The XC2S200-6FGG733C is a premium field-programmable gate array from the renowned Xilinx FPGA Spartan-II family. Engineered for high-volume, cost-sensitive applications, this 200,000 system gate FPGA delivers exceptional performance up to 200 MHz while offering extensive I/O flexibility in a robust 733-ball fine-pitch BGA package. The XC2S200-6FGG733C combines powerful logic resources with advanced clock management features, making it an ideal choice for telecommunications, industrial automation, and embedded system designs.
XC2S200-6FGG733C Key Features and Benefits
The XC2S200-6FGG733C represents the highest density member of the Spartan-II FPGA family, offering designers a cost-effective alternative to mask-programmed ASICs. This programmable logic device eliminates the high initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC development.
Core Logic Architecture
The XC2S200-6FGG733C features a sophisticated configurable logic block (CLB) architecture arranged in a 28×42 array. Each CLB contains look-up tables (LUTs), flip-flops, and dedicated arithmetic logic for implementing complex digital designs.
On-Chip Memory Resources
This FPGA provides dual memory architectures for maximum design flexibility, with 56K bits of dedicated block RAM organized in columns along the device edges and 75,264 bits of distributed RAM integrated within the CLB structure.
Clock Management System
The XC2S200-6FGG733C incorporates four fully digital Delay-Locked Loops positioned at each corner of the die. These DLLs provide zero propagation delay, low clock skew, clock multiplication and division capabilities, and board-level clock deskewing for multi-chip synchronization.
XC2S200-6FGG733C Technical Specifications
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG733C |
| Family |
Spartan-II FPGA |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Maximum Frequency |
200 MHz |
| Speed Grade |
-6 (Fastest) |
XC2S200-6FGG733C Memory Specifications
| Memory Type |
Capacity |
Description |
| Block RAM |
56K bits |
Dedicated synchronous dual-port RAM |
| Distributed RAM |
75,264 bits |
LUT-based configurable memory |
| Total RAM |
131K+ bits |
Combined memory resources |
XC2S200-6FGG733C Package Information
| Specification |
Value |
| Package Type |
FGG733 (Fine-pitch Ball Grid Array) |
| Pin Count |
733 balls |
| Pb-Free |
Yes (indicated by “G” designation) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliant |
Yes |
XC2S200-6FGG733C Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Process Technology |
0.18μm |
| Supported I/O Standards |
16 standards |
Supported I/O Standards for XC2S200-6FGG733C
The XC2S200-6FGG733C supports 16 high-performance interface standards including LVTTL, LVCMOS (3.3V, 2.5V, 1.8V), PCI (3.3V, 5V compatible), GTL, GTL+, HSTL Class I/II/III/IV, SSTL2 Class I/II, SSTL3 Class I/II, CTT, and AGP-2X.
XC2S200-6FGG733C Part Number Breakdown
| Code |
Meaning |
| XC2S |
Xilinx Spartan-II family designator |
| 200 |
200,000 system gates |
| -6 |
Speed grade (-6 is fastest available) |
| FG |
Fine-pitch BGA package |
| G |
Pb-free (lead-free) packaging option |
| 733 |
733-ball package |
| C |
Commercial temperature range |
XC2S200-6FGG733C Applications
The XC2S200-6FGG733C is ideally suited for a wide range of demanding applications across multiple industries.
Industrial Applications
The XC2S200-6FGG733C excels in programmable logic controllers (PLCs), motor control systems, industrial networking equipment, factory automation systems, and sensor interface modules.
Telecommunications
This FPGA is commonly deployed in network switching and routing, protocol conversion, DSP co-processing, baseband processing, and interface bridging applications.
Consumer Electronics
Design engineers choose the XC2S200-6FGG733C for set-top boxes, video processing systems, audio processing units, and gaming peripherals.
Automotive and Aerospace
The commercial temperature range makes the XC2S200-6FGG733C suitable for vehicle infotainment systems, driver assistance systems, and avionics display controllers.
XC2S200-6FGG733C Design Advantages
Rapid Prototyping Capability
Unlike mask-programmed ASICs, the XC2S200-6FGG733C enables rapid prototyping and iterative design refinement. Designers can program, test, and modify their designs without manufacturing delays or expensive mask revisions.
Field Upgradeability
The XC2S200-6FGG733C offers in-system programmability, allowing design upgrades and bug fixes in deployed products without hardware replacement—a capability impossible with traditional ASICs.
Fast Interconnect Architecture
The XC2S200-6FGG733C features fast, predictable interconnect routing that ensures successive design iterations continue meeting timing requirements. This routing hierarchy provides consistent performance across design revisions.
Comprehensive Configuration Options
The XC2S200-6FGG733C supports multiple configuration modes including master serial mode with internal oscillator, slave serial mode for daisy-chaining, and slave parallel mode for high-speed byte-wide configuration.
XC2S200-6FGG733C Development Resources
Design Software
The XC2S200-6FGG733C is supported by Xilinx ISE Design Suite, providing complete synthesis, implementation, and verification tools. The development environment supports hierarchical design entry and automatic tool combination.
Technical Documentation
Comprehensive documentation for the XC2S200-6FGG733C includes the Spartan-II FPGA Family Data Sheet (DS001), application notes, and user guides covering PCB layout recommendations, power supply design, and configuration procedures.
Configuration Devices
Compatible configuration PROMs and flash memory devices enable standalone operation of the XC2S200-6FGG733C without external processors. Various configuration interface options support different system architectures.
XC2S200-6FGG733C vs Alternative Packages
| Part Number |
Package |
Pins |
User I/O |
Best For |
| XC2S200-6FGG733C |
FGG733 |
733 |
284 |
Maximum I/O, high-density PCB |
| XC2S200-6FG456C |
FG456 |
456 |
284 |
Standard BGA applications |
| XC2S200-6PQ208C |
PQ208 |
208 |
140 |
Lower I/O count designs |
The XC2S200-6FGG733C offers the maximum pin count in the Spartan-II XC2S200 series, providing designers with the greatest flexibility for complex interface requirements.
XC2S200-6FGG733C PCB Design Considerations
Power Supply Requirements
The XC2S200-6FGG733C requires a stable 2.5V core supply (VCCINT) and configurable I/O bank voltages (VCCO) based on the selected I/O standards. Proper decoupling capacitors near power pins are essential for reliable operation.
Thermal Management
The 733-ball FGG package provides excellent thermal dissipation through the ball grid array. However, designers should ensure adequate airflow and consider thermal vias for high-utilization designs.
Signal Integrity
The XC2S200-6FGG733C supports multiple I/O standards with programmable drive strengths. Proper termination and routing practices ensure optimal signal integrity for high-speed interfaces.
XC2S200-6FGG733C Ordering Information
When ordering the XC2S200-6FGG733C, verify the complete part number matches your requirements. The “G” designation indicates Pb-free packaging for RoHS compliance, and “C” indicates commercial temperature operation (0°C to +85°C).
Related Spartan-II FPGA Products
The Spartan-II family includes six devices ranging from 15,000 to 200,000 system gates. The XC2S200-6FGG733C represents the largest and most capable member of this cost-optimized FPGA family.
Why Choose XC2S200-6FGG733C for Your Design?
The XC2S200-6FGG733C delivers an exceptional balance of performance, logic density, and cost-effectiveness. With 200,000 system gates, 284 user I/Os, comprehensive memory resources, and advanced clock management through four DLLs, this FPGA provides the foundation for sophisticated digital designs. The -6 speed grade ensures maximum performance, while the Pb-free FGG733 package meets modern environmental compliance requirements.
For engineers seeking a proven, reliable FPGA solution with extensive logic resources and flexible I/O capabilities, the XC2S200-6FGG733C stands as an excellent choice for both new designs and legacy system maintenance.
