The XC2S200-6FGG737C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, designed to deliver exceptional performance and flexibility for demanding digital design applications. This 200,000 system gate FPGA offers engineers a cost-effective programmable logic solution with 5,292 logic cells, 56K bits of block RAM, and 737-pin BGA packaging—making it ideal for telecommunications, industrial automation, and embedded systems where reliability and performance are critical.
XC2S200-6FGG737C Key Features and Benefits
The XC2S200-6FGG737C combines high-density programmable logic with robust I/O capabilities, providing design engineers with the resources needed for complex digital implementations. As a Xilinx FPGA, this device leverages proven architecture that has been deployed in millions of applications worldwide.
Superior Alternative to Mask-Programmed ASICs
Unlike traditional ASICs, the XC2S200-6FGG737C eliminates initial NRE costs, reduces development cycles, and removes the inherent risks of conventional ASIC design. Field programmability enables design upgrades without hardware replacement—a capability impossible with mask-programmed devices.
Advanced Architectural Design
The Spartan-II architecture incorporates:
- Configurable Logic Blocks (CLBs): Arranged in a 28 × 42 array for maximum flexibility
- Input/Output Blocks (IOBs): Supporting 16 selectable I/O standards
- Delay-Locked Loops (DLLs): Four DLLs positioned at each die corner for precise clock management
- Block RAM: Two columns of dedicated memory on opposite sides of the die
- Boundary Scan Support: IEEE 1149.1 JTAG compliant for simplified testing
XC2S200-6FGG737C Technical Specifications
Core Logic Specifications
| Parameter |
Value |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array (Rows × Columns) |
28 × 42 |
| Total CLBs |
1,176 |
| Equivalent Macrocells |
4,704 |
Memory Resources
| Memory Type |
Capacity |
| Total Distributed RAM |
75,264 bits |
| Total Block RAM |
56 Kbits |
| Block RAM Modules |
14 × 4,096-bit blocks |
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Process Technology |
0.18μm CMOS |
| Maximum System Frequency |
Up to 200 MHz |
XC2S200-6FGG737C Package Information
Understanding the Part Number
The XC2S200-6FGG737C part number follows a standardized naming convention:
| Code Segment |
Meaning |
| XC2S200 |
Spartan-II device with 200,000 system gates |
| -6 |
Speed grade -6 (fastest commercial grade) |
| FGG |
Fine-pitch Ball Grid Array, Pb-free packaging |
| 737 |
737-ball package configuration |
| C |
Commercial temperature range (0°C to +85°C) |
Package Specifications
| Specification |
Detail |
| Package Type |
Fine-pitch BGA (FBGA) |
| Total Balls |
737 |
| Pb-Free Compliance |
Yes (RoHS compliant) |
| Temperature Grade |
Commercial (0°C to +85°C) |
I/O Capabilities of the XC2S200-6FGG737C FPGA
Supported I/O Standards
The XC2S200-6FGG737C supports 16 different I/O standards for maximum design flexibility:
| Standard Type |
Supported Standards |
| Single-Ended CMOS |
LVTTL, LVCMOS33, LVCMOS25, LVCMOS18, LVCMOS15 |
| Single-Ended TTL |
PCI33, PCI66, GTL, GTL+ |
| Differential |
LVDS, BLVDS, LVPECL, ULVDS |
| Memory Interface |
SSTL3 Class I/II, SSTL2 Class I/II, HSTL Class I/II/III/IV |
I/O Pin Configuration
| Parameter |
Value |
| Maximum User I/O |
284 |
| Global Clock/User Input Pins |
4 |
| Dedicated Clock Inputs |
4 |
Clock Management in the XC2S200-6FGG737C
Delay-Locked Loop (DLL) Features
The four integrated DLLs provide advanced clock management capabilities:
- Clock Multiplication: 1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, and 16× options
- Clock Division: 1.5, 2, 2.5, 3, 4, 5, 8, and 16 divide ratios
- Duty Cycle Correction: Maintains 50% duty cycle
- Clock Phase Shifting: 90°, 180°, and 270° phase options
- Low Jitter Performance: Excellent signal integrity
XC2S200-6FGG737C Application Areas
Industrial Automation
The XC2S200-6FGG737C excels in industrial control systems requiring:
- Real-time signal processing
- Motor control implementations
- Programmable logic controller (PLC) replacements
- Machine vision preprocessing
Telecommunications Equipment
Ideal for telecom applications including:
- Protocol bridging and conversion
- Data serialization/deserialization
- Network interface implementations
- Clock recovery circuits
Embedded Systems
The device supports embedded applications such as:
- Custom peripheral controllers
- State machine implementations
- Interface adapters
- Co-processor functions
Consumer Electronics
Suitable for consumer products requiring:
- Video processing pipelines
- Display controllers
- Audio signal processing
- Smart device interfaces
Design Resources for XC2S200-6FGG737C Development
Software Development Tools
| Tool |
Purpose |
| ISE Design Suite |
Complete front-to-back FPGA design solution |
| ISE WebPACK |
Free, downloadable design entry and synthesis |
| ChipScope Pro |
On-chip debugging and analysis |
| IP Core Generator |
Parameterizable IP core creation |
Development Support
Engineers working with the XC2S200-6FGG737C benefit from:
- Comprehensive documentation and user guides
- Application notes for common design challenges
- Reference designs and example projects
- Technical support from authorized distributors
- Community forums and knowledge bases
Speed Grade Comparison: XC2S200 FPGA Family
| Speed Grade |
Temperature Range |
Performance Level |
| -6 |
Commercial only |
Highest performance |
| -5 |
Commercial & Industrial |
Standard performance |
The -6 speed grade in the XC2S200-6FGG737C delivers the fastest timing specifications within the Spartan-II 200K family, exclusively available for commercial temperature applications.
XC2S200-6FGG737C Ordering and Availability
Procurement Considerations
When ordering the XC2S200-6FGG737C, consider:
- Lead Time: Verify current stock levels with authorized distributors
- Volume Pricing: Quantity discounts available for production orders
- Alternative Packages: Evaluate 256-ball and 456-ball variants for your design requirements
- End-of-Life Planning: Check product lifecycle status for long-term projects
Quality Assurance
The XC2S200-6FGG737C meets stringent quality standards:
- ISO 9001 certified manufacturing
- RoHS compliant materials
- MSL (Moisture Sensitivity Level) rated packaging
- Comprehensive testing and qualification
Why Choose the XC2S200-6FGG737C for Your Next Design?
Cost-Effective Programmable Logic
The Spartan-II family delivers an exceptional balance of features and value. The XC2S200-6FGG737C provides:
- Lower Total Cost of Ownership: No NRE charges or minimum order quantities
- Reduced Time-to-Market: Rapid prototyping and design iteration
- Design Security: Bitstream encryption prevents unauthorized copying
- Long-Term Availability: Extended product lifecycle support
Proven Reliability
Millions of Spartan-II devices have been deployed successfully in demanding applications worldwide, establishing a track record of dependable operation in harsh environments and mission-critical systems.
Conclusion: XC2S200-6FGG737C FPGA Summary
The XC2S200-6FGG737C represents an excellent choice for engineers seeking a high-performance, cost-effective FPGA solution. With 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and support for 16 I/O standards, this Spartan-II device provides the flexibility and capability needed for complex digital designs across industrial, telecommunications, embedded, and consumer applications.
The combination of fastest-available speed grade (-6), Pb-free 737-ball BGA packaging, and commercial temperature support makes the XC2S200-6FGG737C an ideal component for production designs requiring both performance and environmental compliance.
