The XC2S200-6FGG749C represents a specialized configuration within the renowned Spartan-II FPGA family from Xilinx. Built on proven 0.18-micron process technology, this field-programmable gate array delivers exceptional programmable logic capabilities for demanding embedded systems, telecommunications infrastructure, and industrial control applications.
Note: Standard XC2S200 configurations typically use FGG456 or FGG256 packaging. Please verify package specifications with your authorized distributor to ensure compatibility with your design requirements.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O Pins |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Speed Grade |
-6 (highest performance) |
| Operating Temperature |
Commercial (0°C to +85°C) |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm CMOS |
Performance Characteristics
| Parameter |
Specification |
| System Performance |
Up to 200 MHz |
| Configuration Time |
Fast configuration support |
| Delay-Locked Loops (DLLs) |
4 DLLs (one per corner) |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| RoHS Compliance |
Lead-free option available (G designation) |
XC2S200-6FGG749C Applications and Use Cases
Industrial Control Systems
The XC2S200-6FGG749C excels in factory automation, motion control, and process monitoring applications where real-time processing and high reliability are paramount.
Telecommunications Equipment
With 200,000 system gates and abundant I/O resources, this FPGA handles protocol conversion, signal processing, and network interface applications efficiently.
Consumer Electronics
Ideal for set-top boxes, digital cameras, and multimedia processing systems requiring flexible logic implementation and field upgradability.
Embedded Systems Development
Perfect for rapid prototyping and production deployment, offering significant advantages over traditional ASIC development approaches.
Technical Architecture Deep Dive
Configurable Logic Blocks (CLBs)
The XC2S200 features a robust 28×42 CLB array providing 1,176 configurable logic blocks. Each CLB contains:
- Four logic slices with look-up tables (LUTs)
- Dedicated carry logic for arithmetic operations
- Distributed RAM capabilities for efficient data storage
- Fast interconnect resources
Memory Resources
| Memory Type |
Capacity |
Organization |
| Block RAM |
56 Kbits |
Dual-port configuration |
| Distributed RAM |
75,264 bits |
Flexible, embedded in CLBs |
| Total On-Chip Memory |
131,264 bits |
Combined resources |
Input/Output Architecture
The device provides 284 maximum user I/O pins supporting multiple I/O standards including:
- LVTTL / LVCMOS (3.3V, 2.5V)
- PCI 33MHz and 66MHz
- GTL / GTL+
- SSTL2 and SSTL3
- HSTL Class I, II, III, IV
Comparison with Alternative FPGA Solutions
Spartan-II Family Positioning
| Device |
Logic Cells |
System Gates |
CLBs |
Max I/O |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
The XC2S200 sits at the top of the Spartan-II family, offering maximum logic density and I/O capability within this proven architecture.
Design Tools and Development Support
Compatible Development Environments
- Xilinx ISE Design Suite
- Xilinx Vivado (for legacy support)
- Third-party synthesis tools
- VHDL and Verilog HDL support
Configuration Methods
The XC2S200-6FGG749C supports multiple configuration modes:
- Master Serial Mode – FPGA controls configuration
- Slave Serial Mode – External controller manages process
- Slave Parallel Mode – 8-bit parallel data loading
- Boundary-Scan (JTAG) – Industry-standard programming
Advantages Over ASIC Solutions
Cost-Effectiveness
Eliminates expensive NRE (Non-Recurring Engineering) costs associated with ASIC development, making it ideal for low to medium volume production.
Time-to-Market
Dramatically reduces development cycles from months to weeks, enabling faster product launches and competitive advantage.
Field Upgradability
Unlike mask-programmed ASICs, the XC2S200-6FGG749C allows design updates and bug fixes through simple reprogramming, even after deployment.
Development Risk Mitigation
Programmable architecture eliminates the risk of costly silicon respins and design errors inherent in ASIC development.
Thermal and Power Management
Power Consumption Profile
| Power Type |
Typical Value |
| Static Power |
Low standby current |
| Dynamic Power |
Design-dependent |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (standard-dependent) |
Thermal Considerations
Ball grid array packaging provides excellent thermal dissipation characteristics, supporting operation in demanding environmental conditions within the commercial temperature range.
Quality and Reliability Standards
Manufacturing Excellence
Manufactured using Xilinx’s proven 0.18µm CMOS process technology, the XC2S200 delivers consistent performance and reliability across production lots.
Testing and Validation
- 100% functional testing
- Boundary scan support for board-level testing
- IEEE 1149.1 (JTAG) compliant
- Built-in self-test capabilities
Ordering Information and Package Options
Part Number Breakdown
XC2S200-6FGG749C
- XC2S200: Device family and gate count
- -6: Speed grade (fastest available)
- FGG749: Package type (Fine-pitch BGA, 749-ball)
- C: Commercial temperature range
Available Alternatives
For verified package availability, consider these standard XC2S200 configurations:
- XC2S200-6FGG456C (456-ball FBGA)
- XC2S200-6FGG256C (256-ball FBGA)
- XC2S200-6PQ208C (208-pin PQFP)
Learn More About Xilinx FPGA Solutions
Discover comprehensive resources, technical documentation, and design examples for Xilinx FPGA implementations across various application domains.
Frequently Asked Questions
What makes the -6 speed grade special?
The -6 speed grade represents the fastest performance option in the Spartan-II family, exclusively available in commercial temperature range. It’s optimized for applications requiring maximum system clock frequencies up to 200 MHz.
Can this FPGA replace my current ASIC design?
The XC2S200-6FGG749C offers a compelling ASIC alternative for designs requiring up to 200,000 system gates. It eliminates upfront tooling costs, reduces development time, and provides field programmability that ASICs cannot match.
What development tools are required?
Xilinx ISE Design Suite provides complete design entry, synthesis, implementation, and programming support. The software supports both VHDL and Verilog HDL design entry methods.
Is this device suitable for new designs?
While the Spartan-II family is a mature, proven architecture, designers should evaluate newer Xilinx families (Spartan-6, Spartan-7, Artix-7) for new projects to benefit from enhanced features, lower power consumption, and extended lifecycle support.
What configuration memory options are available?
The device supports external Serial PROM, Flash memory, or processor-based configuration. Multiple devices can be daisy-chained for system-level configuration.
Technical Support Resources
Documentation
- Complete datasheet with electrical specifications
- User guides and application notes
- Reference designs and example code
- PCB layout guidelines
Community and Support
Access Xilinx community forums, technical support, and extensive knowledge base for design assistance and troubleshooting.
Conclusion
The XC2S200-6FGG749C delivers robust programmable logic capabilities suitable for diverse digital design applications. With 200,000 system gates, extensive I/O resources, and proven reliability, this FPGA provides an excellent balance of performance, flexibility, and cost-effectiveness for both prototyping and production deployment.
Whether you’re developing telecommunications equipment, industrial control systems, or embedded applications, the XC2S200 architecture offers the resources and performance needed for successful implementation.
