The XC2S200-6FGG754C is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family, delivering exceptional performance and versatility in a robust 754-ball Fine Pitch Ball Grid Array (FGG754) package. This commercial-grade FPGA combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal solution for high-density digital design applications requiring maximum I/O flexibility.

Engineered with 0.18um technology and operating at 2.5V, the XC2S200-6FGG754C represents a cost-effective alternative to traditional ASICs while offering the flexibility of field-programmable logic. Whether you’re designing communications equipment, industrial control systems, or advanced embedded applications, this FPGA provides the resources and reliability your project demands.

Key Technical Specifications

Core Performance Features

Package Specifications – FGG754

XC2S200-6FGG754C Architecture and Design

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG754C features a robust 28 x 42 array of Configurable Logic Blocks, providing 1,176 total CLBs for implementing complex digital logic functions. Each CLB contains multiple Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling efficient implementation of both combinatorial and sequential logic circuits.

Memory Architecture

This Spartan-II FPGA offers dual memory architectures optimized for different applications:

Distributed RAM: With 75,264 bits of distributed RAM integrated within the CLBs, designers can implement small memory structures directly where needed, reducing routing congestion and improving performance.

Block RAM: The 56 Kbits of dedicated block RAM provides efficient storage for larger data structures, lookup tables, and buffer implementations without consuming general-purpose logic resources.

Input/Output Capabilities

The FGG754 package delivers exceptional I/O density with up to 284 maximum available user I/O pins (excluding the four dedicated global clock/user input pins). This extensive I/O capability makes the XC2S200-6FGG754C particularly well-suited for applications requiring numerous external interfaces, such as multi-channel data acquisition systems, complex communication protocols, or high-speed parallel processing.

Speed Grade and Performance

-6 Speed Grade Advantages

The -6 speed grade designation indicates this FPGA is optimized for high-performance applications, offering:

• Faster propagation delays through logic elements
• Reduced setup and hold times for sequential circuits
• Higher maximum operating frequencies (up to 263 MHz system performance)
• Superior timing margins for complex designs

Important Note: The -6 speed grade is exclusively available in the Commercial temperature range, ensuring optimal performance within the 0°C to +85°C operating window.

Performance Comparison Table

Applications and Use Cases

Industrial and Embedded Systems

The XC2S200-6FGG754C excels in industrial automation, process control, and embedded computing applications where programmable logic provides adaptability and future-proofing that traditional ASICs cannot match.

Communications Infrastructure

With its extensive I/O capabilities and high-speed performance, this FPGA is ideal for telecommunications equipment, including routers, switches, base stations, and protocol converters requiring multiple concurrent interfaces.

Data Acquisition and Processing

The combination of high I/O count, substantial on-chip memory, and fast processing makes the XC2S200-6FGG754C perfect for multi-channel data acquisition systems, real-time signal processing, and high-throughput data conversion applications.

Consumer Electronics

From digital video processing to advanced gaming consoles, the XC2S200-6FGG754C provides the computational power and flexibility needed for sophisticated consumer products.

Advantages Over Traditional ASICs

Cost-Effective Development

Field Programmability Benefits

The XC2S200-6FGG754C’s reprogrammable nature enables:

• Design iterations without hardware replacement
• Feature upgrades deployed to existing installations
• Bug fixes implemented remotely
• Product differentiation using common hardware platforms
• Reduced inventory through multi-purpose designs

Design Tools and Development Support

ISE Design Suite Compatibility

The XC2S200-6FGG754C is fully supported by Xilinx’s ISE Design Suite, providing comprehensive tools for:

• HDL synthesis (VHDL/Verilog)
• Logic simulation and verification
• Timing analysis and optimization
• Place and route automation
• Bitstream generation

For comprehensive FPGA solutions and technical resources, explore our Xilinx FPGA product portfolio.

Programming and Configuration

This Spartan-II FPGA supports multiple configuration modes:

• Master Serial Mode: Direct configuration from serial PROM
• Slave Serial Mode: Configuration via external controller
• JTAG Boundary Scan: In-system programming and debugging
• SelectMAP Mode: High-speed parallel configuration

Package Dimensions and PCB Design Considerations

FGG754 Footprint Requirements

The 754-ball Fine Pitch BGA package requires careful PCB design considerations:

Thermal Considerations

The XC2S200-6FGG754C’s 754-ball package provides excellent thermal dissipation characteristics. Proper thermal management includes:

• Adequate copper pour for heat spreading
• Thermal vias connecting to internal ground planes
• Consideration of ambient temperature and airflow
• Optional heatsink attachment for high-power applications

Power Supply Requirements

Voltage Rails

Multi-Voltage I/O Interface

The XC2S200-6FGG754C features a flexible multi-voltage I/O architecture, allowing different I/O banks to operate at various voltage levels (1.5V, 1.8V, 2.5V, or 3.3V), enabling seamless interfacing with diverse peripheral devices and system components.

Ordering Information and Part Number Breakdown

Understanding the Part Number: XC2S200-6FGG754C

Competitive Advantages

Why Choose XC2S200-6FGG754C?

Maximum I/O Density: The 754-ball package provides the highest pin count available in the Spartan-II XC2S200 family, making it the optimal choice for I/O-intensive applications.

Proven Reliability: Spartan-II FPGAs have demonstrated exceptional reliability across millions of deployed units in mission-critical applications worldwide.

Ecosystem Support: Benefit from Xilinx’s comprehensive documentation, reference designs, IP cores, and active developer community.

Cost-Performance Balance: Delivers enterprise-grade features at a price point suitable for volume production.

Quality and Reliability

Manufacturing Standards

The XC2S200-6FGG754C is manufactured using Xilinx’s rigorous quality control processes, ensuring:

• Consistent electrical characteristics
• Long-term reliability (MTBF > 1 million hours typical)
• ESD protection on all I/O pins
• Compliance with international quality standards

Testing and Validation

Each device undergoes comprehensive testing including:

• Functional verification at wafer level
• Final test at package level
• Temperature cycling validation
• Electrical parameter verification

Environmental Compliance

The XC2S200-6FGG754C is available in both standard and RoHS-compliant (lead-free) versions. The lead-free variant includes the “G” designation in the ordering code (XC2S200-6FGGG754C), meeting international environmental regulations.

Migration Path and Family Compatibility

Spartan-II Family Scalability

The Spartan-II architecture allows for easy migration between family members:

Pin Compatibility

While the FGG754 package is unique to the XC2S200, designs can often migrate between different Spartan-II package options (FG256, FG456, FG754, PQ208) with appropriate pin reassignment.

Getting Started with XC2S200-6FGG754C

Essential Resources

To begin your design with the XC2S200-6FGG754C, you’ll need:

1. Development Board: Evaluation platform with FGG754 socket
2. ISE Design Software: Free WebPACK or full ISE suite
3. JTAG Programmer: USB or parallel cable for configuration
4. Documentation: Datasheet, user guide, and application notes
5. IP Cores: Pre-verified functional blocks to accelerate development

Typical Design Flow

1. Specification: Define requirements and I/O interfaces
2. HDL Coding: Implement design in VHDL or Verilog
3. Simulation: Verify functionality using ModelSim or ISim
4. Synthesis: Convert HDL to gate-level netlist
5. Implementation: Place and route design in FPGA fabric
6. Timing Analysis: Verify timing constraints are met
7. Configuration: Program device and test in target system

Frequently Asked Questions

What makes the FGG754 package unique?

The 754-ball Fine Pitch BGA package offers the maximum I/O count available for the XC2S200 device, providing 284 user I/O pins compared to 176 pins in smaller packages. This makes it ideal for applications requiring extensive external connectivity.

Can I use this FPGA in automotive applications?

The XC2S200-6FGG754C is specified for commercial temperature range (0°C to +85°C). For automotive applications requiring extended temperature ranges or specific automotive qualifications, consult with Xilinx regarding automotive-grade variants.

How much power does the XC2S200-6FGG754C consume?

Power consumption varies based on design complexity, clock frequency, and I/O activity. Typical applications consume 1.5W to 3W. Use Xilinx’s XPower tool for accurate power estimation based on your specific design.

Is the device 5V tolerant?

No, Spartan-II devices are not 5V tolerant. The maximum voltage on any I/O pin is VCCO + 0.5V. Use level shifters or voltage translation buffers when interfacing with 5V systems.

What configuration file formats are supported?

The XC2S200-6FGG754C supports standard Xilinx bitstream formats (.bit) generated by ISE Design Suite. Configuration can be stored in serial PROMs or loaded from external processors.

Conclusion

The XC2S200-6FGG754C represents the pinnacle of Spartan-II FPGA technology, combining substantial logic resources, exceptional I/O density, and high-speed performance in a professional-grade 754-ball BGA package. Whether you’re developing next-generation communications equipment, industrial control systems, or advanced embedded solutions, this FPGA provides the flexibility, reliability, and cost-effectiveness that modern electronic designs demand.

With its proven architecture, comprehensive tool support, and field-programmable advantages over traditional ASICs, the XC2S200-6FGG754C enables faster time-to-market, reduced development risk, and the ability to adapt to changing requirements throughout the product lifecycle. Backed by Xilinx’s industry-leading support and extensive ecosystem, this FPGA is an excellent choice for engineers seeking maximum capability in a high-density programmable logic solution.

For more information about Xilinx FPGA solutions and to explore our complete product catalog, visit our Xilinx FPGA resource center.