The XC2S200-6FGG746C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, delivering exceptional performance and versatility for complex digital applications. This premium 746-ball fine-pitch BGA package offers maximum I/O capability and robust processing power for demanding embedded systems, telecommunications, industrial automation, and automotive applications.
Overview of XC2S200-6FGG746C FPGA
The XC2S200-6FGG746C represents the pinnacle of the Spartan-II XC2S200 series, featuring the largest pin count package option available. Built on proven 0.18-micron technology, this FPGA combines cost-effectiveness with high-performance capabilities, making it an ideal choice for applications requiring extensive input/output connectivity and substantial logic resources.
Key Features and Specifications
The XC2S200-6FGG746C delivers impressive technical specifications designed to meet the requirements of complex digital designs:
| Feature |
Specification |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O Pins |
284 pins (FGG746 package) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Operating Voltage |
2.5V core voltage |
| Speed Grade |
-6 (highest performance) |
| Package Type |
746-ball Fine-Pitch BGA |
| Technology Node |
0.18µm CMOS process |
Technical Architecture and Performance
Advanced FPGA Architecture
The XC2S200-6FGG746C utilizes Xilinx’s proven Spartan-II architecture, featuring a hierarchical array of configurable logic blocks (CLBs) that provide maximum flexibility for digital design implementation. Each CLB contains four logic slices with look-up tables (LUTs), flip-flops, and multiplexers, enabling efficient implementation of complex combinational and sequential logic functions.
Speed Grade and Performance Characteristics
The -6 speed grade designation indicates this device operates at the highest performance tier within the XC2S200 family, supporting system frequencies up to 200 MHz. This premium speed grade ensures optimal timing performance for high-speed digital applications, including:
- High-throughput data processing
- Real-time signal processing applications
- High-speed communication protocols
- Time-critical control systems
FGG746 Package Advantages
| Package Feature |
Benefit |
| 746-ball configuration |
Maximum I/O availability for complex interfacing |
| Fine-pitch BGA design |
Optimized signal integrity and reduced parasitics |
| Commercial temperature range |
0°C to +85°C operation |
| Advanced thermal performance |
Efficient heat dissipation for reliable operation |
| Industry-standard footprint |
Simplified PCB layout and manufacturing |
Memory Architecture and Resources
Distributed RAM Configuration
The XC2S200-6FGG746C provides 75,264 bits of distributed RAM embedded within the CLB structure. This distributed memory offers:
- High-speed access with minimal latency
- Flexible configuration as single-port or dual-port RAM
- Integration directly within logic fabric for optimal performance
- Ideal for FIFO buffers, small lookup tables, and data caching
Block RAM Resources
With 56 Kbits of dedicated block RAM, the device supports larger memory requirements for:
- Data buffering and packet processing
- Image and video processing applications
- DSP coefficient storage
- Microprocessor program and data memory
Application Areas and Use Cases
Telecommunications and Networking
The XC2S200-6FGG746C excels in telecommunications infrastructure, supporting implementation of:
- Protocol converters and bridges
- Network packet processors
- Digital signal processing for communications
- High-speed serial interface controllers
Industrial Automation and Control
Industrial applications benefit from the device’s reliability and reconfigurability:
- Motor control and servo systems
- PLC (Programmable Logic Controller) functionality
- Industrial protocol implementation
- Sensor data acquisition and processing
Automotive Electronics
The FPGA meets automotive industry requirements for:
- Advanced driver assistance systems (ADAS)
- Infotainment system controllers
- Vehicle network gateways
- Diagnostic and testing equipment
Medical and Scientific Instrumentation
Medical device applications leverage the XC2S200-6FGG746C for:
- Medical imaging systems
- Patient monitoring equipment
- Laboratory diagnostic instruments
- Data acquisition and analysis systems
Design Resources and Development Support
Development Tools Compatibility
| Tool/Software |
Compatibility |
| ISE Design Suite |
Full support for synthesis, implementation, and simulation |
| FPGA Editor |
Advanced placement and routing visualization |
| ChipScope Pro |
In-system debugging and verification |
| ModelSim/ISim |
Behavioral and timing simulation |
Programming and Configuration
The XC2S200-6FGG746C supports multiple configuration methods:
- JTAG boundary-scan programming
- Master/Slave serial configuration
- SelectMAP parallel configuration
- Configuration PROM support
Electrical Characteristics and Power Management
Power Supply Requirements
| Power Domain |
Voltage |
Application |
| VCCINT |
2.5V ± 5% |
Core logic supply |
| VCCO |
1.5V to 3.3V |
I/O bank supply voltage |
| VCCAUX |
2.5V |
DLL and auxiliary circuits |
Power Consumption Optimization
The device features multiple power-saving capabilities:
- Selective I/O standard configuration for reduced power
- Unused logic automatic power-down
- Optimized routing to minimize dynamic power
- Low static power consumption
Quality and Reliability Standards
Manufacturing and Compliance
The XC2S200-6FGG746C meets stringent quality standards:
- RoHS compliant (Pb-free “G” package option available)
- JEDEC moisture sensitivity level (MSL) rated
- Automotive-grade variants available
- ISO 9001 certified manufacturing
Temperature Specifications
| Temperature Range |
Application Type |
| Commercial (C): 0°C to +85°C |
Standard applications |
| Industrial (I): -40°C to +100°C |
Extended temperature requirements |
Getting Started with XC2S200-6FGG746C
Ordering and Availability
When ordering the XC2S200-6FGG746C, the part number breaks down as follows:
- XC2S200: Device family and gate count
- 6: Speed grade (highest performance)
- FGG746: Package type (746-ball Fine-Pitch BGA)
- C: Commercial temperature range
Design Resources and Documentation
Engineers implementing the XC2S200-6FGG746C have access to comprehensive documentation:
- Complete datasheet with electrical specifications
- Application notes for common design patterns
- Reference designs and IP cores
- PCB layout guidelines and footprint files
- Thermal management guidelines
Why Choose XC2S200-6FGG746C
Competitive Advantages
- Maximum I/O Capability: The 746-ball package provides the highest user I/O count in the XC2S200 family, ideal for applications requiring extensive external connectivity.
- Proven Reliability: Spartan-II architecture has been deployed in millions of applications worldwide, demonstrating long-term reliability and field-proven performance.
- Cost-Effective Solution: Compared to ASIC development, the XC2S200-6FGG746C eliminates NRE costs, reduces time-to-market, and enables field upgrades.
- Design Flexibility: Reconfigurability allows for product updates, bug fixes, and feature enhancements without hardware changes.
- Comprehensive Ecosystem: Extensive third-party IP cores, development boards, and design services accelerate development cycles.
XC2S200-6FGG746C vs. Alternative Solutions
Comparison with Other Package Options
| Package |
User I/O |
Ball Count |
Best For |
| FGG746 |
284 |
746 |
Maximum I/O applications |
| FG456 |
176 |
456 |
Balanced I/O and size |
| FG256 |
176 |
256 |
Compact designs |
| PQ208 |
140 |
208 |
Cost-sensitive applications |
Technical Support and Resources
For comprehensive support on <a href=”https://pcbsync.com/xilinx-fpga/”>Xilinx FPGA</a> implementation, engineers can access extensive online resources, community forums, and technical documentation. The XC2S200-6FGG746C is backed by Xilinx’s global technical support network, ensuring successful project completion.
Conclusion
The XC2S200-6FGG746C stands as a premium choice for engineers requiring maximum I/O capability combined with substantial logic resources. Its 746-ball fine-pitch BGA package, -6 speed grade performance, and comprehensive feature set make it ideal for demanding applications across telecommunications, industrial, automotive, and medical sectors. With proven Spartan-II architecture and extensive development tool support, the XC2S200-6FGG746C delivers exceptional value for complex FPGA-based designs.
Whether you’re developing next-generation telecommunications equipment, advanced industrial controllers, or sophisticated medical instrumentation, the XC2S200-6FGG746C provides the performance, flexibility, and reliability needed to bring innovative products to market successfully.
