The XC2S200-6FGG753C is a premium field-programmable gate array (FPGA) from the renowned Spartan-II family, engineered by Xilinx (now AMD). This high-density programmable logic device delivers exceptional performance with 200,000 system gates, making it the ideal solution for complex digital design applications across telecommunications, industrial automation, automotive systems, and embedded computing platforms.
Built on proven 0.18-micron CMOS technology, the XC2S200-6FGG753C combines superior processing capabilities with cost-effective programmability, offering engineers and designers a flexible platform for implementing sophisticated digital circuits without the high costs and long lead times associated with traditional ASICs.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 configurable logic cells |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum User I/O |
Up to 284 user I/O pins |
| Speed Grade |
-6 (fastest commercial grade) |
| Operating Voltage |
2.5V core voltage |
| Package Type |
753-ball Fine-pitch Ball Grid Array (FBGA) |
Performance Characteristics
| Parameter |
Specification |
| Maximum System Frequency |
Up to 200 MHz |
| Technology Node |
0.18μm CMOS process |
| Temperature Range |
Commercial (0°C to +85°C) |
| Power Supply Tolerance |
±5% voltage tolerance |
| Configuration Time |
Fast configuration support |
| I/O Standards Supported |
LVTTL, LVCMOS, PCI, GTL+ and more |
XC2S200-6FGG753C Package Details
Fine-Pitch BGA Package Advantages
The 753-pin FBGA package offers several critical advantages for high-density applications:
- Compact Footprint: Maximizes board space utilization while providing extensive I/O connectivity
- Superior Electrical Performance: Shorter signal paths reduce inductance and improve signal integrity
- Enhanced Thermal Management: Ball grid array design facilitates efficient heat dissipation
- Reliable Solder Connections: Fine-pitch ball configuration ensures robust mechanical and electrical connections
- High-Speed Signal Support: Optimized for high-frequency operation with minimal crosstalk
Package Physical Characteristics
| Feature |
Details |
| Total Pin Count |
753 balls |
| Package Designation |
FGG753C (Fine-pitch BGA, Green/Pb-free, Commercial) |
| Mounting Type |
Surface mount technology (SMT) |
| RoHS Compliance |
Fully RoHS compliant (lead-free) |
| Moisture Sensitivity Level |
MSL 3 |
| Package Marking |
Laser-marked part identification |
Advanced Features and Capabilities
Programmable Logic Resources
The XC2S200-6FGG753C delivers comprehensive programmable logic resources:
- 5,292 Logic Cells: Each cell contains look-up tables (LUTs) and flip-flops for implementing complex Boolean functions
- 1,176 Configurable Logic Blocks: Organized in 28×42 array for efficient routing and resource utilization
- Distributed RAM: 75,264 bits of distributed memory integrated within CLBs for high-speed data storage
- Block RAM: 56 Kbits of dual-port block RAM for buffer implementation and data storage applications
Clock Management System
- Four Delay-Locked Loops (DLLs): Positioned at each corner of the die for precise clock management
- Clock Distribution Networks: Global and local clock networks ensure low-skew clock distribution
- Frequency Synthesis: Supports clock multiplication and division for flexible timing requirements
- Phase Adjustment: Fine-grained phase shifting capabilities for advanced timing control
Input/Output Architecture
The XC2S200-6FGG753C supports versatile I/O standards and configurations:
- Multiple I/O Standards: Compatible with LVTTL, LVCMOS 3.3V/2.5V/1.8V, PCI 33/66, GTL+, SSTL, and HSTL
- Programmable Drive Strength: Adjustable output drive strength for impedance matching
- Slew Rate Control: Programmable slew rate reduces EMI and signal reflections
- Input Protection: Built-in ESD protection on all I/O pins
- Differential I/O Support: Enables high-speed differential signaling applications
Application Areas for XC2S200-6FGG753C
Telecommunications Infrastructure
The XC2S200-6FGG753C excels in telecommunications applications:
- Protocol conversion and bridging
- Digital signal processing for voice and data
- Network packet processing
- Channel encoding/decoding
- Baseband signal processing
- Wireless infrastructure equipment
Industrial Control Systems
Perfect for demanding industrial environments:
- Motor control and automation
- Process monitoring and control
- Factory automation systems
- Industrial robotics control
- Sensor interface and data acquisition
- Programmable logic controllers (PLCs)
Automotive Electronics
Reliable performance for automotive applications:
- Engine control units (ECUs)
- Advanced driver assistance systems (ADAS)
- In-vehicle networking (CAN, LIN, FlexRay)
- Infotainment system processing
- Dashboard instrumentation
- Safety-critical control systems
Consumer Electronics
Versatile solution for consumer products:
- Digital video processing
- Audio signal processing and effects
- Gaming console graphics acceleration
- Set-top box functionality
- Smart home device controllers
- Portable electronic devices
Design and Development Support
Compatible Development Tools
| Tool Category |
Details |
| Design Software |
Xilinx ISE Design Suite (full support) |
| HDL Support |
VHDL, Verilog, SystemVerilog |
| Synthesis Tools |
XST (Xilinx Synthesis Technology), third-party synthesis |
| Simulation |
ModelSim, ISim, and other industry-standard simulators |
| Programming |
JTAG boundary scan, slave serial, master serial modes |
| Configuration |
Platform Flash PROMs, processor-based configuration |
Design Resources and Documentation
Engineers working with the XC2S200-6FGG753C benefit from extensive documentation:
- Complete datasheet with electrical and timing specifications
- Application notes covering design best practices
- Reference designs for common applications
- PCB layout guidelines and recommendations
- Power supply design guidance
- Thermal management considerations
Programming and Configuration Options
The XC2S200-6FGG753C offers flexible configuration methods:
- JTAG Programming: Industry-standard boundary scan for in-system programming
- Master Serial Mode: FPGA controls configuration from external PROM
- Slave Serial Mode: External controller manages configuration process
- Master/Slave Parallel: High-speed parallel configuration options
- Configuration Encryption: Optional bitstream security features
Competitive Advantages
Why Choose XC2S200-6FGG753C?
Speed Grade -6 Performance: The fastest speed grade in the commercial temperature range delivers maximum system performance for time-critical applications.
Proven Spartan-II Architecture: Leverages mature, field-tested architecture with millions of deployed units worldwide, ensuring reliability and extensive design support.
Cost-Effective Programmability: Eliminates NRE costs and reduces time-to-market compared to ASIC solutions while maintaining excellent performance.
Comprehensive I/O Support: Wide range of supported I/O standards simplifies interfacing with various components and subsystems.
Scalable Design: Design portability across Spartan-II family members enables easy migration between devices as requirements evolve.
Quality and Reliability
Manufacturing Standards
| Compliance |
Status |
| RoHS Directive |
Fully compliant (lead-free) |
| REACH Regulation |
Compliant with REACH SVHC requirements |
| ISO Certification |
Manufactured in ISO 9001 certified facilities |
| Quality Assurance |
100% tested and inspected |
| Traceability |
Full lot traceability with date/lot codes |
| ESD Sensitivity |
Human Body Model (HBM) Class 1C |
Reliability Features
The XC2S200-6FGG753C incorporates several reliability enhancements:
- Built-in CRC error checking for configuration data integrity
- Power-on reset circuitry ensures proper initialization
- Internal voltage regulators for clean power distribution
- ESD protection structures on all I/O pins
- Designed for >20 years operational lifetime under proper conditions
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG753C
- XC2S200: Device family and gate count (Spartan-II, 200K gates)
- -6: Speed grade (fastest commercial grade)
- FGG: Package type (Fine-pitch Ball Grid Array, Green/Pb-free)
- 753: Pin count (753 balls)
- C: Temperature range (Commercial: 0°C to +85°C)
Procurement Considerations
When sourcing the XC2S200-6FGG753C:
- Verify authentic parts from authorized distributors
- Check date codes for latest manufacturing revisions
- Confirm proper moisture barrier packaging (MSL 3 requirements)
- Review lead times for volume production requirements
- Consult with Xilinx FPGA specialists for technical support and availability
Power Management and Consumption
Power Supply Requirements
| Power Rail |
Typical Voltage |
Function |
| VCCINT |
2.5V ±5% |
Core logic power supply |
| VCCO |
1.8V to 3.3V |
I/O banks power supply |
| VCCAUX |
2.5V or 3.3V |
Auxiliary circuits (DLLs, etc.) |
Power Consumption Characteristics
Power consumption varies based on design utilization and switching activity:
- Quiescent Power: Minimal power when idle
- Dynamic Power: Proportional to clock frequency and toggle rate
- I/O Power: Dependent on I/O standard and drive strength
- Configuration Power: Minimal power during configuration process
Designers should utilize Xilinx XPower tools for accurate power estimation based on specific design requirements.
Thermal Management
Operating Temperature Specifications
The Commercial temperature grade (-C) operates reliably from 0°C to +85°C junction temperature, suitable for most industrial and commercial applications.
Thermal Design Considerations
Proper thermal management ensures reliable operation:
- Calculate junction temperature based on ambient conditions and power dissipation
- Utilize thermal vias under the package for improved heat spreading
- Consider heatsinks or forced airflow for high-utilization designs
- Monitor temperature during operation in thermal-critical applications
- Follow PCB design guidelines for optimal thermal performance
PCB Design Guidelines
Layout Recommendations
For optimal XC2S200-6FGG753C performance:
- Decoupling Capacitors: Place 0.1μF and 0.01μF capacitors close to each power pin
- Power Plane Design: Use solid power and ground planes for low impedance distribution
- Signal Integrity: Maintain controlled impedance for high-speed signals
- Via Design: Use appropriate via sizes for BGA breakout routing
- Thermal Relief: Implement thermal vias for heat dissipation
- EMI Mitigation: Follow proper grounding and shielding practices
BGA Mounting Considerations
The 753-ball FBGA package requires:
- PCB with compatible ball pitch and pad design
- Solder reflow profile optimized for lead-free assembly
- X-ray or automated optical inspection for solder joint verification
- Proper stencil design for consistent solder paste deposition
Comparison with Alternative FPGAs
Position in Spartan-II Family
| Device |
System Gates |
Logic Cells |
Max User I/O |
Ideal For |
| XC2S50 |
50,000 |
1,728 |
176 |
Entry-level designs |
| XC2S100 |
100,000 |
2,700 |
176 |
Mid-range applications |
| XC2S150 |
150,000 |
3,888 |
260 |
Complex systems |
| XC2S200 |
200,000 |
5,292 |
284 |
High-density designs |
The XC2S200-6FGG753C represents the flagship device in the Spartan-II family, offering maximum logic resources for the most demanding applications.
Frequently Asked Questions
Is the XC2S200-6FGG753C suitable for new designs?
While the Spartan-II family is a mature product line, it remains an excellent choice for cost-sensitive applications where proven reliability is essential. For cutting-edge applications, consider evaluating newer Xilinx families alongside Spartan-II.
What configuration memory devices are compatible?
The XC2S200-6FGG753C works with Xilinx Platform Flash PROMs (XCF series) and other compatible serial configuration memory devices that support the required bitstream size.
Can I migrate designs between different Spartan-II package options?
Yes, designs can typically be migrated between package options within the same device (XC2S200), though pin assignments will need adjustment based on package pinout differences.
What development boards support the XC2S200-6FGG753C?
Check with Xilinx partners and third-party development board manufacturers for evaluation platforms featuring Spartan-II devices. Custom prototyping boards may be required for the 753-pin package variant.
Is in-system programming supported?
Yes, the XC2S200-6FGG753C fully supports in-system programming via JTAG interface, allowing field updates and development without removing the device from the circuit board.
Conclusion
The XC2S200-6FGG753C represents a powerful, versatile FPGA solution for engineers and designers requiring high-density programmable logic with exceptional reliability. With 200,000 system gates, 5,292 logic cells, and the fastest commercial speed grade, this device delivers the performance needed for demanding digital design applications across multiple industries.
Whether you’re developing telecommunications infrastructure, industrial control systems, automotive electronics, or consumer products, the XC2S200-6FGG753C provides the programmable logic resources, I/O flexibility, and proven architecture to bring your designs to life efficiently and cost-effectively.
For technical support, design resources, and current availability of the XC2S200-6FGG753C, contact authorized Xilinx FPGA distributors or visit the AMD Xilinx website for comprehensive documentation and application support.
