The XC2S200-6FGG756C is a powerful Field-Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for complex digital processing applications. With 200,000 system gates and 5,292 logic cells, this FPGA provides the flexibility and processing power needed for demanding industrial, telecommunications, and embedded system designs.

Overview of XC2S200-6FGG756C FPGA

The XC2S200-6FGG756C represents a cost-effective solution for engineers and designers seeking reliable programmable logic capabilities. This device features a 756-ball Fine-Pitch Ball Grid Array (FBGA) package, offering maximum connectivity options and superior thermal performance for mission-critical applications.

Key Features and Benefits

The XC2S200-6FGG756C delivers enterprise-grade performance through its advanced architecture and comprehensive feature set:

• 200,000 System Gates: Extensive gate capacity enables implementation of complex digital designs and sophisticated logic functions
• 5,292 Logic Cells: High-density logic resources support intricate signal processing and computational tasks
• 756-Pin FBGA Package: Fine-pitch ball grid array provides maximum I/O availability and excellent signal integrity
• -6 Speed Grade: Optimized timing performance for high-speed digital applications up to 200 MHz
• 2.5V Core Voltage: Low-power operation reduces overall system energy consumption
• 0.18μm Process Technology: Advanced manufacturing process ensures reliability and performance
• 56K Bits Block RAM: Integrated memory blocks for efficient data buffering and storage
• 75,264 Distributed RAM Bits: Additional memory resources for flexible design implementation

Technical Specifications Table

Architecture and Design Capabilities

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG756C features a robust array of 1,176 Configurable Logic Blocks arranged in a 28 x 42 matrix. Each CLB contains:

• Four logic slices with Look-Up Tables (LUTs)
• Dedicated fast carry logic chains
• Storage elements (flip-flops and latches)
• Wide-function multiplexers

This architecture enables efficient implementation of arithmetic functions, state machines, data path logic, and complex Boolean operations.

Memory Resources

Input/Output Capabilities

The FGG756 package provides exceptional I/O density with up to 284 user-configurable pins. Each I/O block supports:

• Multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+)
• Programmable slew rates
• Individual three-state control
• Input delay compensation
• Boundary-scan testing (JTAG)

Performance Specifications

Timing and Speed Grade Comparison

The -6 speed grade of the XC2S200-6FGG756C ensures optimal performance for time-critical applications requiring maximum operating frequencies.

Application Areas

Industrial Automation and Control

The XC2S200-6FGG756C excels in industrial environments where programmable logic enables:

• Motor control systems with PWM generation
• PLC (Programmable Logic Controller) replacement
• Factory automation and robotics control
• Process monitoring and data acquisition systems
• Industrial communication protocol implementation

Telecommunications and Networking

High-speed data processing capabilities make this FPGA ideal for:

• Protocol conversion and bridge circuits
• Data packet routing and switching
• Digital signal processing for communications
• Baseband processing units
• Network interface controllers

Embedded Systems Development

The device serves as the core logic element in:

• Custom embedded processors
• Sensor interface and data processing
• Real-time control applications
• Hardware acceleration modules
• Prototyping complex digital systems

Medical and Scientific Instrumentation

Precision and reliability requirements are met through:

• Medical imaging systems
• Diagnostic equipment interfaces
• Laboratory instrumentation
• Patient monitoring devices
• Data acquisition and analysis systems

Package Information: FGG756

Package Dimensions and Specifications

Thermal Characteristics

The FGG756 package offers superior thermal performance:

• Enhanced heat dissipation through large thermal pad
• Optimized for high-density PCB layouts
• Compatible with standard SMT assembly processes
• Supports various cooling solutions (heatsinks, forced air)

Design Tools and Development Support

Software Compatibility

The XC2S200-6FGG756C is fully supported by:

• Xilinx ISE Design Suite: Complete design entry, synthesis, and implementation
• Vivado Design Suite: Modern development environment for advanced designs
• FPGA Editor: Visual design verification and modification
• ChipScope Pro: In-system debugging and analysis

Programming and Configuration

Multiple configuration modes provide flexibility:

Comparison with Alternative FPGA Solutions

XC2S200-6FGG756C vs Other Spartan-II Packages

The FGG756 package provides the maximum I/O count and best thermal characteristics, making it the preferred choice for complex, high-density designs requiring extensive external connectivity.

Quality and Reliability

Manufacturing Standards

AMD Xilinx manufactures the XC2S200-6FGG756C using:

• ISO 9001 certified production facilities
• Military-grade screening options available
• Comprehensive quality assurance testing
• Full traceability and lot control

Reliability Metrics

• MTBF (Mean Time Between Failures): Exceeds 1 million hours
• Operating life: Designed for 20+ years
• ESD protection: Human Body Model (HBM) 2kV minimum
• Latch-up immunity: Compliant with JEDEC standards

Getting Started with XC2S200-6FGG756C

Evaluation and Development Boards

While the XC2S200-6FGG756C doesn’t have dedicated evaluation boards, designers can:

• Create custom PCB designs for specific applications
• Use prototyping services for quick turnaround
• Leverage reference designs from AMD Xilinx
• Utilize third-party FPGA development platforms

Design Resources

Engineers can access comprehensive support materials:

• Complete datasheets with electrical specifications
• Application notes for common design patterns
• Reference designs and IP cores
• Technical documentation and user guides
• Community forums and design examples

Power Consumption Considerations

Power Supply Requirements

Power Optimization Strategies

Reduce overall power consumption through:

• Clock gating for unused logic blocks
• Intelligent power management modes
• Optimized I/O standard selection
• Efficient design practices and timing closure

Why Choose XC2S200-6FGG756C?

Advantages Over Competitive Solutions

The XC2S200-6FGG756C offers distinct advantages:

1. Proven Architecture: Mature Spartan-II platform with extensive field deployment
2. Cost-Effectiveness: Lower total system cost compared to ASIC development
3. Field Reconfigurability: Update designs without hardware changes
4. Rapid Prototyping: Accelerate time-to-market for new products
5. Extensive I/O Options: FGG756 package maximizes connectivity
6. Design Security: Configuration memory encryption available

Long-Term Availability

AMD Xilinx maintains long product lifecycles, ensuring:

• Multi-year availability commitments
• Advance notification of product changes
• Migration paths to newer families
• Continued technical support

Ordering Information and Part Number Breakdown

Part Number Decoding: XC2S200-6FGG756C

• XC: Xilinx Commercial product
• 2S: Spartan-II family
• 200: 200,000 system gates
• -6: Speed grade (fastest commercial grade)
• FGG: Fine-pitch Ball Grid Array with lead-free (Green) option
• 756: 756-ball package
• C: Commercial temperature range (0°C to +85°C)

Available Temperature Grades

Integration with Xilinx Ecosystem

The XC2S200-6FGG756C seamlessly integrates with the broader Xilinx FPGA portfolio, allowing designers to leverage:

• Common design tools across product families
• IP core compatibility and reuse
• Familiar development workflows
• Consistent technical support infrastructure

This integration enables smooth migration paths when scaling designs up to larger Spartan-II devices or transitioning to newer FPGA families while maintaining design investment.

Environmental Compliance

RoHS and Environmental Standards

The XC2S200-6FGG756C with “G” designation (FGG package) complies with:

• RoHS (Restriction of Hazardous Substances) directive
• WEEE (Waste Electrical and Electronic Equipment) regulations
• REACH (Registration, Evaluation, Authorization of Chemicals)
• Halogen-free packaging options available

Conclusion

The XC2S200-6FGG756C represents an excellent choice for engineers requiring high-performance programmable logic with extensive I/O capabilities. Its combination of 200,000 system gates, 5,292 logic cells, and 756-pin FBGA package makes it ideal for complex digital designs across industrial automation, telecommunications, medical devices, and embedded systems.

With proven reliability, comprehensive development tool support, and the backing of AMD Xilinx’s industry leadership, the XC2S200-6FGG756C delivers exceptional value for both prototype development and volume production applications. Whether you’re replacing legacy ASIC designs, developing next-generation products, or requiring field-reconfigurable hardware, this Spartan-II FPGA provides the performance, flexibility, and reliability needed for success.