The XC2S200-6FGG748C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for complex digital design projects. This industrial-grade programmable logic device combines robust features, superior reliability, and cost-effectiveness, making it an ideal solution for telecommunications, automotive systems, industrial automation, and embedded computing applications.

Overview of XC2S200-6FGG748C FPGA

The XC2S200-6FGG748C represents the pinnacle of the Spartan-II family, offering extensive programmable resources in a high-density 748-ball Fine-Pitch Ball Grid Array (FBGA) package. Built on Xilinx’s proven 2.5V FPGA architecture, this device provides designers with the flexibility and performance needed for demanding applications while maintaining excellent power efficiency.

What Makes XC2S200-6FGG748C Unique?

This FPGA stands out with its 200,000 system gates and 5,292 logic cells, providing substantial computational resources for complex algorithm implementation. The FGG748 package delivers maximum I/O capability with 284 user I/O pins, enabling comprehensive connectivity options for diverse system architectures. The -6 speed grade ensures optimal performance for high-speed applications requiring rapid signal processing.

XC2S200-6FGG748C Technical Specifications

Core Architecture and Logic Resources

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG748C features 1,176 Configurable Logic Blocks arranged in a 28 x 42 array, providing extensive logic implementation capabilities. Each CLB contains multiple Look-Up Tables (LUTs), flip-flops, and dedicated carry logic, enabling efficient arithmetic operations and complex state machine implementation.

Memory Architecture

This FPGA incorporates dual memory architectures for maximum flexibility:

• Distributed RAM: 75,264 bits of distributed RAM embedded within CLBs for fast, localized storage
• Block RAM: 56 Kbits of dedicated block RAM for efficient data buffering and FIFO implementations

FGG748 Package Specifications

Physical Characteristics

The Fine-Pitch Ball Grid Array (FGG748) package provides optimal signal integrity and thermal performance in a compact form factor:

• Ball Count: 748 connections
• Package Technology: Flip-chip Ball Grid Array
• Ball Pitch: Fine-pitch for high-density routing
• Thermal Performance: Enhanced heat dissipation capabilities
• Mounting: Surface-mount technology (SMT) compatible

I/O Capabilities and Connectivity

With 284 maximum user I/O pins, the XC2S200-6FGG748C offers exceptional connectivity options:

Performance Specifications

Speed Grade -6 Performance

The -6 speed grade designation indicates this device’s highest performance tier within the Spartan-II family, exclusively available in the commercial temperature range:

• Maximum System Performance: Up to 200 MHz operation
• Signal Propagation: Optimized for low-latency applications
• Clock Distribution: Four Delay-Locked Loops (DLLs) for precise timing
• Data Path Performance: Enhanced routing for high-speed designs

Key Features and Advantages

Advanced Design Capabilities

The XC2S200-6FGG748C delivers comprehensive design flexibility:

1. High Logic Density: 200,000 system gates accommodate complex algorithms
2. Flexible Memory Options: Dual RAM architecture for diverse storage requirements
3. Superior I/O Count: 284 user pins for extensive system integration
4. Clock Management: Four DLLs for precise clock synthesis and distribution
5. Fast Configuration: Rapid reconfiguration capabilities for dynamic applications

Design Implementation Benefits

Application Areas for XC2S200-6FGG748C

Telecommunications Infrastructure

The XC2S200-6FGG748C excels in telecommunications applications requiring high-speed data processing:

• Protocol converters and bridges
• Digital signal processing (DSP) acceleration
• Network interface controllers
• Communication protocol implementation
• Data packet processing engines

Industrial Automation and Control

Industrial applications benefit from the device’s reliability and I/O capabilities:

• Motor control systems
• PLC (Programmable Logic Controller) implementations
• Sensor interface and data acquisition
• Real-time control algorithms
• Industrial networking protocols

Automotive Electronics

The commercial temperature range and robust design support automotive applications:

• Engine control unit (ECU) prototyping
• Advanced driver assistance systems (ADAS)
• In-vehicle networking
• Instrument cluster controllers
• Automotive sensor fusion

Consumer Electronics

High-volume consumer products leverage cost-effectiveness and flexibility:

• Digital video processing
• Audio DSP applications
• Gaming console logic
• Set-top box implementations
• Display controller interfaces

Design Tools and Development Resources

Xilinx ISE Design Suite

The XC2S200-6FGG748C integrates seamlessly with Xilinx development tools:

• Synthesis Tools: Efficient logic synthesis and optimization
• Place and Route: Advanced algorithms for optimal resource utilization
• Timing Analysis: Comprehensive timing verification and constraint management
• Simulation: Behavioral and post-layout simulation capabilities
• Programming Tools: Multiple configuration methods including JTAG and serial modes

Documentation and Support

Comprehensive technical resources facilitate successful implementation:

• Complete datasheet with electrical and timing specifications
• Application notes for common design patterns
• Reference designs for standard interfaces
• PCB layout guidelines for FGG748 package
• Design constraint files (UCF) for pin planning

Ordering Information and Part Number Breakdown

XC2S200-6FGG748C Part Number Decoded

Understanding the part number structure:

• XC2S200: Device family and logic capacity (Spartan-II, 200K gates)
• -6: Speed grade (highest performance tier)
• FGG748: Package type (Fine-pitch BGA, 748 balls)
• C: Commercial temperature range (0°C to +85°C)

Package Options and Alternatives

Power Supply and Thermal Considerations

Power Requirements

The XC2S200-6FGG748C operates on a 2.5V core voltage with proper power distribution:

• Core Voltage (VCCINT): 2.5V ±5%
• I/O Voltage (VCCO): Configurable per bank, supports multiple standards
• Auxiliary Voltage: As required for specific I/O standards
• Power Consumption: Depends on design utilization and toggle rates

Thermal Management

The FGG748 package provides enhanced thermal characteristics:

• Ball grid array design facilitates efficient heat transfer
• Thermal vias recommended for optimal cooling
• Junction temperature monitoring for reliability
• Package thermal resistance specifications available in datasheet

Configuration and Programming

Configuration Methods

Multiple configuration options provide design flexibility:

1. JTAG Interface: Boundary-scan testing and in-circuit programming
2. Master Serial Mode: Direct connection to configuration PROM
3. Slave Serial Mode: Host processor-controlled configuration
4. SelectMAP Mode: High-speed parallel configuration interface

Configuration Memory Requirements

Configuration bitstream storage options:

• Compatible Xilinx configuration PROMs
• External flash memory support
• One-time programmable (OTP) solutions
• Reconfigurable system designs

Quality and Reliability

Manufacturing Standards

The XC2S200-6FGG748C meets stringent quality requirements:

• RoHS Compliance: Lead-free packaging options available (FGG designation with “G”)
• Manufacturing Process: Advanced semiconductor fabrication
• Quality Assurance: Comprehensive testing and screening
• Reliability Testing: Extended temperature cycling and stress testing

Long-Term Availability

Xilinx maintains product longevity support:

• Extended product lifecycle management
• Automotive-grade variants for critical applications
• Comprehensive supply chain support
• Migration paths to newer device families

Competitive Advantages of XC2S200-6FGG748C

Why Choose This FPGA?

The XC2S200-6FGG748C offers distinct advantages over alternative solutions:

1. Proven Architecture: Mature Spartan-II platform with extensive design heritage
2. Maximum I/O Density: 284 pins in FGG748 package exceed smaller package options
3. Cost-Performance Balance: Industrial-grade features at competitive pricing
4. Comprehensive Ecosystem: Extensive third-party IP cores and reference designs
5. Design Reuse: Pin-compatible migration paths within Spartan-II family

Getting Started with XC2S200-6FGG748C

Development Board Recommendations

Accelerate your design with evaluation platforms:

• Spartan-II development kits with FGG748 socket
• Custom evaluation boards for specific applications
• Expansion modules for peripheral interfaces
• Educational platforms for training and prototyping

First Steps for New Designers

1. Download Tools: Obtain Xilinx ISE WebPACK or full version
2. Review Documentation: Study datasheet and application notes
3. Start Simple: Begin with basic logic designs to understand architecture
4. Use Reference Designs: Leverage proven IP cores for common functions
5. Join Community: Participate in Xilinx forums for peer support

Purchase and Distribution

Where to Buy XC2S200-6FGG748C

The XC2S200-6FGG748C is available through authorized distribution channels:

• Authorized Xilinx distributors worldwide
• Major electronics component suppliers
• Online marketplaces for small quantities
• Direct from manufacturer for volume orders

For comprehensive information about Xilinx FPGA products and additional resources, visit specialized FPGA resource centers.

Pricing Considerations

Pricing varies based on several factors:

• Order Quantity: Volume discounts available for production runs
• Distribution Channel: Pricing differences between distributors
• Package Options: FGG748 premium versus smaller packages
• Lead Time: Stock versus custom order fulfillment

Frequently Asked Questions

What is the difference between FGG748 and other packages?

The FGG748 package provides the maximum number of I/O pins (284) for the XC2S200 device, making it ideal for applications requiring extensive connectivity. Smaller packages like FG456 or PQ208 have fewer I/O pins but offer reduced footprint for space-constrained designs.

Can I use the -6 speed grade in industrial temperature range?

No, the -6 speed grade is exclusively available in the commercial temperature range (C designation, 0°C to +85°C). For industrial temperature requirements (-40°C to +100°C), consider the -5 speed grade with I temperature designation.

What configuration PROM should I use?

The XC2S200 requires configuration memory appropriate for its bitstream size. Xilinx XCF series PROMs or compatible serial flash devices can store the configuration data. Consult the configuration guide for specific part number recommendations.

Is this device suitable for new designs?

While the Spartan-II family is a mature product line, the XC2S200-6FGG748C remains suitable for cost-sensitive applications and designs where the feature set meets requirements. For new high-performance designs, consider evaluating newer Xilinx families like Spartan-6 or 7 Series.

What development tools are required?

Xilinx ISE Design Suite is the primary development environment for Spartan-II devices. The free WebPACK version supports XC2S200 for most applications, while the full ISE suite provides additional advanced features.

Conclusion: XC2S200-6FGG748C for Your Next Project

The XC2S200-6FGG748C delivers exceptional value for designers requiring a balance of logic capacity, I/O density, and performance in a proven FPGA platform. With 200,000 system gates, 284 user I/O pins, and the highest-performance -6 speed grade, this device addresses diverse application requirements from telecommunications to industrial control.

Whether you’re developing a high-speed communication interface, implementing complex control algorithms, or prototyping a custom digital system, the XC2S200-6FGG748C provides the programmable logic resources and flexibility to bring your design to reality. The extensive Xilinx ecosystem, comprehensive documentation, and proven reliability make this FPGA an excellent choice for both prototyping and production deployment.

Start your next FPGA project with confidence using the XC2S200-6FGG748C – where performance, reliability, and cost-effectiveness converge in a single, powerful programmable logic solution.