The XC2S200-6FGG758C represents a flagship field-programmable gate array (FPGA) solution from the industry-leading Spartan-II family, developed by Xilinx (now AMD). This advanced programmable logic device delivers exceptional performance with 200,000 system gates and 5,292 configurable logic cells, making it the premier choice for demanding applications in telecommunications infrastructure, industrial automation, automotive systems, medical equipment, and high-performance embedded computing.
Manufactured using cutting-edge 0.18-micron CMOS process technology, the XC2S200-6FGG758C combines high-speed operation with superior programmability and cost-effectiveness. Engineers worldwide trust this FPGA for implementing complex digital circuits that require maximum flexibility without the prohibitive costs and extended development cycles associated with traditional ASIC solutions.
Technical Specifications and Core Features
Primary Device Specifications
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG758C |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 configurable logic cells |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (dual-port) |
| Maximum User I/O Pins |
Up to 284 pins |
| Speed Grade |
-6 (highest commercial performance) |
| Package Type |
758-ball Fine-pitch BGA (FGG758) |
| Temperature Range |
Commercial (0°C to +85°C) |
Advanced Performance Characteristics
| Feature |
Details |
| Process Technology |
0.18μm CMOS |
| Core Voltage |
2.5V ±5% |
| Maximum Operating Frequency |
Up to 200 MHz system performance |
| Configuration Options |
JTAG, Master/Slave Serial, Parallel |
| Delay-Locked Loops (DLLs) |
4 DLLs for precision clock management |
| I/O Standards Supported |
LVTTL, LVCMOS, PCI-33/66, GTL+, SSTL, HSTL |
| RoHS Compliance |
Fully RoHS compliant (lead-free) |
| Package Designation |
FGG758C (Fine-pitch BGA, Green, Commercial) |
XC2S200-6FGG758C Package Architecture
758-Pin Fine-Pitch BGA Package Advantages
The 758-pin Fine-pitch Ball Grid Array (FBGA) package delivers superior performance and reliability for high-density applications:
- High-Density Interconnection: 758 solder balls provide extensive I/O connectivity and signal routing options
- Compact Form Factor: Maximizes board space efficiency while maintaining excellent electrical characteristics
- Enhanced Signal Integrity: Short signal paths minimize inductance and capacitance for superior high-frequency performance
- Superior Thermal Performance: Large thermal mass and efficient heat dissipation path for reliable continuous operation
- Manufacturing Reliability: Fine-pitch ball grid ensures robust mechanical connections with excellent solder joint strength
- Low Parasitic Effects: Reduced package parasitics support high-speed operation with minimal signal degradation
Package Physical Properties
| Characteristic |
Value |
| Total Ball Count |
758 balls |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Body Material |
High-performance BT resin substrate |
| Solder Ball Material |
Lead-free (Pb-free) compliant |
| Mounting Method |
Surface mount technology (SMT) |
| Moisture Sensitivity |
MSL 3 (Moisture Sensitivity Level 3) |
| Part Marking |
Laser-etched identification |
| Environmental Grade |
Green package (halogen-free available) |
Configurable Logic Block Architecture
Logic Cell Configuration
Each of the 5,292 logic cells in the XC2S200-6FGG758C contains:
- 4-input Look-Up Tables (LUTs): Implement any Boolean function of up to four inputs
- Dedicated Flip-Flops: Registered outputs for synchronous designs
- Carry Logic: Fast arithmetic operations and cascading support
- Multiplexers: Efficient data path implementation
- Storage Elements: Configurable as registers or latches
Configurable Logic Block Organization
| Resource |
Quantity |
Description |
| Total CLBs |
1,176 blocks |
Organized in 28 x 42 array |
| Logic Cells per CLB |
4-5 cells |
Varies by configuration |
| LUTs per CLB |
4 LUTs |
Each 4-input configurable |
| Flip-Flops per CLB |
4 FF |
D-type with clock enable |
| RAM Bits per CLB |
64 bits |
Distributed RAM mode |
| Routing Resources |
Extensive |
Multi-level hierarchical routing |
Memory Architecture and Resources
Distributed RAM Configuration
The XC2S200-6FGG758C provides 75,264 bits of distributed RAM integrated within the CLB structure:
- Single-Port RAM: Up to 16 bits deep per CLB
- Dual-Port RAM: Simultaneous read/write operations
- Shift Register Mode: Efficient delay line implementation
- LUT-Based Storage: Zero additional resource usage
- Flexible Configuration: Adaptable to application requirements
Block RAM Implementation
56 Kbits of dedicated Block RAM arranged in dual-port configuration:
| Block RAM Feature |
Specification |
| Total Capacity |
56 Kbits (7 KB) |
| Block Size |
4 Kbits per block |
| Number of Blocks |
14 independent blocks |
| Port Configuration |
True dual-port access |
| Data Width |
Configurable 1 to 16 bits |
| Parity Support |
Optional parity bits |
| Operating Mode |
Read-first, write-first, no-change |
Clock Management System
Delay-Locked Loop Features
The XC2S200-6FGG758C incorporates four DLL modules positioned at each corner of the die:
- Clock De-skewing: Eliminates clock distribution delays
- Clock Multiplication: 2X, 4X frequency multiplication
- Clock Division: Divide-by-2, divide-by-4, divide-by-8
- Phase Shifting: Fine-grained phase adjustment (90°, 180°, 270°)
- Clock Mirroring: Board-level clock synchronization
- Duty Cycle Correction: Ensures 50% duty cycle output
Global Clock Distribution
| Clock Resource |
Details |
| Primary Global Clocks |
4 dedicated global clock nets |
| Secondary Global Clocks |
4 additional low-skew networks |
| Clock Distribution |
Low-skew routing tree architecture |
| Clock Input Pins |
Dedicated GCLK input pads |
| Clock Buffers |
BUFG global clock buffers |
| Clock Frequency |
DC to 200 MHz supported |
Input/Output Block Capabilities
Versatile I/O Standards Support
The XC2S200-6FGG758C supports an extensive range of industry-standard I/O interfaces:
- LVTTL (Low Voltage TTL): 3.3V standard logic
- LVCMOS: 1.8V, 2.5V, 3.3V variants
- PCI: 33 MHz and 66 MHz PCI bus support
- GTL+: Gunning Transceiver Logic Plus
- SSTL: Stub Series Terminated Logic (SSTL-2, SSTL-3)
- HSTL: High-Speed Transceiver Logic
Programmable I/O Features
| I/O Capability |
Specification |
| Maximum User I/O |
284 single-ended I/O pins |
| Drive Strength |
2mA, 4mA, 6mA, 8mA, 12mA, 16mA, 24mA |
| Slew Rate Control |
Fast and slow slew rates |
| Pull-up/Pull-down |
Weak pull-up and pull-down options |
| 3-State Control |
Independent 3-state enable per output |
| Input Thresholds |
TTL and CMOS compatible |
| ESD Protection |
Human Body Model (HBM) Class 1C |
| Differential I/O |
Supported for high-speed signaling |
Application Areas for XC2S200-6FGG758C
Telecommunications and Networking
The XC2S200-6FGG758C excels in telecommunications infrastructure:
- Protocol Processing: Multi-protocol bridging and conversion
- Digital Signal Processing: Voice and data signal processing
- Packet Processing: Network packet inspection and routing
- Channel Coding: Forward error correction and encoding
- Baseband Processing: Wireless baseband signal processing
- Switching Fabric: High-speed data switching applications
- Network Interface Cards: Custom NIC implementations
- Telecommunications Equipment: Central office and base station equipment
Industrial Control and Automation
Ideal for demanding industrial environments:
- Motion Control: Multi-axis servo motor controllers
- Process Control: Real-time industrial process monitoring
- Factory Automation: Programmable automation controllers (PACs)
- Robotics: Advanced robotic control systems
- Sensor Fusion: Multi-sensor data acquisition and processing
- Machine Vision: Image processing and analysis
- Programmable Logic Controllers: Custom PLC implementations
- Industrial Networking: Fieldbus and industrial Ethernet interfaces
Automotive Electronics Applications
Reliable performance for automotive systems:
- Engine Management: Advanced engine control units (ECUs)
- ADAS Systems: Advanced driver assistance systems
- Vehicle Networking: CAN, LIN, FlexRay protocol implementation
- Infotainment Processing: Audio/video signal processing
- Dashboard Control: Instrument cluster controllers
- Safety Systems: Airbag and safety-critical controllers
- Powertrain Control: Transmission and drivetrain management
- Body Electronics: Door modules and comfort systems
Medical Equipment and Instrumentation
Precision performance for medical devices:
- Diagnostic Imaging: Ultrasound and X-ray image processing
- Patient Monitoring: Multi-parameter vital signs monitoring
- Laboratory Equipment: Automated analyzers and test equipment
- Surgical Instruments: Robotic surgery control systems
- Therapeutic Devices: Programmable treatment controllers
- Portable Diagnostics: Handheld medical diagnostic tools
Aerospace and Defense
High-reliability applications in aerospace:
- Avionics Systems: Flight control and navigation
- Radar Processing: Signal processing for radar systems
- Communications: Secure communications equipment
- Satellite Systems: Onboard processing and control
- Test Equipment: Automated test and measurement systems
- Data Acquisition: High-speed data logging systems
Design Tools and Development Support
Compatible Development Environment
| Tool Category |
Compatible Software |
| Design Entry |
Xilinx ISE Design Suite (complete support) |
| HDL Languages |
VHDL, Verilog HDL, SystemVerilog |
| Synthesis |
XST (Xilinx Synthesis Technology), Synplify Pro |
| Simulation |
ModelSim, ISim, Vivado Simulator |
| Timing Analysis |
Static timing analysis with comprehensive reports |
| Floor Planning |
FPGA Editor for manual placement |
| Constraint Entry |
UCF (User Constraints File) format |
| Debug Tools |
ChipScope Pro logic analyzer |
Programming and Configuration Methods
The XC2S200-6FGG758C offers flexible configuration approaches:
- JTAG Boundary Scan: Industry-standard IEEE 1149.1 in-system programming
- Master Serial Mode: FPGA controls configuration from Platform Flash PROM
- Slave Serial Mode: External microcontroller manages configuration
- Master Parallel Mode: High-speed parallel configuration interface
- Slave Parallel Mode: External master controls parallel configuration
- Configuration Encryption: Optional bitstream security for IP protection
Power Supply and Management
Power Rail Requirements
| Power Supply |
Voltage |
Tolerance |
Function |
| VCCINT |
2.5V |
±5% |
Core logic power |
| VCCO Bank 0-7 |
1.8V – 3.3V |
±5% |
I/O bank supplies |
| VCCAUX |
2.5V or 3.3V |
±5% |
DLL and auxiliary circuits |
Power Consumption Considerations
Power usage in the XC2S200-6FGG758C depends on several factors:
- Static Power: Quiescent current when logic is idle
- Dynamic Power: Proportional to clock frequency and toggle rate
- I/O Power: Based on I/O standard and drive strength
- Clock Power: Global and local clock network consumption
- Block RAM Power: Dependent on memory access patterns
Engineers should utilize Xilinx XPower analysis tools for accurate power budgeting based on actual design utilization and operating conditions.
Ordering Information and Part Number Breakdown
Part Number Decoding
XC2S200-6FGG758C
- XC2S200: Device family and density (Spartan-II, 200K gates)
- -6: Speed grade (fastest commercial grade available)
- FGG: Package type (Fine-pitch Ball Grid Array, Green/Pb-free)
- 758: Pin count (758 solder balls)
- C: Temperature range (Commercial: 0°C to +85°C)
Procurement Guidelines
When sourcing the XC2S200-6FGG758C:
- Authorized Distributors: Purchase from verified Xilinx/AMD distributors
- Date Codes: Verify manufacturing date for latest silicon revision
- Anti-Counterfeit: Implement authentication procedures for critical applications
- Lead Times: Plan for appropriate procurement lead times
- Volume Pricing: Consult distributors for quantity discounts
- Technical Support: Leverage Xilinx FPGA expertise for design assistance
Quality, Reliability, and Compliance
Manufacturing Quality Standards
| Certification |
Status |
| RoHS Directive |
Fully compliant (lead-free construction) |
| REACH SVHC |
Compliant with REACH regulations |
| ISO 9001 |
Manufactured in certified facilities |
| Automotive AEC-Q100 |
Contact manufacturer for automotive grade |
| Testing Coverage |
100% production tested |
| Lot Traceability |
Full traceability with date/lot codes |
Reliability and Environmental Data
The XC2S200-6FGG758C meets stringent reliability requirements:
- ESD Protection: Human Body Model (HBM) Class 1C (>2000V)
- Latch-Up Immunity: JEDEC standard JESD78 compliant
- MTBF: >1 million hours under specified conditions
- Operating Life: Designed for >20 years continuous operation
- Thermal Cycling: Qualified per JEDEC standards
- Configuration Integrity: Built-in CRC error checking
PCB Design Best Practices
Layout Guidelines for FGG758 Package
Optimal XC2S200-6FGG758C PCB implementation requires:
- Layer Stack-up: Minimum 6-layer PCB recommended for complex designs
- Power Planes: Dedicated solid power and ground planes
- Decoupling: 0.1μF and 0.01μF capacitors near each power pin
- Via Design: Appropriate via size for BGA escape routing
- Thermal Vias: Array of thermal vias under package for heat dissipation
- Controlled Impedance: Match trace impedance to I/O standards
- EMI Control: Proper grounding and shielding techniques
BGA Assembly Considerations
| Requirement |
Specification |
| PCB Pad Design |
NSMD (Non-Solder Mask Defined) recommended |
| Solder Paste |
Lead-free SAC305 or equivalent |
| Reflow Profile |
Follow JEDEC J-STD-020 guidelines |
| Inspection |
X-ray inspection for solder joint verification |
| Rework |
BGA rework station with controlled heating |
Thermal Management Solutions
Thermal Design Parameters
| Parameter |
Specification |
| Junction Temperature (TJ) |
0°C to +85°C (Commercial) |
| Ambient Temperature (TA) |
Per thermal resistance calculations |
| Theta-JA (θJA) |
Package-dependent (consult datasheet) |
| Theta-JC (θJC) |
Case-to-junction thermal resistance |
Cooling Solutions
For optimal thermal performance:
- Natural Convection: Adequate for low-power designs with proper airflow
- Forced Air Cooling: Fans or blowers for moderate power dissipation
- Heatsinks: Attached heatsinks for high-utilization applications
- Thermal Interface: Thermal pads or grease between package and heatsink
- Thermal Monitoring: Temperature sensors for critical applications
Comparison with Spartan-II Family
Spartan-II Device Family Positioning
| Device |
System Gates |
Logic Cells |
Block RAM |
Max I/O |
Best For |
| XC2S15 |
15,000 |
432 |
16K |
86 |
Ultra-low-cost designs |
| XC2S30 |
30,000 |
972 |
24K |
92 |
Entry-level applications |
| XC2S50 |
50,000 |
1,728 |
32K |
176 |
Cost-sensitive projects |
| XC2S100 |
100,000 |
2,700 |
40K |
176 |
Mid-range systems |
| XC2S150 |
150,000 |
3,888 |
48K |
260 |
Complex applications |
| XC2S200 |
200,000 |
5,292 |
56K |
284 |
Maximum performance |
The XC2S200-6FGG758C sits at the top of the Spartan-II family hierarchy, offering maximum logic density and I/O resources for the most demanding digital design challenges.
Common Design Patterns and Applications
Digital Signal Processing Implementations
- FIR/IIR Filters: High-performance filtering using distributed arithmetic
- FFT/IFFT: Fast Fourier transform implementations
- Modulation/Demodulation: Digital communication signal processing
- Correlation: Cross-correlation and auto-correlation functions
- Adaptive Filters: LMS and RLS adaptive filtering algorithms
Communication Protocol Implementations
- UART: Universal asynchronous receiver/transmitter
- SPI: Serial peripheral interface master/slave
- I2C: Inter-integrated circuit bus controller
- Ethernet MAC: 10/100 Mbps Ethernet media access control
- USB: Universal serial bus device interfaces
- PCIe: PCI Express endpoint implementations
Frequently Asked Questions
Is the XC2S200-6FGG758C suitable for new product designs?
While the Spartan-II family is mature technology, it remains an excellent choice for cost-optimized applications requiring proven reliability. For new designs prioritizing cutting-edge features, evaluate newer FPGA families alongside Spartan-II options.
What configuration memory devices are compatible?
The XC2S200-6FGG758C works with Xilinx Platform Flash PROMs (XCF series), standard serial Flash memory, and processor-based configuration approaches. Configuration file size is approximately 2.8 Mbits.
Can I migrate between different package options?
Designs can typically migrate between XC2S200 package variants, though pin assignments must be updated. Consult package pinout documentation for specific pin mapping differences.
What development boards are available?
Contact Xilinx partners and third-party development tool vendors for evaluation platforms. Custom prototyping boards may be necessary for the 758-pin package variant.
Does the device support partial reconfiguration?
The XC2S200-6FGG758C supports full device reconfiguration but does not include partial reconfiguration capabilities. Newer FPGA families offer partial reconfiguration if required.
What is the configuration time?
Configuration time depends on the selected mode. Master Serial mode typically requires 50-100ms, while parallel modes offer faster configuration times. Exact timing depends on clock frequency and interface selection.
Is the speed grade -6 available in industrial temperature range?
The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature requirements (-40°C to +100°C), the -5 speed grade is recommended.
Design Resources and Documentation
Essential Technical Documentation
| Document Type |
Purpose |
| Complete Datasheet |
Electrical specifications and timing |
| User Guide |
Architectural details and design guidelines |
| Application Notes |
Design best practices and reference designs |
| Package Drawings |
Mechanical specifications and dimensions |
| Pinout Files |
Complete pin assignments and descriptions |
| PCB Guidelines |
Layout recommendations and constraints |
Online Resources and Support
Access comprehensive design support through:
- Technical support forums and knowledge base
- Reference designs and IP cores
- Training videos and webinars
- Application-specific design examples
- Software tool updates and patches
Conclusion
The XC2S200-6FGG758C delivers outstanding value for engineers developing high-performance digital systems requiring maximum programmable logic resources. With 200,000 system gates, 5,292 logic cells, the fastest commercial speed grade, and extensive I/O capabilities in a high-density 758-pin BGA package, this FPGA provides the performance and flexibility demanded by today’s complex applications.
Whether designing telecommunications infrastructure, industrial automation systems, automotive electronics, medical equipment, or aerospace applications, the XC2S200-6FGG758C offers the proven architecture, comprehensive development support, and cost-effective programmability to accelerate your product development and ensure long-term success.
For detailed technical specifications, current availability, pricing information, and design support for the XC2S200-6FGG758C, contact authorized Xilinx FPGA distributors or visit the AMD Xilinx website for comprehensive documentation and application resources.
