The XC2S200-6FGG745C represents a powerful member of AMD Xilinx’s renowned Spartan-II FPGA family, delivering exceptional programmable logic capabilities for diverse digital applications. This commercial-grade field-programmable gate array combines robust performance with cost-effectiveness, making it an ideal solution for telecommunications, industrial automation, consumer electronics, and embedded system designs.
Manufactured using advanced 0.18-micron process technology, the XC2S200-6FGG745C offers engineers and designers a flexible platform to implement complex digital circuits without the high costs and lengthy development cycles associated with traditional ASICs. The device’s reconfigurable architecture enables design updates and modifications in the field, providing unprecedented flexibility for evolving project requirements.
Key Features and Technical Specifications
Core Architecture and Logic Resources
The XC2S200-6FGG745C is built on a sophisticated architecture that provides substantial computational resources for demanding applications:
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
1,176 (28 x 42 array) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Maximum User I/O |
284 pins |
Performance Characteristics
| Parameter |
Specification |
| Speed Grade |
-6 (fastest commercial grade) |
| System Performance |
Up to 263 MHz |
| Core Voltage |
2.5V |
| Process Technology |
0.18 µm |
| Temperature Range |
Commercial (0°C to +85°C) |
Package Information: FGG745
The FGG745 package designation indicates a Fine-Pitch Ball Grid Array configuration with 745 balls, offering:
- Package Type: Fine-Pitch BGA (FBGA)
- Total Pin Count: 745 pins
- Form Factor: Square ball grid array
- Mounting Type: Surface mount technology (SMT)
- Enhanced thermal performance for reliable operation
- Excellent signal integrity for high-speed applications
- Optimized footprint for complex PCB designs
XC2S200-6FGG745C Design Architecture
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG745C features 1,176 configurable logic blocks arranged in a 28 x 42 matrix, providing the foundation for implementing complex digital functions. Each CLB contains:
- Look-up tables (LUTs) for combinatorial logic
- Flip-flops for sequential logic implementation
- Multiplexers for flexible signal routing
- Fast carry logic for arithmetic operations
Memory Architecture
The device incorporates dual memory architectures for maximum flexibility:
Distributed RAM: 75,264 bits of distributed memory integrated within CLBs, ideal for small, fast memory structures like FIFOs, shift registers, and small buffers.
Block RAM: 56K bits of dedicated block memory organized in efficient columns, perfect for larger data storage requirements such as packet buffers, lookup tables, and data caching.
Input/Output Resources
With up to 284 user I/O pins, the XC2S200-6FGG745C supports:
- Multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL)
- Programmable drive strength
- Programmable slew rate control
- Individual I/O banking for voltage flexibility
- Advanced I/O features including DDR registers
Clock Management with DLL
Four Delay-Locked Loops (DLLs) positioned at each corner provide sophisticated clock management:
- Clock deskewing and distribution
- Clock frequency multiplication and division
- Phase shifting capabilities
- Reduced clock-to-output delays
- Enhanced system timing performance
Applications and Use Cases
Telecommunications and Networking
The XC2S200-6FGG745C excels in communication infrastructure applications:
- Protocol conversion and bridging
- Network packet processing
- Digital signal processing for modems
- Baseband processing for wireless systems
- Router and switch implementations
Industrial Control and Automation
Industrial applications benefit from the device’s reliability and flexibility:
- Programmable logic controllers (PLCs)
- Motor control systems
- Process control interfaces
- Sensor data acquisition and processing
- Real-time control systems
Consumer Electronics
Consumer product designers leverage the XC2S200-6FGG745C for:
- Set-top boxes and media players
- Digital imaging and camera systems
- Audio/video processing equipment
- Gaming console components
- Display controllers and interfaces
Automotive and Embedded Systems
Automotive and embedded applications utilize:
- Advanced driver assistance systems (ADAS)
- In-vehicle infotainment systems
- Engine control interfaces
- CAN bus protocol implementations
- Dashboard and instrument cluster control
Development Tools and Software Support
Design Software
Xilinx ISE Design Suite provides comprehensive development support for the XC2S200-6FGG745C:
- Synthesis and implementation tools
- Timing analysis and optimization
- Power analysis utilities
- Simulation and verification environments
- Bitstream generation and configuration
IP Cores and Libraries
Access to extensive intellectual property includes:
- Processor cores (MicroBlaze, PicoBlaze)
- Communication protocol cores
- DSP functions and algorithms
- Memory controllers
- Interface IP (PCIe, Ethernet, USB)
Programming and Configuration
Multiple configuration options support diverse deployment scenarios:
- JTAG boundary scan programming
- Master serial configuration mode
- Slave serial and parallel modes
- Platform Flash PROM configuration
- In-system reconfiguration capability
Advantages Over Traditional ASIC Solutions
Cost Effectiveness
| Advantage |
Benefit |
| No NRE Costs |
Eliminates expensive mask and tooling fees |
| Lower MOQ |
Small volume production without inventory risk |
| Faster Time-to-Market |
Immediate availability without fabrication delays |
| Design Iteration |
Rapid prototyping and refinement cycles |
Flexibility and Upgradability
Unlike fixed-function ASICs, the XC2S200-6FGG745C offers:
- Field-upgradable firmware without hardware changes
- Bug fixes and feature enhancements post-deployment
- Product differentiation through software updates
- Extended product lifecycle management
- Risk mitigation for evolving standards
Technical Documentation and Resources
Available Documentation
Engineers can access comprehensive technical resources:
- Complete Datasheet: Electrical characteristics, DC/AC parameters, absolute maximum ratings
- User Guides: Implementation guidelines, best practices, design constraints
- Application Notes: Reference designs, optimization techniques, interface examples
- PCB Layout Guidelines: Package dimensions, thermal considerations, routing recommendations
Development Support
Additional resources include:
- Online design tutorials and webinars
- Community forums and knowledge base
- Technical support from authorized distributors
- Reference designs and example projects
- Xilinx FPGA comprehensive resources and guides
Package and Ordering Information
Part Number Breakdown
XC2S200-6FGG745C
- XC2S200: Device family and gate count (200K system gates)
- 6: Speed grade (fastest commercial grade)
- FGG745: Package type (745-ball Fine-Pitch BGA)
- C: Commercial temperature range (0°C to +85°C)
Quality and Compliance
| Standard |
Status |
| RoHS Compliance |
Available in RoHS-compliant versions (with “G” suffix) |
| Quality Standards |
Automotive AEC-Q100 qualification available |
| Moisture Sensitivity |
MSL 3 rating for proper handling |
| Lead-Free Options |
Pb-free packaging available |
Package Physical Characteristics
- Package Dimensions: Optimized for high-density boards
- Ball Pitch: Fine-pitch for maximum I/O density
- Thermal Performance: Enhanced heat dissipation capabilities
- Reliability: Proven BGA interconnect technology
Comparison with Similar Devices
XC2S200 Package Variants
| Package |
Pin Count |
Dimensions |
Typical Applications |
| FGG745 |
745 |
Larger footprint |
Maximum I/O requirements |
| FGG456 |
456 |
Medium footprint |
Balanced I/O density |
| FG256 |
256 |
Compact footprint |
Space-constrained designs |
| PQ208 |
208 |
Quad flat pack |
Through-hole compatible |
Performance Positioning
The -6 speed grade represents the fastest commercial option for the XC2S200 family, offering:
- Minimum propagation delays
- Maximum operating frequencies
- Optimized critical path performance
- Best-in-class timing margins
Power Management and Thermal Considerations
Power Supply Requirements
The XC2S200-6FGG745C operates from standard power supplies:
- VCCINT (Core): 2.5V ± 5%
- VCCO (I/O banks): 1.5V to 3.3V configurable
- Power sequencing: Recommended but not mandatory
- Decoupling: Standard practices for stable operation
Thermal Management
Effective thermal design ensures reliable operation:
- Junction temperature monitoring recommended
- Adequate airflow for convection cooling
- Heat sink attachment for high-power applications
- Thermal vias for enhanced PCB heat spreading
Getting Started with XC2S200-6FGG745C
Design Flow Overview
- Specification: Define system requirements and constraints
- HDL Coding: Write Verilog or VHDL design descriptions
- Simulation: Verify functional correctness
- Synthesis: Convert HDL to gate-level netlist
- Implementation: Place and route design resources
- Timing Analysis: Verify timing requirements met
- Configuration: Generate bitstream and program device
Best Practices for Success
- Utilize clock domain crossing protocols properly
- Implement robust reset strategies
- Apply timing constraints accurately
- Leverage block RAM for efficiency
- Consider power optimization techniques
- Plan I/O banking and voltage requirements
Frequently Asked Questions
What distinguishes the FGG745 package from other options?
The FGG745 package provides the maximum pin count available for the XC2S200 device, offering 745 balls for applications requiring extensive I/O connectivity, complex signal routing, or maximum design flexibility.
Is the XC2S200-6FGG745C suitable for new designs?
While the Spartan-II family represents mature FPGA technology, the XC2S200-6FGG745C remains suitable for cost-sensitive applications, legacy system support, and designs where proven reliability outweighs cutting-edge features.
What temperature ranges are available?
The “C” suffix indicates commercial temperature range (0°C to +85°C). Industrial temperature variants may be available under different part numbers.
How does the -6 speed grade affect performance?
The -6 speed grade offers the fastest timing characteristics within the commercial temperature range, enabling higher system clock frequencies and reduced propagation delays compared to slower speed grades.
What programming interfaces are supported?
The device supports JTAG programming for development, along with multiple configuration modes including master/slave serial, parallel, and Platform Flash PROM for production deployment.
Conclusion: Why Choose XC2S200-6FGG745C
The XC2S200-6FGG745C delivers a compelling combination of performance, flexibility, and value for FPGA-based digital designs. With 200,000 system gates, 5,292 logic cells, and 745-pin BGA packaging, this device provides ample resources for complex applications while maintaining cost-effectiveness.
Key benefits include:
- Proven Spartan-II architecture with extensive design heritage
- Fastest commercial speed grade for optimal performance
- Maximum I/O availability through FGG745 package
- Comprehensive development tools and IP library support
- Superior alternative to ASICs with lower cost and faster deployment
- Field-upgradable design for long-term product evolution
Whether you’re developing telecommunications equipment, industrial control systems, consumer electronics, or embedded applications, the XC2S200-6FGG745C provides the programmable logic resources, performance characteristics, and flexibility needed for successful product implementation.
For engineers seeking a reliable, well-supported FPGA solution with extensive I/O capabilities and proven performance, the XC2S200-6FGG745C represents an excellent choice that balances technical capability with practical deployment considerations.
