The XC2S200-6FGG750C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s acclaimed Spartan-II family, engineered to deliver exceptional performance for complex digital design projects. This commercial-grade FPGA combines 200,000 system gates with 5,292 logic cells, providing designers with substantial resources for implementing sophisticated embedded systems, telecommunications infrastructure, and industrial automation solutions.
Built on proven 0.18μm CMOS technology, the XC2S200-6FGG750C operates at a core voltage of 2.5V and features a -6 speed grade for optimal performance in commercial temperature environments. The 750-ball Fine-Pitch Ball Grid Array (FBGA) package delivers superior thermal characteristics and enhanced signal integrity, making this device ideal for high-density applications requiring maximum I/O capabilities.
Key Technical Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II FPGA |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,576 bits total) |
| Maximum User I/O |
284 pins |
| Speed Grade |
-6 (commercial) |
| Core Voltage |
2.5V |
| Package Type |
750-ball Fine-Pitch BGA |
| Process Technology |
0.18μm CMOS |
| Operating Temperature |
0°C to +85°C (Commercial) |
Advanced Features and Capabilities
High-Density Logic Resources
The XC2S200-6FGG750C incorporates a robust 28 x 42 configurable logic block (CLB) array, delivering 1,176 total CLBs for implementing complex digital circuits. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, enabling flexible implementation of arithmetic functions, state machines, and data path logic.
Comprehensive Memory Architecture
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Small, fast buffers and FIFOs |
| Block RAM |
56K bits |
Large data storage, packet buffers |
| Total Memory |
131,840 bits |
Combined storage solutions |
The dual-column block RAM architecture provides high-speed data storage capabilities, while distributed RAM within CLBs enables efficient implementation of small memory structures and shift registers.
Maximum I/O Flexibility
With 284 maximum user I/O pins (excluding four dedicated global clock inputs), the XC2S200-6FGG750C supports extensive interfacing requirements. The device accommodates multiple I/O standards including:
- LVTTL (Low-Voltage TTL)
- LVCMOS (Low-Voltage CMOS)
- PCI 33MHz/66MHz
- GTL/GTL+
- SSTL2 and SSTL3
- HSTL Class I
Clock Management System
Four dedicated Delay-Locked Loops (DLLs) positioned at each corner of the die provide precise clock management capabilities. These DLLs enable clock deskewing, multiplication, division, and phase shifting, ensuring optimal timing performance across the entire design.
Application Areas and Use Cases
Industrial Automation and Control
The XC2S200-6FGG750C excels in industrial control applications requiring reliable programmable logic for:
- Motor control systems with precise PWM generation
- Process control and monitoring equipment
- Programmable logic controllers (PLCs)
- Machine vision and inspection systems
- Sensor interface and data acquisition
Telecommunications Infrastructure
Telecommunications equipment benefits from the XC2S200-6FGG750C’s high-speed capabilities:
- Protocol conversion and bridging
- Network packet processing
- Digital signal processing for communications
- Line card interfaces
- Wireless base station components
Consumer Electronics
Cost-sensitive consumer applications leverage the Spartan-II architecture:
- Digital video processing and format conversion
- Audio/video equipment interfaces
- Gaming console peripherals
- Display controllers
- Set-top box functionality
Medical and Scientific Instrumentation
Healthcare and research equipment utilize the XC2S200-6FGG750C for:
- Medical imaging systems
- Patient monitoring devices
- Laboratory test equipment
- Diagnostic instrumentation
- Data acquisition systems
Performance Characteristics
Speed Grade Analysis
| Speed Grade |
Maximum Frequency |
Typical Applications |
| -6 |
Up to 200 MHz |
Standard commercial designs |
| -5 |
Moderate performance |
Cost-optimized applications |
The -6 speed grade designation on the XC2S200-6FGG750C indicates optimized performance exclusively available in commercial temperature range, making it suitable for applications requiring higher clock frequencies and reduced propagation delays.
Power Efficiency
Operating at 2.5V core voltage, the device implements power-efficient design techniques:
- Low static power consumption
- Dynamic power scaling
- Flexible I/O voltage support
- Power-down modes for unused resources
Package Details: 750-Ball FBGA
Physical Characteristics
The Fine-Pitch Ball Grid Array (FBGA) package provides several advantages:
- Superior thermal performance with enhanced heat dissipation
- Reduced inductance for high-speed signal integrity
- Smaller footprint compared to traditional packages
- Increased I/O density supporting complex designs
- Reliable solder ball connections for manufacturing
PCB Design Considerations
| Parameter |
Recommendation |
| Ball Pitch |
Fine-pitch spacing |
| PCB Layers |
Minimum 6-layer recommended |
| Via Technology |
Microvias for optimal routing |
| Thermal Management |
Thermal vias to ground plane |
| Impedance Control |
50Ω for high-speed signals |
Development and Programming
Design Tools Compatibility
The XC2S200-6FGG750C is fully supported by industry-standard development environments:
- Xilinx ISE Design Suite – Complete design flow from entry to bitstream generation
- HDL Support – VHDL and Verilog hardware description languages
- IP Core Integration – Extensive IP library including processors, controllers, and interfaces
- Simulation Tools – ModelSim, ISim for functional verification
- Timing Analysis – Static timing analysis for performance optimization
Configuration Options
Multiple configuration modes support diverse application requirements:
- Master Serial – FPGA controls configuration from external PROM
- Slave Serial – External controller manages configuration
- JTAG – Boundary scan programming and debugging
- SelectMAP – High-speed parallel configuration
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG750C adheres to stringent quality standards:
- RoHS Compliant – Lead-free for environmental responsibility
- Commercial Temperature Range – 0°C to +85°C operation
- ESD Protection – Robust electrostatic discharge safeguards
- JEDEC Standards – Industry-standard package specifications
Long-Term Availability
As part of the established Spartan-II family, the XC2S200 series maintains:
- Proven field reliability across millions of units
- Comprehensive documentation and application notes
- Strong ecosystem support
- Legacy design migration paths
Competitive Advantages
Cost-Effectiveness
The Spartan-II architecture delivers exceptional value:
- Lower cost per gate compared to high-end FPGAs
- Reduced development time with mature tools
- No NRE costs unlike ASIC alternatives
- Field upgradability without hardware changes
Design Flexibility
Programmable logic provides unique advantages:
- Rapid prototyping – Implement and test designs quickly
- In-system updates – Modify functionality post-deployment
- Risk mitigation – Avoid ASIC commitment until proven
- Version management – Deploy different configurations as needed
Technical Comparison
| Feature |
XC2S200 |
XC2S150 |
XC2S100 |
| System Gates |
200,000 |
150,000 |
100,000 |
| Logic Cells |
5,292 |
3,888 |
2,700 |
| Total CLBs |
1,176 |
864 |
600 |
| Distributed RAM |
75,264 bits |
55,296 bits |
38,400 bits |
| Block RAM |
56K bits |
48K bits |
40K bits |
| Max User I/O |
284 |
260 |
176 |
Getting Started with XC2S200-6FGG750C
Evaluation and Development
Engineers beginning XC2S200-6FGG750C projects should:
- Review technical documentation – Study datasheet and user guides
- Evaluate reference designs – Leverage proven design templates
- Select development board – Choose appropriate evaluation platform
- Install design tools – Configure Xilinx ISE Design Suite
- Create initial design – Start with simple projects before scaling
Design Best Practices
Optimize XC2S200-6FGG750C implementations by:
- Utilizing synchronous design methodologies
- Implementing proper clock domain crossing techniques
- Leveraging block RAM for data-intensive applications
- Optimizing I/O placement for signal integrity
- Performing thorough timing closure analysis
Support and Resources
Comprehensive resources accelerate XC2S200-6FGG750C development:
- Product Datasheet – Complete electrical and timing specifications
- User Guides – Architecture and configuration details
- Application Notes – Design techniques and implementation guidance
- Reference Designs – Starter projects and proven implementations
- Community Forums – Peer support and knowledge sharing
For more information about Xilinx FPGA solutions and technical support, visit authorized distributors and design centers.
Conclusion
The XC2S200-6FGG750C represents a mature, reliable FPGA solution combining substantial logic resources, flexible I/O capabilities, and cost-effective implementation for a wide range of digital design applications. Its 200,000-gate capacity, comprehensive memory architecture, and 750-ball FBGA package make it an excellent choice for industrial, telecommunications, consumer, and medical electronics projects requiring programmable logic flexibility without the commitment and expense of ASIC development.
Whether you’re designing industrial control systems, telecommunications equipment, consumer devices, or scientific instrumentation, the XC2S200-6FGG750C delivers the performance, flexibility, and value needed for successful product development and deployment.
