The XC2S200-6FGG740C represents a powerful field-programmable gate array solution from AMD Xilinx’s proven Spartan-II family. This advanced FPGA delivers exceptional performance with 200,000 system gates, making it an ideal choice for demanding digital design applications across telecommunications, industrial automation, and embedded systems.
Overview of XC2S200-6FGG740C FPGA Technology
The XC2S200-6FGG740C stands out in the Spartan-II series with its robust architecture and comprehensive feature set. Engineered on 0.18-micron process technology, this FPGA combines cost-effectiveness with high performance, offering designers a flexible platform for implementing complex digital circuits without the lengthy development cycles associated with traditional ASICs.
Key Features and Specifications
The XC2S200-6FGG740C incorporates cutting-edge FPGA technology designed to meet modern design requirements. With its speed grade -6 designation, this device ensures optimal performance across various operating conditions while maintaining commercial temperature range compliance.
Technical Specifications Table
| Specification |
Details |
| Part Number |
XC2S200-6FGG740C |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Maximum User I/O |
284 pins |
| Package Type |
740-Ball Fine-Pitch BGA (FGG740) |
| Speed Grade |
-6 |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm |
| Operating Frequency |
Up to 263 MHz |
| Temperature Range |
Commercial (0°C to +85°C) |
Memory Architecture Comparison
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Fast, small data buffers and lookup tables |
| Block RAM |
56K bits |
Larger data storage, FIFO buffers, and memory-intensive applications |
| Total RAM Resources |
131,264 bits |
Combined storage for complex designs |
XC2S200-6FGG740C Architecture and Design Resources
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG740C features 1,176 configurable logic blocks arranged in a 28 x 42 array. Each CLB contains multiple logic cells equipped with lookup tables (LUTs), flip-flops, and multiplexers, providing exceptional flexibility for implementing diverse digital functions. This architecture enables designers to create custom logic circuits tailored to specific application requirements.
Input/Output Capabilities
With 284 maximum available user I/O pins, the XC2S200-6FGG740C supports extensive interfacing requirements. The 740-ball fine-pitch BGA package optimizes pin density while maintaining signal integrity, making it suitable for high-performance applications requiring numerous external connections.
Memory Resources
The dual-column block RAM architecture provides 56K bits of high-speed embedded memory, complemented by 75,264 bits of distributed RAM throughout the CLB array. This combination enables efficient data buffering, temporary storage, and complex data processing operations.
Package Information: FGG740 Fine-Pitch BGA
| Package Feature |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array |
| Total Balls |
740 |
| Package Code |
FGG740 |
| Mounting Type |
Surface Mount |
| Lead-Free Option |
Available (designated by ‘G’ in part number) |
| Ball Pitch |
Fine-Pitch spacing for high-density routing |
The FGG740 package provides superior thermal performance and electrical characteristics compared to traditional packages. The ball grid array configuration ensures reliable connections while minimizing inductance and enabling high-speed signal transmission.
Applications and Use Cases
Telecommunications Infrastructure
The XC2S200-6FGG740C excels in telecommunications applications including protocol implementation, data encoding/decoding, and network routing. Its high gate count and I/O capacity support complex communication standards and high-bandwidth data processing.
Industrial Automation and Control
For industrial environments, this FPGA enables sophisticated motor control systems, process automation, and real-time monitoring solutions. The commercial temperature range and robust architecture ensure reliable operation in demanding conditions.
Digital Signal Processing
With substantial logic resources and dedicated block RAM, the XC2S200-6FGG740C handles advanced DSP algorithms for audio processing, image manipulation, and signal filtering applications.
Embedded Systems Development
The device serves as an excellent platform for custom embedded controllers, offering flexibility for rapid prototyping and iterative design refinement without ASIC-level commitment.
Performance Characteristics Table
| Performance Metric |
Specification |
| Maximum Operating Frequency |
263 MHz |
| Logic Density |
5,292 logic cells |
| System Gates |
200,000 |
| Configuration Time |
Fast configuration via multiple modes |
| Power Consumption |
Optimized for 2.5V operation |
| Speed Grade |
-6 (Commercial temperature range exclusive) |
Design Tools and Configuration Options
Configuration Modes Supported
The XC2S200-6FGG740C supports multiple configuration modes for maximum design flexibility:
- Master Serial Mode: Device controls configuration clock
- Slave Serial Mode: External controller provides configuration clock
- Slave Parallel Mode: 8-bit parallel data interface for faster configuration
- Boundary-Scan Mode: JTAG-based configuration and testing
Development Environment
Design implementation for the XC2S200-6FGG740C utilizes industry-standard Xilinx development tools, providing comprehensive synthesis, simulation, and place-and-route capabilities. These tools optimize designs for timing, area, and power consumption.
Advantages Over ASIC Solutions
| Benefit |
XC2S200-6FGG740C FPGA |
Traditional ASIC |
| Initial Cost |
Low development cost |
High NRE costs |
| Time to Market |
Rapid deployment |
6-12 month development cycle |
| Design Flexibility |
Field-upgradeable |
Fixed after fabrication |
| Risk Mitigation |
Low risk, iterative refinement |
High risk, no changes after tape-out |
| Production Volume |
Cost-effective for medium volumes |
Economical only at high volumes |
Clock Management and Timing
The XC2S200-6FGG740C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:
- Clock frequency synthesis and multiplication
- Clock deskewing for synchronous designs
- Precise phase shifting capabilities
- Jitter reduction for high-speed interfaces
Quality and Reliability Standards
| Reliability Feature |
Description |
| Manufacturing Process |
Advanced 0.18µm CMOS technology |
| Quality Assurance |
Full production testing and validation |
| ESD Protection |
Robust protection on all I/O pins |
| Package Options |
Standard and lead-free (RoHS compliant) variants |
| Long-Term Availability |
Xilinx commitment to product longevity |
Why Choose XC2S200-6FGG740C for Your Design?
The XC2S200-6FGG740C delivers an exceptional balance of performance, capacity, and cost-effectiveness. Its 200,000 system gates provide ample resources for complex designs, while the 740-ball BGA package maximizes I/O availability for high-pin-count applications.
Competitive Advantages
- Proven Architecture: Spartan-II family heritage ensures reliable, field-tested technology
- Comprehensive I/O: 284 user I/O pins accommodate complex interfacing requirements
- Flexible Memory: Dual RAM architecture optimizes both small and large data storage needs
- Speed Performance: -6 speed grade enables high-frequency operation up to 263 MHz
- Development Support: Extensive documentation and mature tool support
Integration and Implementation Guidelines
Power Supply Requirements
The XC2S200-6FGG740C requires careful power distribution design:
- VCCINT: Core logic power supply at 2.5V
- VCCO: I/O bank power supply (voltage varies by I/O standard)
- VCCAUX: Auxiliary power for DLLs and other analog circuits
- GND: Multiple ground connections for signal integrity
PCB Design Considerations
When designing with the FGG740 package, consider these factors:
- Adequate decoupling capacitors near power pins
- Controlled impedance routing for high-speed signals
- Proper thermal management through vias and ground planes
- BGA footprint accuracy for reliable solder connections
Spartan-II Family Comparison
| Device |
Logic Cells |
System Gates |
CLB Array |
User I/O |
Block RAM |
| XC2S50 |
1,728 |
50,000 |
16 x 24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 x 30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 x 36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28 x 42 |
284 |
56K |
The XC2S200-6FGG740C represents the highest capacity device in the Spartan-II family, offering maximum resources for demanding applications.
Support and Resources
Developers working with the XC2S200-6FGG740C benefit from extensive support resources including comprehensive datasheets, application notes, reference designs, and active user communities. Technical documentation covers all aspects from initial design through production implementation.
For additional information about Xilinx FPGA solutions and design resources, comprehensive guides are available to help optimize your development process.
Conclusion: XC2S200-6FGG740C for Modern FPGA Designs
The XC2S200-6FGG740C combines robust performance, extensive I/O capabilities, and cost-effective pricing to deliver exceptional value for FPGA-based designs. Whether developing telecommunications infrastructure, industrial control systems, or advanced signal processing applications, this device provides the resources and reliability required for successful implementation.
Its 740-ball fine-pitch BGA package, 200,000 system gates, and comprehensive memory architecture position the XC2S200-6FGG740C as an excellent choice for designs requiring maximum Spartan-II family resources in a high-density package configuration.
