The XC2S200-6FGG751C represents a powerful solution in the Spartan-II FPGA family from Xilinx (now AMD). This advanced field-programmable gate array combines exceptional performance with cost-effective design capabilities, making it ideal for high-volume applications across telecommunications, industrial control, automotive electronics, and embedded systems. With its 751-ball fine-pitch BGA package, this device offers maximum I/O density and superior thermal performance for demanding applications.
Key Specifications and Technical Features
Core Performance Characteristics
| Specification |
Value |
| Logic Cells |
5,292 cells |
| System Gates |
200,000 gates (logic and RAM) |
| CLB Array Configuration |
28 x 42 (R x C) |
| Total CLBs |
1,176 configurable logic blocks |
| Speed Grade |
-6 (highest performance) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Operating Voltage |
2.5V core voltage |
| Technology Node |
0.18μm process |
| Package Type |
FGG751 (751-ball Fine-Pitch BGA) |
Advanced Package Technology
The FGG751 package (751-ball Fine-Pitch Ball Grid Array) provides several critical advantages:
- Higher I/O Density: 751 solder balls enable maximum pin availability and signal routing flexibility
- Enhanced Thermal Management: Superior heat dissipation through the ball grid array structure
- Compact Footprint: Space-efficient design suitable for high-density PCB layouts
- Reliable Connectivity: Ball grid array technology ensures robust electrical connections
- RoHS Compliance: Lead-free (Pb-free) package option available with “G” designation
Memory Architecture and Resources
Internal Memory Configuration
| Memory Type |
Capacity |
Description |
| Distributed RAM |
75,264 bits |
Flexible RAM distributed throughout CLBs for data buffering |
| Block RAM |
56K bits |
Dedicated memory blocks for efficient data storage |
| Total RAM Resources |
131,264 bits |
Combined distributed and block RAM |
The XC2S200-6FGG751C’s dual-memory architecture provides designers with flexible options for implementing data buffers, FIFOs, lookup tables, and storage elements within their FPGA designs.
Speed Grade and Performance Capabilities
Understanding the -6 Speed Grade
The -6 speed grade designation indicates this device operates at the highest performance level within the Spartan-II XC2S200 family. Key performance metrics include:
- Maximum Operating Frequency: Up to 200 MHz system performance
- Low Propagation Delays: Optimized for time-critical applications
- Fast Setup and Hold Times: Ensures reliable high-speed data capture
- Commercial Temperature Range: -6 speed grade available exclusively for commercial applications (0°C to +85°C)
Clock Management Features
The XC2S200-6FGG751C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die, providing:
- Clock Deskewing: Eliminates clock distribution delays
- Clock Multiplication/Division: Flexible frequency synthesis
- Phase Shifting: Precise timing control for interface requirements
- Low Jitter: Stable clock signals for high-speed applications
Application Areas and Use Cases
Industry Applications
The XC2S200-6FGG751C excels in numerous applications:
Telecommunications Equipment
- Network routers and switches
- Base station controllers
- Protocol converters
- Signal processing modules
Industrial Automation
- Process control systems
- Motor control applications
- Factory automation equipment
- PLC interfaces
Consumer Electronics
- High-definition video processing
- Digital signal processing
- Audio/video equipment
- Gaming consoles
Automotive Systems
- Engine control units
- Advanced driver assistance systems (ADAS)
- Infotainment platforms
- Vehicle networking
Medical Devices
- Patient monitoring systems
- Diagnostic imaging equipment
- Laboratory instrumentation
- Medical data acquisition
Design and Development Advantages
Programmable Architecture Benefits
| Feature |
Advantage |
| Reconfigurability |
Update designs without hardware changes |
| Fast Time-to-Market |
Eliminate lengthy ASIC development cycles |
| Lower Initial Costs |
No mask charges or NRE fees |
| Design Flexibility |
Iterate and optimize designs in the field |
| Risk Reduction |
Avoid ASIC design risks and fixed functionality |
Input/Output Capabilities
The XC2S200-6FGG751C provides 284 maximum user I/O pins (excluding four dedicated global clock inputs), offering:
- Multi-standard I/O Support: Compatible with various voltage standards
- Programmable Drive Strength: Adjustable output current for impedance matching
- Slew Rate Control: Minimize signal integrity issues
- Pull-up/Pull-down Options: Integrated termination options
- Hot-swap Support: Enable live insertion capabilities
Programming and Configuration
Supported Configuration Methods
- JTAG Boundary Scan: Standard IEEE 1149.1 configuration interface
- SelectMAP: High-speed parallel configuration
- Serial Configuration: Lower pin-count configuration option
- Master/Slave Modes: Flexible system integration
Development Tool Compatibility
Design and program the XC2S200-6FGG751C using industry-standard tools:
- Xilinx ISE Design Suite
- Vivado Design Suite (for newer workflows)
- Third-party synthesis tools
- Comprehensive simulation environments
Package Dimensions and PCB Considerations
FGG751 Package Physical Characteristics
| Parameter |
Specification |
| Ball Count |
751 balls |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Ball Pitch |
Fine pitch for high density |
| Package Shape |
Square configuration |
| Mounting Type |
Surface mount technology (SMT) |
| RoHS Status |
Available in both standard and Pb-free versions |
PCB Design Guidelines
When designing with the XC2S200-6FGG751C:
- Implement proper power plane design with adequate decoupling
- Follow Xilinx PCB design guidelines for signal integrity
- Ensure adequate thermal vias for heat dissipation
- Maintain controlled impedance for high-speed signals
- Consider BGA inspection requirements in manufacturing
Power Requirements and Thermal Management
Power Specifications
- Core Voltage (VCCINT): 2.5V ±5%
- I/O Voltage (VCCO): 1.5V to 3.3V (bank-specific)
- Power Consumption: Application and design dependent
- Multiple Power Banks: Independent I/O voltage domains
Thermal Considerations
The 751-ball BGA package provides excellent thermal characteristics through its large contact area and efficient heat transfer path. Proper thermal management includes:
- Heat sink attachment (when required)
- Adequate PCB copper pour for heat spreading
- Thermal vias connecting to ground planes
- Consideration of ambient operating conditions
Quality and Reliability
Manufacturing Standards
- Process Technology: Advanced 0.18μm CMOS technology
- Quality Certification: Industrial-grade reliability testing
- Temperature Range: Commercial (0°C to +85°C) for -6 speed grade
- Lifecycle: Long-term product availability for industrial applications
Built-in Test Features
- JTAG Boundary Scan: IEEE 1149.1 compliant for board-level testing
- Readback Capability: Verify configuration data
- CRC Error Detection: Configuration integrity checking
Ordering Information and Part Number Decode
Understanding the Part Number: XC2S200-6FGG751C
- XC2S200: Device family and gate count (Spartan-II, 200K gates)
- -6: Speed grade (highest performance)
- FG: Package type (Fine-pitch Ball Grid Array)
- G: Lead-free/RoHS-compliant designation
- 751: Ball count (751-ball BGA)
- C: Commercial temperature range (0°C to +85°C)
Competitive Advantages
Why Choose XC2S200-6FGG751C?
- Cost-Effective Performance: Delivers high performance at competitive pricing
- Maximum I/O Availability: 751-ball package provides extensive connectivity options
- Proven Architecture: Mature Spartan-II platform with extensive design resources
- Flexible Integration: Supports multiple configuration methods and interfaces
- Scalable Solution: Easy migration within Spartan-II family for different resource requirements
Technical Support and Resources
Available Documentation
- Complete datasheet with DC and AC specifications
- Application notes for design best practices
- Reference designs and IP cores
- PCB layout guidelines and package drawings
Design Resources
For comprehensive technical information and design support for Xilinx FPGA products, engineers can access extensive documentation, reference designs, and community forums to accelerate their development process.
Summary: XC2S200-6FGG751C Key Benefits
The XC2S200-6FGG751C Spartan-II FPGA delivers an optimal balance of performance, I/O capacity, and cost-effectiveness for demanding embedded applications. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in a space-efficient 751-ball BGA package, this device provides engineers with the flexibility and resources needed for complex digital designs.
The -6 speed grade ensures maximum performance up to 200 MHz, while the fine-pitch BGA package enables high-density integration and superior thermal characteristics. Whether developing telecommunications equipment, industrial controllers, or consumer electronics, the XC2S200-6FGG751C offers a proven, reliable FPGA solution backed by comprehensive development tools and extensive technical support.
Quick Reference Specifications
- ✓ 200,000 system gates with 5,292 logic cells
- ✓ 751-ball fine-pitch BGA package for maximum I/O density
- ✓ -6 speed grade for highest performance (up to 200 MHz)
- ✓ 284 user I/O pins with multi-voltage support
- ✓ 56K bits block RAM plus 75,264 bits distributed RAM
- ✓ Four DLLs for advanced clock management
- ✓ Commercial temperature range operation
- ✓ RoHS-compliant lead-free package option
- ✓ Compatible with industry-standard development tools
- ✓ Cost-effective alternative to ASIC development
For engineers seeking a high-performance, field-programmable solution with extensive I/O capabilities and proven reliability, the XC2S200-6FGG751C represents an excellent choice for next-generation digital designs.
