The XC2S200-6FGG747C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional programmable logic solutions for complex digital applications. This commercial-grade device combines robust performance with cost-effectiveness, making it an ideal choice for telecommunications, industrial automation, embedded systems, and consumer electronics projects.

Built on proven 0.18-micron technology, the XC2S200-6FGG747C offers superior flexibility compared to traditional mask-programmed ASICs, eliminating initial tooling costs and lengthy development cycles while enabling field upgrades without hardware replacement.

Technical Specifications

Core Architecture Features

Package Configuration

The FGG747 package delivers excellent thermal performance and high pin density, optimizing board space utilization while maintaining reliable electrical connections for high-speed signal integrity.

Key Performance Characteristics

Processing Capabilities

The XC2S200-6FGG747C operates at system frequencies up to 200 MHz, providing ample processing power for demanding real-time applications. The -6 speed grade designation ensures optimal performance under various operational conditions, delivering faster propagation delays and setup times compared to slower speed grades.

Memory Resources

With 56K bits of dedicated block RAM and over 75,000 bits of distributed RAM, this FPGA supports complex data buffering, FIFO implementations, and embedded memory requirements. The dual-port block RAM architecture enables simultaneous read/write operations, enhancing system throughput.

I/O Flexibility

The device features 284 maximum available user I/O pins (excluding four dedicated global clock inputs), supporting multiple I/O standards for seamless integration with various system interfaces. Each I/O block includes programmable slew rate control, pull-up/pull-down resistors, and support for differential signaling protocols.

Application Areas

Telecommunications and Networking

The XC2S200-6FGG747C excels in communication systems requiring high-speed data processing and protocol implementation. Applications include:

• Network routers and switches
• Protocol converters and bridges
• Digital signal processing for communications
• Baseband processing units
• Software-defined radio components

Industrial Automation

For industrial applications, this FPGA facilitates precision control and automation:

• Motor control systems with PWM generation
• Process control and monitoring equipment
• Industrial networking protocols (EtherCAT, PROFINET)
• Sensor interface and data acquisition
• Programmable logic controller (PLC) replacements

Consumer Electronics

The device supports various consumer applications demanding programmable logic:

• Digital set-top boxes and media players
• Display controllers and graphics acceleration
• Audio/video processing and encoding
• Gaming console peripherals
• Smart home automation hubs

Automotive Systems

Automotive applications benefit from the FPGA’s reliability and reconfigurability:

• Advanced driver assistance systems (ADAS)
• In-vehicle infotainment interfaces
• Sensor fusion processors
• Electronic control unit (ECU) prototyping
• Vehicle network gateways

Design and Development Resources

Development Tools

ISE Design Suite: The XC2S200-6FGG747C is supported by Xilinx ISE (Integrated Software Environment) development tools, providing comprehensive design entry, synthesis, implementation, and verification capabilities. The toolchain includes:

• Schematic and HDL design entry
• RTL synthesis and optimization
• Place and route automation
• Timing analysis and simulation
• Built-in configuration generation

Programming Languages: Designers can implement logic using Verilog HDL, VHDL, or schematic capture methods, with full support for behavioral, structural, and dataflow modeling paradigms.

Configuration Options

The device includes four Delay-Locked Loops (DLLs) positioned at each corner of the die, providing precise clock management, phase shifting, and clock multiplication/division capabilities for complex timing requirements.

Comparison with Alternative Packages

Package Options Comparison

The FGG747 package provides the maximum number of user I/O pins available for the XC2S200 device, making it suitable for applications requiring extensive external connectivity and interface flexibility.

Advantages Over ASIC Solutions

Cost-Effectiveness

The XC2S200-6FGG747C eliminates the substantial non-recurring engineering (NRE) costs associated with ASIC development, which can range from hundreds of thousands to millions of dollars. This makes it economically viable for:

• Low to medium volume production
• Rapid prototyping and proof-of-concept
• Product iterations requiring design changes
• Time-sensitive market entry

Design Flexibility

Unlike fixed-function ASICs, the FPGA architecture allows:

• Field updates: Modify functionality after deployment
• Bug fixes: Correct design errors without hardware respins
• Feature additions: Enhance products with new capabilities
• Design reuse: Reprogram for different applications

Reduced Time-to-Market

FPGA-based designs significantly accelerate development schedules:

• Immediate design verification and testing
• Parallel hardware/software development
• Iterative refinement without fabrication delays
• Quick response to market changes

Power Consumption Considerations

The XC2S200-6FGG747C features optimized power management:

• Low static power: Efficient standby power consumption
• Dynamic power scaling: Power consumption proportional to active logic
• Clock gating support: Disable unused logic blocks
• Voltage optimization: 2.5V core reduces power requirements

Actual power consumption varies based on design utilization, clock frequencies, and switching activity. Power estimation tools within the ISE Design Suite provide accurate power budgeting during development.

Quality and Reliability

Manufacturing Standards

AMD Xilinx manufactures the XC2S200-6FGG747C using advanced semiconductor processes with rigorous quality control:

• ISO 9001 certified manufacturing facilities
• Comprehensive device testing and screening
• Established reliability qualification procedures
• Long-term product availability commitment

Environmental Compliance

The device is available in both standard and lead-free (Pb-free) packaging options, denoted by the “G” character in Pb-free variants. Lead-free packages comply with RoHS (Restriction of Hazardous Substances) directives, ensuring environmentally responsible manufacturing.

Ordering Information and Availability

Part Number Breakdown

XC2S200-6FGG747C

• XC2S200: Device type (Spartan-II, 200K gates)
• -6: Speed grade (fastest commercial option)
• FGG747: Package type and pin count
• C: Commercial temperature range (0°C to +85°C)

Procurement Considerations

When sourcing the XC2S200-6FGG747C:

• Verify authentic AMD Xilinx components from authorized distributors
• Check current stock availability and lead times
• Request volume pricing for production quantities
• Confirm package marking and date codes
• Validate RoHS compliance requirements for your region

For current pricing, availability, and technical support, consult authorized Xilinx FPGA distributors or contact AMD Xilinx directly.

Implementation Best Practices

Design Guidelines

To maximize performance and reliability:

Power Distribution:

• Implement proper decoupling capacitors near power pins
• Use dedicated power planes for clean voltage distribution
• Monitor current requirements across all power domains

Clock Management:

• Utilize DLL resources for clock conditioning
• Minimize clock skew across global networks
• Implement proper clock domain crossing techniques

Thermal Management:

• Ensure adequate airflow for convection cooling
• Consider heat sink attachment for high-utilization designs
• Monitor junction temperature during operation

Signal Integrity

For optimal signal quality in FGG747 BGA applications:

• Follow controlled impedance routing guidelines
• Maintain appropriate trace spacing and lengths
• Implement proper termination for high-speed signals
• Use ground planes to reduce electromagnetic interference

Support and Documentation

Technical Resources

Comprehensive documentation supports XC2S200-6FGG747C implementation:

• Datasheet: Complete electrical specifications, DC/AC parameters, and timing characteristics
• User Guides: Detailed architecture documentation and programming guidelines
• Application Notes: Design best practices, reference designs, and implementation examples
• PCB Layout Guidelines: Package-specific routing recommendations and footprint libraries

Community and Forums

Access technical expertise through:

• AMD Xilinx support forums and knowledge base
• Design community discussions and shared solutions
• Training webinars and tutorial resources
• Direct technical support from field applications engineers

Conclusion

The XC2S200-6FGG747C represents a powerful, flexible solution for complex digital design challenges. With 200,000 system gates, 5,292 logic cells, and 284 maximum user I/O pins in the high-density FGG747 package, this Spartan-II FPGA delivers exceptional performance for telecommunications, industrial, automotive, and consumer electronics applications.

Its superior advantages over traditional ASIC solutions—including eliminated NRE costs, rapid time-to-market, and field programmability—make it an economically compelling choice for both prototype development and volume production. The -6 speed grade ensures maximum performance, while comprehensive development tool support and extensive documentation facilitate efficient design implementation.

Whether developing advanced communication systems, industrial automation controllers, or embedded processing platforms, the XC2S200-6FGG747C provides the programmable logic resources, I/O flexibility, and reliability required for demanding applications in today’s rapidly evolving technology landscape.