The XC2S200-6FGG735C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family. This device delivers 200,000 system gates, 5,292 logic cells, and exceptional performance at 263MHz, making it an ideal choice for cost-sensitive applications requiring robust programmable logic capabilities. The XC2S200-6FGG735C utilizes a 735-ball fine-pitch BGA (FGG735) package with Pb-free (lead-free) construction, offering expanded I/O connectivity and superior thermal performance for demanding embedded systems.

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XC2S200-6FGG735C Key Features and Benefits

Superior Logic Capacity and Performance

The XC2S200-6FGG735C provides engineers with substantial programmable resources for complex digital designs. Built on Xilinx’s proven 0.18µm six-layer metal CMOS process technology, this device operates at a core voltage of 2.5V while supporting multiple I/O voltage standards. The -6 speed grade designation indicates the fastest timing specification available in the commercial temperature range, ensuring optimal system performance up to 200MHz.

Advanced CLB Architecture

The Configurable Logic Block (CLB) architecture of the XC2S200-6FGG735C consists of a 28×42 array totaling 1,176 CLBs. Each CLB contains four logic cells, providing exceptional flexibility for implementing complex combinational and sequential logic functions.

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XC2S200-6FGG735C Technical Specifications

Core Specifications Table

Electrical Characteristics

Package Information

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XC2S200-6FGG735C Memory Resources

Block RAM Configuration

The XC2S200-6FGG735C incorporates 14 dedicated Block SelectRAM+ memory modules, each providing 4,096 bits of synchronous dual-port RAM. These block RAM resources support various configurations for maximum design flexibility.

Distributed RAM Capabilities

Each logic cell within the XC2S200-6FGG735C can be configured as 16×1-bit synchronous RAM, enabling designers to implement small, fast memory structures directly within the CLB fabric.

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XC2S200-6FGG735C I/O Standards Support

The XC2S200-6FGG735C supports a comprehensive range of single-ended and differential I/O standards, ensuring seamless integration with various system interfaces.

Supported I/O Standards

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XC2S200-6FGG735C Part Number Decoder

Understanding the part number structure helps ensure correct device selection:

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XC2S200-6FGG735C Applications

Industrial and Embedded Systems

The XC2S200-6FGG735C excels in numerous application domains where cost-effective programmable logic is essential:

• Telecommunications Equipment – Protocol converters, multiplexers, and interface bridges
• Industrial Automation – Motor control, process monitoring, and PLC implementations
• Consumer Electronics – Display controllers, audio/video processing, and gaming systems
• Automotive Systems – Dashboard displays, sensor interfaces, and control modules
• Medical Devices – Signal processing, patient monitoring, and diagnostic equipment
• Test and Measurement – Data acquisition, pattern generation, and instrument control

Design Advantages Over ASICs

The XC2S200-6FGG735C offers significant benefits compared to traditional mask-programmed ASICs:

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XC2S200-6FGG735C Clock Management

Delay-Locked Loop (DLL) Features

The XC2S200-6FGG735C includes four dedicated DLLs positioned at each corner of the die, providing sophisticated clock management capabilities:

• Clock Deskew – Eliminates clock distribution delays
• Frequency Synthesis – Generates clock frequencies at 1.5×, 2×, 2.5×, 3×, 4×, 5×, and 8× input frequency
• Clock Division – Creates 1/2, 1/3, 1/4, 1/5, 1/8, and 1/16 frequency outputs
• Phase Shifting – Enables precise phase adjustments for timing optimization
• Duty Cycle Correction – Maintains 50% duty cycle for improved signal integrity

Global Clock Network

Four low-skew global clock networks distribute clock signals efficiently across the entire device, supporting synchronous designs at maximum operating frequencies.

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XC2S200-6FGG735C Development Tools

Design Software Compatibility

The XC2S200-6FGG735C is supported by Xilinx ISE Design Suite, providing a comprehensive development environment:

• HDL Synthesis – VHDL and Verilog support
• Schematic Capture – Graphical design entry
• Simulation – Behavioral and timing simulation
• Implementation – Mapping, placing, and routing
• Configuration – Bitstream generation and programming

Configuration Options

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Why Choose XC2S200-6FGG735C for Your Next Project

The XC2S200-6FGG735C represents an excellent balance of performance, I/O capability, and cost-effectiveness for FPGA-based designs. With 200,000 system gates, extensive memory resources, and flexible I/O standards support, this device handles complex digital implementations while maintaining budget-conscious development.

The 735-ball FGG package provides expanded connectivity options compared to smaller package variants, making the XC2S200-6FGG735C particularly suitable for applications requiring numerous external interfaces. The Pb-free construction ensures RoHS compliance and environmental responsibility.

For engineers seeking reliable Xilinx FPGA solutions with proven silicon and mature design tools, the XC2S200-6FGG735C delivers exceptional value in the Spartan-II product lineup.

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XC2S200-6FGG735C Ordering Information

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Related Spartan-II FPGA Resources

Documentation and Support

• Spartan-II FPGA Family Data Sheet (DS001)
• Spartan-II FPGA User Guide
• ISE Design Suite Documentation
• Application Notes and Reference Designs

Technical Support

Engineers working with the XC2S200-6FGG735C can access comprehensive technical resources including datasheets, pinout diagrams, development board information, and application notes through authorized distributors and the AMD/Xilinx documentation portal.