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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG732C: High-Performance Xilinx Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG732C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family, engineered to deliver exceptional performance, flexibility, and reliability for demanding digital design applications. This high-density programmable logic device combines 200,000 system gates with advanced I/O capabilities, making it an ideal solution for telecommunications, industrial automation, consumer electronics, and embedded system designs.


XC2S200-6FGG732C Key Features and Benefits

The XC2S200-6FGG732C represents the pinnacle of the Spartan-II FPGA architecture, offering engineers a cost-effective alternative to traditional mask-programmed ASICs. This device eliminates the high initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC implementations while providing the flexibility for in-field design upgrades without hardware replacement.

Advanced Programmable Logic Architecture

The XC2S200-6FGG732C features a regular, flexible, and fully programmable architecture built around Configurable Logic Blocks (CLBs) surrounded by a perimeter of programmable Input/Output Blocks (IOBs). This architecture enables rapid prototyping and seamless transition from design to production, significantly reducing time-to-market for complex digital systems.

High-Performance Clock Management

Four integrated Delay-Locked Loops (DLLs), positioned at each corner of the die, provide precise clock management capabilities. These DLLs enable clock deskewing across multiple devices at the board level, ensuring synchronized operation in complex multi-FPGA systems. The clock mirror functionality allows designers to maintain signal integrity across distributed architectures.


XC2S200-6FGG732C Technical Specifications

Parameter Specification
Device Family Xilinx Spartan-II
Part Number XC2S200-6FGG732C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Delay-Locked Loops (DLLs) 4
Speed Grade -6 (Fastest)
Process Technology 0.18 µm
Core Voltage 2.5V
Operating Frequency Up to 263 MHz
Package Type Fine-Pitch BGA (Lead-Free)
Temperature Range Commercial (0°C to +85°C)
Configuration File Size 1,335,840 bits
RoHS Compliance Lead-Free (Pb-Free)

XC2S200-6FGG732C Architecture Overview

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG732C incorporates 1,176 Configurable Logic Blocks arranged in a 28 × 42 array, providing substantial logic density for complex digital implementations. Each CLB contains multiple slices with look-up tables (LUTs), flip-flops, and dedicated carry logic, enabling efficient implementation of combinational and sequential circuits.

The CLB architecture supports both synchronous and asynchronous design methodologies, with dedicated resources for arithmetic operations, multiplexers, and shift registers. This flexibility allows designers to optimize resource utilization based on specific application requirements.

Input/Output Block (IOB) Capabilities

The programmable IOBs in the XC2S200-6FGG732C support a wide range of input/output signaling standards, including:

  • LVTTL (Low-Voltage TTL)
  • LVCMOS (Low-Voltage CMOS)
  • PCI (Peripheral Component Interconnect)
  • GTL/GTL+ (Gunning Transceiver Logic)
  • SSTL (Stub Series Terminated Logic)
  • HSTL (High-Speed Transceiver Logic)

Each IOB contains three registers that can function as D-type edge-triggered flip-flops or level-sensitive latches. Independent Clock Enable (CE) signals for each register provide fine-grained control over I/O timing, essential for high-speed interface implementations.

Dual-Port Block RAM Memory

The XC2S200-6FGG732C features 56 Kbits of dedicated Block RAM organized in dual-ported memory cells. Each 4,096-bit RAM block provides fully synchronous operation with independent control signals for each port. The configurable data widths support various memory configurations, including:

  • 4K × 1
  • 2K × 2
  • 1K × 4
  • 512 × 8
  • 256 × 16

This built-in memory capability eliminates the need for external RAM in many applications, reducing component count, board space, and system cost.

Distributed RAM Resources

In addition to Block RAM, the XC2S200-6FGG732C provides 75,264 bits of distributed RAM implemented within the CLB structure. This distributed memory offers lower latency access compared to Block RAM, making it ideal for small lookup tables, register files, and FIFO buffers requiring single-cycle access times.


XC2S200-6FGG732C Speed Grade and Performance

The “-6” speed grade designation indicates the fastest performance tier available for the Spartan-II family. This speed grade delivers optimal timing characteristics for applications requiring maximum operating frequencies and minimal propagation delays.

Performance Highlights

  • Maximum Internal Clock Frequency: 263 MHz
  • Optimized Routing Architecture: VersaRing technology facilitates efficient pin-swapping and pin-locking
  • Low-Latency I/O: Dedicated routing resources minimize input-to-output delays
  • DLL-Based Clock Management: Sub-nanosecond clock skew correction

The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C), making the XC2S200-6FGG732C suitable for controlled operating environments in industrial, telecommunications, and consumer applications.


XC2S200-6FGG732C Package Information

Fine-Pitch BGA (FGG) Package

The XC2S200-6FGG732C utilizes a Fine-Pitch Ball Grid Array (BGA) package with lead-free (Pb-free) solder balls, indicated by the “G” designation in the part number. This package type offers several advantages:

  • Superior Thermal Performance: Enhanced heat dissipation through the BGA substrate
  • Excellent Signal Integrity: Shorter interconnect lengths reduce inductance and improve high-frequency performance
  • High Pin Density: Compact footprint maximizes I/O availability in space-constrained designs
  • RoHS Compliance: Lead-free construction meets environmental regulations

Environmental Compliance

The “C” suffix indicates Commercial temperature grade operation, suitable for applications where ambient temperatures remain within the 0°C to +85°C range. For extended temperature requirements, industrial-grade variants are available in the Xilinx FPGA product portfolio.


XC2S200-6FGG732C Configuration Options

The XC2S200-6FGG732C supports multiple configuration modes to accommodate various system architectures:

Master Serial Mode

In Master Serial mode, the FPGA generates the configuration clock (CCLK) and reads configuration data from an external serial PROM. This mode is ideal for standalone applications where the FPGA must boot independently.

Slave Parallel Mode

Slave Parallel mode accepts 8-bit parallel configuration data from an external controller, enabling faster configuration times and integration with microprocessor-based systems.

Boundary-Scan (JTAG) Mode

IEEE 1149.1 boundary-scan support enables configuration through the JTAG port, facilitating in-system programming, debugging, and production testing without additional hardware.

Slave Serial Mode

Slave Serial mode allows configuration through a single data pin with an externally supplied clock, supporting daisy-chain configuration of multiple FPGAs.


XC2S200-6FGG732C Application Areas

The versatility and performance of the XC2S200-6FGG732C make it suitable for diverse applications across multiple industries:

Telecommunications

  • Digital signal processing for wireless base stations
  • Protocol conversion and bridging
  • Network interface controllers
  • Voice over IP (VoIP) processing

Industrial Automation

  • Programmable logic controllers (PLCs)
  • Motor control and drive systems
  • Machine vision processing
  • Sensor interface and data acquisition

Consumer Electronics

  • Video processing and scaling
  • Audio codec implementations
  • Display controllers
  • Gaming and multimedia systems

Embedded Systems

  • Microcontroller peripheral expansion
  • Custom co-processors
  • Interface bridging
  • System-on-chip (SoC) prototyping

XC2S200-6FGG732C Development Tools and Resources

Xilinx ISE Design Suite

The XC2S200-6FGG732C is fully supported by the Xilinx ISE Design Suite, providing comprehensive tools for:

  • Schematic capture and HDL-based design entry
  • Logic synthesis and optimization
  • Place-and-route implementation
  • Timing analysis and simulation
  • Bitstream generation and device programming

Hardware Description Language Support

The device supports industry-standard hardware description languages including:

  • VHDL: IEEE 1076 compliant
  • Verilog HDL: IEEE 1364 compliant
  • Mixed-language designs: Combining VHDL and Verilog modules

IP Core Availability

Extensive libraries of pre-verified intellectual property (IP) cores accelerate design development, including:

  • Arithmetic functions (multipliers, dividers, DSP blocks)
  • Memory controllers (SDRAM, DDR, Flash)
  • Communication interfaces (UART, SPI, I2C, Ethernet)
  • Bus interfaces (PCI, Wishbone, AMBA)

XC2S200-6FGG732C Ordering Information

Part Number Breakdown

Code Meaning
XC2S Spartan-II Family Identifier
200 200,000 System Gates
-6 Speed Grade (Fastest)
FG Fine-Pitch BGA Package
G Lead-Free (Pb-Free)
732 Pin Count
C Commercial Temperature Range

Quality and Reliability

The XC2S200-6FGG732C undergoes rigorous quality assurance testing to ensure reliable operation throughout its specified lifetime. Key reliability features include:

  • Electrostatic discharge (ESD) protection on all I/O pins
  • Latch-up immunity per JEDEC standards
  • Hot-swap compatibility with proper external circuitry
  • Extended data retention for configuration memory

Why Choose the XC2S200-6FGG732C Spartan-II FPGA?

The XC2S200-6FGG732C delivers an optimal balance of performance, capacity, and cost-effectiveness for mid-range FPGA applications. Key advantages include:

  1. Proven Technology: The Spartan-II family has a long track record of reliable operation in production systems worldwide.
  2. Cost Efficiency: Significantly lower per-unit costs compared to high-end FPGA families while maintaining robust feature sets.
  3. Design Flexibility: Field-programmable architecture enables rapid iteration and in-system updates without hardware modifications.
  4. Comprehensive Support: Extensive documentation, application notes, and development tools simplify the design process.
  5. Long-Term Availability: Established product with predictable supply chain and lifecycle management.

Conclusion

The XC2S200-6FGG732C Spartan-II FPGA represents an excellent choice for engineers requiring high-performance programmable logic in a cost-effective package. With 200,000 system gates, 5,292 logic cells, 56 Kbits of block RAM, and support for multiple I/O standards, this device addresses a wide spectrum of digital design challenges. The -6 speed grade ensures maximum performance, while the lead-free BGA package meets modern environmental standards.

Whether implementing complex telecommunications protocols, industrial control systems, or consumer electronics applications, the XC2S200-6FGG732C provides the flexibility, reliability, and performance necessary for successful product development. Contact your authorized distributor for pricing, availability, and technical support for your next FPGA-based design project.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.