
Industry-standard boundary scan programming |
| Serial Mode |
Single PROM configuration |
| Master/Slave Serial |
Multi-device configuration chains |
| SelectMAP |
High-speed parallel configuration |
Package Details: FGG761 Ball Grid Array
Physical Dimensions
The FGG761 package delivers maximum I/O density in a fine-pitch ball grid array format, optimized for high-reliability applications requiring extensive pin counts.
Thermal Management
- Exposed die pad for enhanced heat dissipation
- Suitable for both natural convection and forced-air cooling
- Compatible with standard thermal interface materials
Ordering Information and Part Number Breakdown
XC2S200-6FGG761C decodes as follows:
- XC2S200: Spartan-II family, 200K gate device
- -6: Speed grade (fastest commercial grade)
- FGG761: Fine-pitch BGA, 761 balls
- C: Commercial temperature range (0°C to +85°C)
Comparison with Related Devices
Spartan-II Family Position
| Device |
Logic Cells |
System Gates |
User I/O |
Block RAM |
| XC2S150 |
3,888 |
150,000 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
284 |
56K |
| XC2S300 |
6,912 |
300,000 |
329 |
64K |
The XC2S200-6FGG761C provides an optimal balance of resources for mid-range FPGA applications, offering substantial logic capacity without the cost premium of larger devices.
Quality and Reliability
Manufacturing Standards
- Produced using advanced 0.18μm CMOS technology
- Comprehensive device testing and screening
- Full compliance with industry quality standards
- Long-term product availability commitment
Design Verification
The Spartan-II architecture undergoes rigorous verification including timing analysis, functional simulation, and comprehensive design rule checking to ensure reliable operation across all specified conditions.
Why Choose XC2S200-6FGG761C
Cost-Effective Performance
The XC2S200-6FGG761C delivers exceptional value by providing high gate density and extensive I/O capabilities at a competitive price point compared to ASIC development.
Design Flexibility
Field programmability enables rapid prototyping, in-field updates, and design modifications without hardware changes—impossible with traditional ASICs.
Proven Architecture
As part of the established Spartan-II family, this FPGA benefits from mature design tools, extensive documentation, and proven reliability in deployed systems worldwide.
Extensive I/O Support
The 761-ball package configuration provides maximum connectivity options, supporting complex multi-interface applications and high-bandwidth data paths.
Getting Started with XC2S200-6FGG761C
Development Resources
Engineers can access comprehensive design resources including datasheets, application notes, reference designs, and technical support documentation through AMD Xilinx channels.
Reference Designs
Pre-verified IP cores and reference implementations accelerate development for common applications including communication protocols, memory controllers, and interface standards.
Technical Support
Xilinx provides extensive technical support resources including design advisory services, timing analysis tools, and power estimation utilities to optimize your FPGA implementation.
Pin Configuration and Interface Standards
Supported I/O Standards
The XC2S200-6FGG761C supports multiple industry-standard I/O protocols:
- LVTTL/LVCMOS (3.3V, 2.5V)
- SSTL (Stub Series Terminated Logic)
- GTL/GTL+ (Gunning Transceiver Logic)
- PCI compatible interfaces
Flexible I/O Banking
Organized I/O banks allow mixed-voltage interface support, enabling connection to diverse system components operating at different voltage levels.
Integration and System Design
Board Layout Considerations
The fine-pitch BGA package requires careful PCB design with attention to:
- Controlled impedance routing for high-speed signals
- Proper power distribution and decoupling
- Thermal management provisions
- Signal integrity for dense ball-out patterns
System Clocking
Four integrated Delay-Locked Loops (DLLs) provide:
- Clock distribution with minimal skew
- Frequency synthesis and division
- Phase shifting capabilities
- Duty cycle correction
Environmental and Compliance Information
Operating Conditions
| Parameter |
Rating |
| Commercial Temperature |
0°C to +85°C |
| Storage Temperature |
-65°C to +150°C |
| Relative Humidity |
5% to 95% non-condensing |
Regulatory Compliance
- RoHS compliant (lead-free package option)
- REACH compliant
- Conflict mineral reporting available
For comprehensive information about the complete Xilinx FPGA portfolio, technical resources, and application guidance, explore our dedicated resource center.
Conclusion: Maximizing Your FPGA Design Success
The XC2S200-6FGG761C stands as a versatile, high-performance FPGA solution for engineers seeking robust digital logic implementation capabilities. With its combination of substantial gate count, extensive I/O options, integrated memory resources, and proven Spartan-II architecture, this device enables efficient development of sophisticated digital systems across multiple industry segments.
Whether you’re developing next-generation telecommunications equipment, advanced industrial control systems, or innovative digital signal processing applications, the XC2S200-6FGG761C provides the performance, flexibility, and reliability needed to bring your designs to market successfully.
The -6 speed grade ensures maximum performance for timing-critical applications, while the 761-ball FBGA package delivers the connectivity required for complex, multi-interface systems. Combined with mature development tools and comprehensive technical support, the XC2S200-6FGG761C represents an intelligent choice for demanding FPGA applications.
